PLCC-2 Yellow LED Datasheet - Package 3.2x2.8x1.9mm - Voltage 2.0V - Power 0.04W - English Technical Document

1. Product Overview

This document details the specifications for a high-brightness, surface-mount Yellow LED in a PLCC-2 (Plastic Leaded Chip Carrier) package. The device is engineered for reliability and performance in demanding environments, featuring a compact form factor suitable for automated assembly processes. Its primary application focus is automotive interior lighting, including instrument clusters, where consistent color output and long-term stability are critical.

1.1 Core Features and Target Market

The LED's defining characteristics position it for specific industrial and consumer applications. The package type ensures compatibility with standard SMT (Surface Mount Technology) production lines. The yellow color, defined by a dominant wavelength, is achieved through specific semiconductor materials. A typical luminous intensity of 1120 millicandelas (mcd) at a standard 20mA drive current provides ample brightness for indicator and backlighting purposes. The wide 120-degree viewing angle ensures good visibility from various perspectives. Compliance with the AEC-Q101 automotive qualification standard is a key differentiator, indicating rigorous testing for temperature cycling, humidity resistance, and long-term operational stability, making it suitable for the harsh environment inside vehicles. Adherence to RoHS (Restriction of Hazardous Substances) and REACH regulations ensures environmental compliance for global markets.

2. In-Depth Technical Parameter Analysis

A thorough understanding of the electrical, optical, and thermal parameters is essential for proper circuit design and reliable operation.

2.1 Electrical and Optical Characteristics

The forward voltage (VF) has a typical value of 2.0V with a maximum of 2.75V at the standard test current of 20mA. This parameter is crucial for determining the current-limiting resistor value in a series circuit. The absolute maximum forward current is 50mA for DC operation, with a surge current rating of 100mA for very short pulses (≤10μs). The device is not designed for reverse bias operation. The luminous intensity (IV) is specified with a minimum of 710 mcd, typical of 1120 mcd, and maximum of 1400 mcd at 20mA, showing the expected performance spread. The dominant wavelength (λd) defines the yellow color, ranging from 585nm to 594nm, centered around 590nm typical.

2.2 Thermal and Absolute Maximum Ratings

Thermal management is vital for LED longevity. The thermal resistance from the junction to the solder point is specified as 160 K/W (real) and 125 K/W (electrical), indicating how effectively heat is conducted away from the semiconductor die. The maximum permissible junction temperature (Tj) is 125°C. The operating temperature range is from -40°C to +110°C, suitable for automotive under-dash environments. The device can withstand a reflow soldering temperature peak of 260°C for 30 seconds, aligning with common lead-free soldering profiles. It also has an ESD (Electrostatic Discharge) sensitivity rating of 2kV (Human Body Model), requiring standard ESD handling precautions during assembly.

3. Performance Curve Analysis

The provided graphs offer insights into the LED's behavior under varying conditions, which is critical for robust design.

3.1 Current, Voltage, and Temperature Dependencies

The Forward Current vs. Forward Voltage graph shows the exponential IV relationship typical of a diode. The Relative Luminous Intensity vs. Forward Current curve demonstrates that light output increases with current but may become sub-linear at higher currents due to heating effects. The Dominant Wavelength vs. Forward Current graph shows minimal shift with current, indicating good color stability. The Relative Forward Voltage vs. Junction Temperature graph has a negative coefficient, meaning VF decreases as temperature increases, which can be used for indirect temperature sensing. The Relative Luminous Intensity vs. Junction Temperature graph shows the expected decrease in light output as temperature rises, a key consideration for thermal design. The Relative Wavelength Shift vs. Junction Temperature indicates how the yellow color may slightly shift with temperature.

3.2 Derating and Pulse Operation

The Forward Current Derating Curve is essential for determining the maximum safe operating current at elevated ambient or solder pad temperatures. For example, at a solder pad temperature (Ts) of 110°C, the maximum permissible forward current drops to 35mA. The Permissible Pulse Handling Capability chart defines the peak current (IF) allowed for a given pulse width (tp) and duty cycle (D), useful for multiplexing or PWM (Pulse Width Modulation) dimming applications without overheating the junction.

4. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into performance bins.

4.1 Luminous Intensity Binning

The luminous intensity is categorized into alphanumeric bins (e.g., L1, L2, M1... up to GA). Each bin covers a specific range of minimum and maximum luminous intensity in millicandelas (mcd). For this specific part number, the typical output of 1120 mcd falls into the \"AA\" bin (1120-1400 mcd). Designers can specify a bin code to guarantee a minimum brightness level for their application.

4.2 Dominant Wavelength Binning

The dominant wavelength, which defines the precise shade of yellow, is also binned using numeric codes (e.g., 9194, 9497). The bin \"9194\" covers a range from 591nm to 594nm. The typical value of 590nm for this part suggests it likely falls into the \"8891\" (588-591nm) or \"9194\" bin. Specifying a tight wavelength bin ensures color uniformity across multiple LEDs in a display or lighting array.

5. Mechanical, Assembly, and Packaging

5.1 Physical Dimensions and Polarity

The PLCC-2 package has a standard footprint. The mechanical drawing (implied by section reference) would show the length, width, and height (typically around 3.2mm x 2.8mm x 1.9mm), as well as the lead spacing. The package includes a polarity indicator, usually a notch or a chamfered corner, to identify the cathode. The recommended soldering pad layout is provided to ensure a reliable solder joint and proper heat dissipation during reflow.

5.2 Soldering and Handling Guidelines

The reflow soldering profile specifies the critical parameters: preheat, soak, reflow peak (260°C max), and cooling rates to prevent thermal shock to the component. Precautions for use include standard ESD protection, avoiding mechanical stress on the lens, and not exceeding the absolute maximum ratings. Proper storage conditions (within the specified -40°C to +110°C temperature range and low humidity) are recommended to preserve solderability and performance.

5.3 Packaging and Ordering Information

The LEDs are supplied in tape-and-reel packaging compatible with automated pick-and-place machines. The packaging information section details reel dimensions, tape width, pocket spacing, and orientation. The part number structure (e.g., 67-21-UY0200H-AM) encodes key attributes like color (Y for Yellow), package, and likely performance bins. Ordering information clarifies how to specify quantity, packaging type, and any special binning requirements.

6. Application Notes and Design Considerations

6.1 Typical Application Circuits

In a typical DC driving circuit, a current-limiting resistor is mandatory. The resistor value (R) is calculated using Ohm's Law: R = (Vsupply - VF) / IF. For a 5V supply and targeting IF=20mA with VF=2.0V, R = (5V - 2.0V) / 0.02A = 150 Ohms. The resistor power rating should be at least PR = (Vsupply - VF) * IF = 0.06W; a 1/8W or 1/4W resistor is suitable. For applications requiring brightness control or multiplexing, PWM (Pulse Width Modulation) is the preferred method over analog current dimming, as it maintains color consistency.

6.2 Thermal Management in Design

Despite its low power consumption (~40mW at 20mA), effective heat sinking is important for maintaining performance and longevity, especially in high ambient temperatures or enclosed spaces. The thermal path is from the junction, through the package, to the solder pads, and into the printed circuit board (PCB). Using a PCB with thermal vias under the LED's thermal pad connected to a ground plane significantly improves heat dissipation, lowers the junction temperature, and helps sustain higher luminous output.

6.3 Design for Automotive Reliability

For automotive cluster or interior lighting, consider the following: Use derated operating currents (e.g., 15-18mA instead of 20mA) to enhance longevity and reduce thermal stress. Ensure the PCB layout minimizes parasitic inductance and capacitance in drive lines. Implement protection circuits against load dump and other automotive electrical transients if the LED is directly driven by the vehicle's power bus. Verify that the chosen bin codes for intensity and wavelength meet the aesthetic and functional requirements of the final product under all specified operating temperatures.

7. Technical Comparison and Trends

7.1 Principle of Operation

A Light Emitting Diode (LED) is a semiconductor p-n junction device. When a forward voltage is applied, electrons and holes recombine in the active region, releasing energy in the form of photons (light). The color of the light is determined by the bandgap energy of the semiconductor materials used in the active layer. Yellow LEDs are commonly based on materials like Aluminum Gallium Indium Phosphide (AlGaInP). The PLCC package incorporates a reflective cavity and a molded epoxy lens that shapes the light output and provides environmental protection.

7.2 Industry Context and Evolution

The PLCC-2 package represents a mature and widely adopted form factor in the LED industry, offering a good balance of size, cost, and optical performance. Key trends in LED technology relevant to such components include the continuous improvement of luminous efficacy (more light output per watt of electrical input), enhanced color stability over temperature and lifetime, and the development of ever-smaller package sizes with maintained or improved optical power. The drive for higher reliability and qualification to stringent standards like AEC-Q101 continues to be a major focus, especially for automotive and industrial markets.