PLCC-2 Yellow LED Datasheet - Package 2.0x1.25x0.8mm - Voltage 2.0V - Power 40mW - English Technical Document

1. Product Overview

This document details the specifications for a high-brightness, surface-mount yellow LED in a PLCC-2 (Plastic Leaded Chip Carrier) package. Designed primarily for the automotive industry, this component offers reliable performance in demanding environments. Its key positioning is within automotive interior lighting systems, including instrument clusters and general cabin illumination, where consistent color output and long-term reliability are paramount.

The core advantages of this LED include its compact form factor, high luminous intensity for its package size, and a wide 120-degree viewing angle ensuring good visibility. It is built to meet stringent automotive-grade standards, including AEC-Q102 qualification for discrete optoelectronic devices and specific corrosion robustness requirements. Furthermore, it complies with major environmental regulations such as RoHS, REACH, and halogen-free standards, making it suitable for modern, eco-conscious designs.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

The primary photometric characteristic is the luminous intensity, with a typical value of 900 millicandelas (mcd) when driven at a forward current (I_F) of 20mA. The specified range is from a minimum of 560 mcd to a maximum of 1400 mcd, indicating potential variation between production lots, which is managed through the binning system described later. The dominant wavelength, which defines the perceived yellow color, is typically 592 nanometers (nm), with a range from 585 nm to 594 nm. The wide viewing angle of 120 degrees (with a tolerance of ±5°) provides a broad emission pattern suitable for backlighting and indicator applications.

Electrically, the device exhibits a typical forward voltage (V_F) of 2.0 volts at 20mA, ranging from 1.75V to 2.75V. The absolute maximum continuous forward current is 50 mA. The thermal resistance, a critical parameter for managing heat dissipation, is specified from the junction to the solder point. Two values are given: a \"real\" thermal resistance (R_{th JS real}) of 160 K/W and an \"electrical\" thermal resistance (R_{th JS el}) of 125 K/W. The electrical method is typically derived from a change in forward voltage and is often used for in-situ estimation, while the real value is more representative of the actual thermal path.

2.2 Absolute Maximum Ratings and Thermal Limits

Adherence to Absolute Maximum Ratings is essential for device longevity. The maximum power dissipation is 137 mW. The junction temperature (T_J) must not exceed 125°C. The device is rated for operation and storage within a temperature range of -40°C to +110°C, confirming its suitability for automotive environments. It can withstand a surge current (I_FM) of 100 mA for very short pulses (≤10 μs) at a low duty cycle. The Electrostatic Discharge (ESD) sensitivity is 2 kV (Human Body Model), which is a standard level requiring basic handling precautions. The soldering temperature profile allows for reflow soldering with a peak temperature of 260°C for up to 30 seconds.

3. Binning System Explanation

To ensure consistency in production runs, LEDs are sorted into performance bins. This allows designers to select components that meet specific thresholds for key parameters.

3.1 Luminous Intensity Binning

The luminous intensity is binned using an alphanumeric code system spanning from L1 (11.2-14 mcd) up to GA (18000-22400 mcd). For this specific part number (65-21-UY0200H-AM), the possible output bins are highlighted in the datasheet and center around the V1 (710-900 mcd) and V2 (900-1120 mcd) groups, aligning with the typical 900 mcd specification. A measurement tolerance of ±8% applies.

3.2 Dominant Wavelength Binning

The dominant wavelength, determining the yellow hue, is also binned. The bins are defined by three-digit codes representing the minimum wavelength in nanometers. For this yellow LED, the relevant bins are in the 585-600 nm range, specifically covering codes like 8588 (585-588 nm), 8891 (588-591 nm), 9194 (591-594 nm), and 9497 (594-597 nm). The typical value of 592 nm falls within the 9194 bin. A tight tolerance of ±1 nm is specified.

3.3 Forward Voltage Binning

The forward voltage is binned into three groups: 1012 (1.00-1.25V), 1215 (1.25-1.50V), and 1517 (1.50-1.75V). The typical V_F of 2.0V for this device is notably higher than the maximum of these bins, suggesting that for this specific product, the voltage binning table might represent a standard company grid, and the actual V_F characteristic is defined by the min/typ/max values in the characteristics table.

4. Performance Curve Analysis

The datasheet provides several graphs depicting the LED's behavior under different conditions.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve shows the exponential relationship typical of a diode. As forward current increases from 0 to 60 mA, the forward voltage rises from approximately 1.75V to 2.2V. This curve is crucial for designing the current-limiting circuitry to ensure stable operation.

4.2 Optical Characteristics vs. Current and Temperature

The Relative Luminous Intensity vs. Forward Current graph shows that light output increases super-linearly with current before tending to saturate at higher currents, emphasizing the importance of operating within the recommended range for efficiency. The Relative Luminous Intensity vs. Junction Temperature graph demonstrates thermal quenching: as the junction temperature rises from -40°C to 140°C, the light output decreases significantly, dropping to about 60% of its 25°C value at 125°C. This underscores the need for effective thermal management in the application.

The Dominant Wavelength vs. Forward Current shows a slight decrease in wavelength (a \"blue-shift\") as current increases, while the Relative Wavelength Shift vs. Junction Temperature graph shows a clear \"red-shift\" (increase in wavelength) as temperature rises. These shifts are important for color-critical applications.

4.3 Derating and Pulse Handling

The Forward Current Derating Curve is vital for reliability. It shows the maximum allowable continuous forward current as a function of the solder pad temperature. For example, at a pad temperature of 110°C, the maximum current is only 35 mA, down from 50 mA at lower temperatures. The Permissible Pulse Handling Capability chart defines the allowable peak pulse current for various pulse widths and duty cycles, useful for multiplexing or blinking applications.

5. Mechanical and Package Information

The LED uses a standard PLCC-2 surface-mount package. The mechanical drawing would typically show a package body size of approximately 2.0mm in length, 1.25mm in width, and 0.8mm in height (these are common PLCC-2 dimensions; the exact values should be taken from the \"Mechanical Dimension\" section). The device has two terminals. Polarity is indicated by a marker on the package, typically a notch or a chamfered corner on the cathode side. A recommended solder pad layout is provided to ensure a reliable solder joint and proper thermal connection to the PCB.

6. Soldering and Assembly Guidelines

The component is suitable for reflow soldering processes common in surface-mount assembly. A specific reflow soldering profile is recommended, with a peak temperature not exceeding 260°C for 30 seconds. This profile must be followed to prevent damage to the plastic package or the internal die and wire bonds. General precautions include avoiding mechanical stress on the package, using proper ESD controls during handling, and ensuring the PCB and solder paste are clean to prevent corrosion or sulfur-induced degradation, for which separate test criteria are mentioned.

7. Packaging and Ordering Information

The LEDs are supplied in tape-and-reel packaging compatible with automated pick-and-place machines. The packaging information section details the reel dimensions, tape width, pocket spacing, and orientation of components within the tape. The part number 65-21-UY0200H-AM follows a specific coding system likely indicating package type, color, brightness bin, wavelength bin, and other attributes. Ordering information would specify the minimum order quantity, packaging type (e.g., reel size), and potentially options for specific bin combinations.

8. Application Recommendations

8.1 Typical Application Scenarios

The primary application is automotive interior lighting. This includes backlighting for instrument clusters, warning indicators, infotainment system buttons, and general cabin ambient lighting. Its AEC-Q102 qualification and wide temperature range make it directly suitable for these harsh environments.

8.2 Design Considerations

Current Drive: A constant-current driver is strongly recommended over a constant-voltage source with a series resistor for better stability and longevity, especially considering the V_F variation and temperature dependence. The operating current should be chosen based on the required brightness and thermal derating. 20mA is the typical test condition.

Thermal Management: The thermal resistance from junction to solder point is significant. To maintain performance and reliability, the PCB layout must provide an adequate thermal pad connected to copper pours or planes to dissipate heat. Keeping the solder pad temperature low is key to maximizing light output and lifespan.

Optical Design: The 120-degree viewing angle is suitable for wide-area illumination. For more focused light, secondary optics (lenses) may be required. The slight wavelength shift with current and temperature should be considered if color consistency is critical across different operating conditions.

9. Technical Comparison and Differentiation

Compared to generic commercial-grade LEDs, this device's key differentiators are its automotive-grade qualifications (AEC-Q102, corrosion robustness) and extended temperature range. Within the automotive LED market, its combination of PLCC-2 package (offering a good balance of size and thermal performance), high typical brightness (900mcd), and specific yellow wavelength target it for interior indicator and backlight roles. The comprehensive binning structure allows for tighter system-level color and brightness matching compared to unbinned parts.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 50 mA continuously?
A: You can, but only if the solder pad temperature is kept sufficiently low, as defined by the derating curve. At elevated temperatures, the maximum allowable continuous current is significantly reduced. Operating at 20mA is typical for a balance of brightness and efficiency.

Q: Why does the light output decrease at high temperature?
A: This is a fundamental semiconductor physics phenomenon called \"thermal quenching.\" Increased lattice vibrations at higher temperatures promote non-radiative recombination of electron-hole pairs, reducing the efficiency of light generation.

Q: How do I interpret the two different thermal resistance values?
A: The \"real\" thermal resistance (160 K/W) is likely measured using a physical temperature sensor. The \"electrical\" value (125 K/W) is calculated using the temperature-sensitive forward voltage as a proxy for junction temperature. For design purposes, using the higher (more conservative) value is safer for estimating temperature rise.

Q: Is a current-limiting resistor sufficient for driving this LED?
A: For simple, non-critical applications with a stable supply voltage, a series resistor can be used. The value is calculated as R = (V_supply - V_F) / I_F. However, due to V_F variation and its temperature dependence, the current will not be perfectly stable. For automotive applications where reliability is key, a dedicated constant-current driver IC or circuit is preferred.

11. Practical Design and Usage Case

Case: Instrument Cluster Warning Indicator
A designer is creating a warning light for a check engine indicator. The light must be clearly visible in all ambient lighting conditions, meet automotive reliability standards, and have a consistent yellow color. This PLCC-2 yellow LED is selected. The design uses a constant-current driver set to 18mA to provide ample brightness while staying below the 20mA typical point for better longevity. The PCB layout includes a generous thermal pad connected to an internal ground plane to keep the junction temperature low. The designer specifies LEDs from the 9194 wavelength bin and V1/V2 intensity bins to ensure color and brightness consistency across all units in the production line.

12. Operating Principle Introduction

This LED is a semiconductor light source. Its core is a chip made of compound semiconductor materials (typically based on Aluminum Gallium Indium Phosphide - AlGaInP for yellow light). When a forward voltage is applied, electrons and holes are injected into the active region of the chip where they recombine. A portion of this recombination energy is released in the form of photons (light). The specific composition of the semiconductor layers determines the wavelength (color) of the emitted light. The PLCC-2 package encapsulates this chip, provides electrical connections via lead frames, and includes a molded plastic lens that shapes the light output to achieve the 120-degree viewing angle.

13. Technology Trends

The general trend in automotive lighting LEDs is towards higher efficiency (more lumens per watt), which reduces power consumption and thermal load. There is also a drive for miniaturization, enabling slimmer and more flexible designs for interior panels. Furthermore, the integration of smart features, such as embedded ICs for diagnostics or addressability, is becoming more common. For interior lighting specifically, there is growing interest in tunable white and multi-color LEDs for ambient lighting systems that can change color to suit driver mood or function. While this specific component is a monochrome yellow LED, the underlying packaging and qualification processes are foundational for these more advanced devices.