PLCC-6 RGB LED Datasheet - 120° Viewing Angle - Red 1.95V/900mcd, Green 2.75V/2200mcd, Blue 3.0V/320mcd @20mA - English Technical Document

1. Product Overview

This document details the technical specifications for a high-performance, surface-mount RGB (Red, Green, Blue) LED in a PLCC-6 package. The device is engineered for demanding applications, particularly in the automotive sector, where reliability, consistent performance, and environmental robustness are critical. Its primary function is to provide vibrant, multi-color illumination for interior ambient lighting, switch backlighting, and other indicator functions.

The core advantages of this component include its compact PLCC-6 footprint, a wide 120-degree viewing angle for excellent visibility, and individually high luminous intensity outputs for each color channel. It is designed to meet stringent automotive-grade qualifications, ensuring long-term performance under harsh operating conditions.

The target market is primarily automotive electronics manufacturers, specifically for interior lighting modules, dashboard illumination, ambient lighting systems, and tactile switch backlighting. Its compliance with industry standards also makes it suitable for other high-reliability consumer and industrial applications.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

The device's performance is defined under standard test conditions (Ts=25°C). The forward current (I_F) for all three colors has a typical operating point of 20mA, with maximum ratings of 50mA for Red and 30mA for Green and Blue. The minimum forward currents are 5mA for Red and 3mA for Green/Blue, below which operation is not recommended.

Luminous Intensity (I_V): This is a key performance metric. At 20mA, the typical values are 900 mcd (Red), 2200 mcd (Green), and 320 mcd (Blue). The Green channel offers the highest output, followed by Red and then Blue. The measurement tolerance for luminous flux is ±8%.

Forward Voltage (V_F): The voltage drop across each diode at 20mA is typically 1.95V for Red, 2.75V for Green, and 3.00V for Blue. These values are crucial for driver circuit design and power dissipation calculations. The forward voltage measurement tolerance is ±0.05V.

Dominant Wavelength (λ_d): Defines the perceived color. Typical values are 626nm (Red), 527nm (Green), and 455nm (Blue), with a tight tolerance of ±1nm. This ensures consistent color output across production batches.

Viewing Angle (φ): A consistent 120 degrees for all three colors, with a tolerance of ±5°. This wide angle provides uniform illumination over a broad area.

2.2 Thermal and Reliability Characteristics

Thermal Resistance (R_{th JS}): This parameter indicates how effectively heat is transferred from the LED junction to the solder point. Two values are given: Real (measured optically) and Electrical (measured via voltage method). For the Red channel, the maximum real thermal resistance is 160 K/W, while for Green and Blue it is 130 K/W. The electrical thermal resistance is lower at 125 K/W (Red) and 100 K/W (Green/Blue). Lower values are better for thermal management.

Absolute Maximum Ratings: These are stress limits that must not be exceeded, even momentarily. Key limits include a maximum junction temperature (T_J) of 125°C, an operating temperature range (T_opr) from -40°C to +110°C, and storage temperature (T_stg) from -40°C to +110°C. The device can withstand an ESD (HBM) of up to 2kV and a reflow soldering temperature of 260°C for 30 seconds.

Power Dissipation (P_d): The maximum allowable power dissipation is 137 mW for the Red LED and 105 mW for the Green and Blue LEDs. Exceeding this limit risks damaging the device.

3. Binning Information and Part Number System

The product utilizes a binning system to categorize LEDs based on key optical and electrical parameters, ensuring consistency for the end-user. While the full binning matrix is detailed in the datasheet, the primary parameters for binning typically include:

• Luminous Intensity Binning: LEDs are sorted into bins based on their measured light output at a specific current (e.g., 20mA). This ensures a uniform brightness level in an assembly.
• Dominant Wavelength / Chromaticity Binning: LEDs are grouped according to their precise wavelength or color coordinates on the CIE chromaticity diagram. This is critical for achieving consistent and accurate color, especially in multi-LED arrays or when matching specific color requirements.
• Forward Voltage Binning: Sorting by V_{F helps in designing more efficient driver circuits and can be important for current balancing in parallel configurations.}

The part number 67-63L-RGB0200H-A04-2T-AM encodes this binning and other product attributes. The specific alphanumeric codes (like "A04" and "2T") correspond to the selected bins for intensity, wavelength, and voltage for the Red, Green, and Blue chips within this single package. The ordering information section provides the key to interpreting this code for procurement.

4. Performance Curve Analysis

4.1 IV Curve and Relative Luminous Intensity

The Forward Current vs. Forward Voltage graph shows the exponential relationship typical of diodes. The Red LED has the lowest turn-on voltage, followed by Green, then Blue. This graph is essential for selecting the appropriate current-limiting resistor or designing a constant-current driver.

The Relative Luminous Intensity vs. Forward Current graph demonstrates that light output increases with current but not linearly. It tends to saturate at higher currents. This curve helps designers optimize the drive current for the desired brightness while considering efficiency and device lifetime.

4.2 Temperature Dependence

Relative Luminous Intensity vs. Junction Temperature: Light output decreases as junction temperature rises. The rate of decrease varies by color; the graph shows that Blue is typically more sensitive to temperature than Red or Green. This is a critical consideration for thermal management in the final application.

Relative Forward Voltage vs. Junction Temperature: The forward voltage has a negative temperature coefficient—it decreases as temperature increases. This characteristic can sometimes be used for indirect temperature sensing.

Relative Wavelength Shift vs. Junction Temperature: The dominant wavelength shifts with temperature. Generally, the wavelength increases (shifts to longer wavelengths, or "red-shifts") as temperature rises. This shift must be accounted for in color-critical applications.

4.3 Spectral and Radiation Characteristics

The Relative Spectral Distribution graph plots the intensity of light emitted across the visible spectrum for each color. It shows the purity and peak wavelengths of the Red, Green, and Blue emissions. The Full Width at Half Maximum (FWHM) of these peaks can be inferred, indicating color saturation.

The Typical Diagram Characteristics of Radiation (for Red, Green, and Blue) illustrate the spatial distribution of light—the radiation pattern. The 120° viewing angle is defined as the full angle where intensity drops to 50% of the peak value (on-axis). These polar plots are vital for optical design, such as selecting diffusers or lenses.

4.4 Forward Current Derating

Separate derating curves for Red, Green, and Blue show the maximum allowable forward current as a function of the solder pad temperature (T_S). As T_S increases, the maximum permissible I_F must be reduced to prevent the junction temperature from exceeding its 125°C limit. For example, the Red LED's maximum current drops from 50mA at 103°C to 35mA at 110°C. These curves are mandatory for reliable operation in high-temperature environments like automotive interiors.

5. Mechanical, Packaging, and Assembly Information

5.1 Mechanical Dimensions and Polarity

The component is housed in a standard PLCC-6 (Plastic Leaded Chip Carrier) package. The mechanical drawing provides exact dimensions including body length, width, height, lead spacing, and pad positions. Adherence to these dimensions is necessary for PCB footprint design. The package includes a polarity indicator, typically a notch or a dot near pin 1, which corresponds to the cathode of the Red LED. The pinout configuration (which pin controls Red, Green, Blue, and common anode/cathode) is clearly defined in the drawing.

5.2 Recommended Soldering Pad and Reflow Profile

A recommended solder pad land pattern is provided to ensure proper solder joint formation, mechanical stability, and optimal heat transfer during reflow. Following this pattern minimizes tombstoning and improves reliability.

The reflow soldering profile specifies the critical parameters for assembly: preheat, soak, reflow peak temperature (260°C max for 30 seconds), and cooling rates. This profile is designed to be compatible with standard lead-free (RoHS) solder pastes while preventing thermal damage to the LED.

5.3 Packaging and Handling

The device is supplied on tape-and-reel for automated pick-and-place assembly. The packaging information details reel dimensions, tape width, pocket spacing, and orientation. The Moisture Sensitivity Level (MSL) is rated at 3, meaning the component must be baked if exposed to ambient air for more than 168 hours before soldering to prevent "popcorning" during reflow.

6. Application Guidelines and Design Considerations

6.1 Typical Application Scenarios

• Automotive Interior Ambient Lighting: Footwell lights, dashboard accents, door panel lighting. The wide viewing angle and color mixing capability are ideal for creating soft, diffuse lighting effects.
• Switch and Control Backlighting: Illuminating buttons, knobs, and touch interfaces. The high brightness ensures visibility under various lighting conditions.
• Status Indicators and Clusters: Multi-color indicators for system status, warnings, or infotainment feedback.

6.2 Critical Design Considerations

• Current Driving: Always use a constant-current driver or appropriate current-limiting resistors for each color channel. Do not connect directly to a voltage source. Refer to the derating curves for high-temperature environments.
• Thermal Management: The PCB layout must facilitate heat dissipation. Use the recommended pad design, ensure adequate copper area connected to the thermal pad, and consider the operating ambient temperature. Poor thermal management leads to reduced light output, color shift, and shortened lifespan.
• ESD Protection: While rated for 2kV HBM, standard ESD handling precautions should be observed during assembly and handling.
• Color Mixing: To achieve white or other specific colors, the different drive currents for the R, G, and B channels must be carefully calibrated due to their differing luminous efficacies. A microcontroller with PWM control is typically used for dynamic color mixing.

7. Compliance and Material Information

The product is designed and qualified to meet several important industry standards:

• AEC-Q102: This is the stress test qualification for discrete optoelectronic semiconductors in automotive applications. Compliance ensures reliability under automotive temperature cycles, humidity, vibration, etc.
• RoHS Compliant: The device is free of restricted hazardous substances like lead, mercury, and cadmium.
• REACH Compliant: Adheres to the EU regulation concerning the Registration, Evaluation, Authorisation and Restriction of Chemicals.
• Halogen Free: The packaging material has very low Bromine (Br) and Chlorine (Cl) content (Br <900ppm, Cl <900ppm, Br+Cl <1500ppm), which is important for environmental and safety reasons during disposal or in case of fire.
• Corrosion Robustness: Meets Class B1 requirements, indicating a degree of resistance to corrosive atmospheres.

8. Precautions and Sulfur Resistance

The "Precaution for Use" section outlines general handling and operational warnings, such as avoiding mechanical stress on the lens, preventing contamination, and ensuring correct polarity during installation.

A specific note is made regarding Sulfur Resistance. Silver-based materials used in some LED packages can corrode when exposed to sulfur-containing atmospheres (e.g., industrial environments, some rubbers). The datasheet references a sulfur test criteria, indicating that the device has been tested or designed with some level of resistance to this phenomenon, which is crucial for long-term reliability in certain applications.