1. Product Overview
This document details the specifications for a surface-mount LED in a PLCC-2 package with the part number 1608-UY0100M-AM. The primary application focus is automotive interior lighting, where reliability and performance under varying environmental conditions are paramount. The device emits yellow light and is characterized by a compact 1608 footprint (1.6mm x 0.8mm). Its core advantages include a wide 120-degree viewing angle for uniform illumination, compliance with stringent automotive qualification standards like AEC-Q102, and adherence to environmental regulations such as RoHS, REACH, and halogen-free requirements.
2. Technical Parameter Deep-Dive
2.1 Photometric and Electrical Characteristics
The key operating parameters are defined at a forward current (IF) of 10mA. The typical luminous intensity is 330 mcd, with a minimum of 280 mcd and a maximum of 520 mcd, indicating potential binning variations. The forward voltage (VF) typically measures 2.1V, ranging from 1.5V to 2.75V. The dominant wavelength (λd) is centered at 591nm (yellow spectrum), with a tolerance of ±1nm. The viewing angle is specified as 120 degrees.
2.2 Absolute Maximum Ratings
These ratings define the stress limits beyond which permanent damage may occur. The absolute maximum forward current is 20mA, with a surge current capability of 50mA for pulses ≤10μs. The maximum power dissipation is 50mW. The device can operate and be stored within a temperature range of -40°C to +110°C, with a maximum junction temperature of 125°C. It is not designed for reverse voltage operation. The ESD sensitivity is rated at 2kV (Human Body Model). The maximum soldering temperature during reflow is 260°C for 30 seconds.
2.3 Thermal Characteristics
Thermal management is critical for LED longevity and performance stability. The datasheet provides two thermal resistance values: the real thermal resistance (Rth JS real) from junction to solder point is 150 K/W, while the electrical method-derived value (Rth JS el) is 120 K/W. This parameter is essential for calculating the junction temperature rise under given operating conditions and for proper heatsinking design in the application.
3. Performance Curve Analysis
3.1 IV Curve and Luminous Efficiency
The forward current vs. forward voltage graph shows a characteristic exponential relationship. At the typical operating point of 10mA, VF is approximately 2.1V. The relative luminous intensity vs. forward current curve demonstrates that light output increases with current but may exhibit non-linear behavior and efficiency droop at higher currents, emphasizing the importance of operating within recommended limits.
3.2 Temperature Dependence
Several graphs illustrate the device's performance variation with junction temperature (Tj). The relative luminous intensity decreases as temperature increases, a common trait in LEDs. The forward voltage has a negative temperature coefficient, decreasing linearly with rising temperature. The dominant wavelength also shifts with temperature, which is a consideration for color-critical applications. The forward current derating curve mandates a reduction in maximum allowable current as the solder pad temperature increases above 25°C to prevent exceeding the maximum junction temperature.
3.3 Spectral Distribution and Radiation Pattern
The relative spectral distribution plot confirms the emission in the yellow wavelength region, centered around 591nm. The radiation pattern diagram visually represents the 120-degree viewing angle, showing the angular distribution of light intensity.
4. Binning System Explanation
The LED parameters are grouped into bins to ensure consistency within a production lot. Three key parameters are binned.
4.1 Luminous Intensity Binning
Intensity is grouped from 'Q' (71-82 mcd) up to 'B' (1800-2800 mcd). For this specific part number (1608-UY0100M-AM), the highlighted possible output bins are within the 'T' group, specifically T-X (280-330 mcd), T-Y (330-390 mcd), and T-Z (390-450 mcd), aligning with the typical value of 330 mcd stated in the characteristics table.
4.2 Dominant Wavelength Binning
Wavelength is binned in 3nm steps, coded with four-digit numbers (e.g., 9194 for 591-594nm). The possible bins for this yellow LED are highlighted in the range from 8891 (588-591nm) to 9700 (597-600nm), consistent with the typical 591nm and the 585-594nm range specified earlier.
4.3 Forward Voltage Binning
Forward voltage is binned in steps of approximately 0.25V, coded with four digits (e.g., 1720 for 1.75-2.00V). The typical VF of 2.1V falls within the 2022 bin (2.00-2.25V).
5. Mechanical and Package Information
5.1 Mechanical Dimensions
The LED uses a standard PLCC-2 (Plastic Leaded Chip Carrier) surface-mount package with a 1608 metric footprint (1.6mm length x 0.8mm width). The exact dimensional drawing includes body height, lead dimensions, and tolerances, which are critical for PCB footprint design and assembly clearance.
5.2 Recommended Soldering Pad Layout
A recommended land pattern (footprint) for the PCB is provided. This includes the pad dimensions, spacing, and shape optimized for reliable solder joint formation during reflow soldering, ensuring proper mechanical attachment and thermal/electrical connection.
5.3 Polarity Identification
The PLCC-2 package has a specific marking or physical feature (like a notch or a cut corner) to indicate the cathode. Correct polarity orientation during placement on the PCB is essential for the device to function.
6. Soldering and Assembly Guidelines
6.1 Reflow Soldering Profile
A detailed reflow profile is specified, with a peak temperature not exceeding 260°C for a maximum of 30 seconds. The profile includes preheat, soak, reflow, and cooling stages with defined ramp rates and time above liquidus. Adhering to this profile is crucial to prevent thermal damage to the LED package or die.
6.2 Precautions for Use
General handling and application notes are provided. These include warnings against applying reverse voltage, ensuring operation within absolute maximum ratings, implementing proper ESD protection during handling, and following the current derating guidelines based on ambient temperature.
6.3 Storage Conditions
The device should be stored in an environment within the storage temperature range of -40°C to +110°C, with controlled humidity (as indicated by the MSL-3 rating) to prevent moisture absorption that could cause popcorning during reflow.
7. Packaging and Ordering Information
7.1 Packaging Specifications
The LEDs are supplied on tape and reel, a standard format for automated pick-and-place assembly machines. The packaging information details the reel dimensions, tape width, pocket spacing, and orientation of components on the tape.
7.2 Part Number Structure
The part number 1608-UY0100M-AM can be decoded: \"1608\" indicates the package size, \"UY\" likely denotes the color (Yellow), \"0100\" may relate to a performance code, and \"M-AM\" could specify binning, packaging, or other variants. The exact decoding logic is model-specific.
8. Application Recommendations
8.1 Typical Application Scenarios
The primary and stated application is automotive interior lighting. This includes dashboard backlighting, switch illumination, ambient lighting, and indicator lights. The AEC-Q102 qualification and wide operating temperature range make it suitable for the harsh environment inside a vehicle.
8.2 Design Considerations
When designing with this LED, engineers must consider several factors: Current limiting is mandatory; a series resistor or constant current driver should be used to set IF to the desired level (e.g., 10mA for typical brightness). Thermal design is needed if operating at high ambient temperatures or high currents, using the thermal resistance and derating curve. For uniform lighting arrays, specifying tight bin codes for intensity and wavelength may be necessary. The wide viewing angle is beneficial for area illumination but may require diffusers or light guides for specific beam patterns.
9. Technical Comparison and Differentiation
Compared to generic non-automotive LEDs, this device's key differentiators are its formal AEC-Q102 qualification, which involves rigorous testing for long-term reliability under thermal shock, humidity, and other stresses. The corrosion robustness class B1 rating indicates enhanced resistance to sulfur-containing atmospheres, which is valuable in automotive environments. Its compliance with the latest environmental regulations (RoHS, REACH, Halogen-Free) is also a significant advantage for global market acceptance.
10. Frequently Asked Questions (Based on Technical Parameters)
Q: What is the recommended operating current?
A: The datasheet defines characteristics at 10mA, which is the typical operating point. The absolute maximum is 20mA, but operation at or below 10mA is standard for longevity and efficiency.
Q: How do I control the brightness?
A: Brightness (luminous intensity) is primarily controlled by the forward current (IF). Pulse-width modulation (PWM) can also be used for dimming without shifting the color point significantly.
Q: Why is the forward voltage binning important?
A: In applications where multiple LEDs are connected in series and driven by a constant voltage source, variations in VF can lead to uneven current distribution and brightness. Using LEDs from the same VF bin ensures uniformity.
Q: Can this LED be used outdoors?
A: While it has a wide temperature range, the datasheet specifies \"Automotive Interior lighting.\" For exterior use, additional protection against UV radiation, moisture ingress, and wider temperature extremes would need to be evaluated, and an exterior-grade product might be more appropriate.
11. Practical Design and Usage Case
Case: Dashboard Button Backlighting
In a car dashboard, multiple buttons require soft, uniform yellow backlighting. A designer would use several 1608-UY0100M-AM LEDs. They would connect them in series (if the driver voltage permits) or in parallel with individual resistors to ensure consistent current. The 120° viewing angle helps illuminate the button evenly from a single LED placed underneath. The designer must calculate the required current (likely 5-10mA per LED) to achieve the desired brightness without causing excessive power dissipation or heat on the flexible PCB. The AEC-Q102 qualification gives confidence in the component's ability to withstand the vehicle's lifetime temperature cycles and vibrations.
12. Operating Principle Introduction
This is a semiconductor light-emitting diode (LED). When a forward voltage exceeding its bandgap energy is applied, electrons and holes recombine in the active region of the semiconductor chip (likely based on AlInGaP or similar material for yellow light). This recombination releases energy in the form of photons (light). The specific material composition and doping determine the dominant wavelength of the emitted light, which in this case is in the yellow spectrum (~591nm). The PLCC-2 package houses the semiconductor die, provides electrical connections via two leads, and incorporates a molded plastic lens that shapes the output beam to achieve the 120-degree viewing angle.
13. Technology Trends
The trend in automotive interior lighting LEDs is towards higher efficiency (more lumens per watt), enabling brighter displays with lower power consumption and less heat generation. There is also a move towards smaller package sizes (like 1008 or 0806) to allow for more compact and sleek designs. Furthermore, the integration of multiple color LEDs (RGB) in a single package for dynamic, customizable ambient lighting is becoming increasingly popular. Enhanced reliability standards and broader environmental compliance remain constant drivers in the automotive sector.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |