PLCC-2 Red LED 2214 Datasheet - 2.2x1.4mm - 2.05V Typ - 30mA - 1120mcd - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-brightness red LED in a PLCC-2 (Plastic Leaded Chip Carrier) surface-mount package, designated as 2214. This component is engineered for reliability and performance in demanding applications, featuring a compact footprint and a wide 120-degree viewing angle. Its primary design target is automotive interior lighting systems, where consistent color output, long-term stability, and compliance with industry standards are critical.

The LED's core advantages include its qualification to the AEC-Q102 standard for automotive-grade discrete optoelectronic devices, ensuring it meets stringent quality and reliability requirements for vehicle use. It also boasts compliance with RoHS, REACH, and halogen-free directives, making it suitable for global markets with strict environmental regulations. The combination of high luminous intensity, robust construction (Corrosion Robustness Class A1), and a proven package technology makes it a versatile choice for designers.

2. Technical Parameter Deep-Dive

2.1 Photometric & Optical Characteristics

The key performance metric is the luminous intensity, with a typical value of 1120 millicandelas (mcd) at a standard drive current of 30 mA. The minimum and maximum values under the same condition are 900 mcd and 1800 mcd, respectively, indicating the production spread. The dominant wavelength, which defines the perceived color, is typically 622 nanometers (nm), within a range of 615 nm to 627 nm. This places it firmly in the standard red spectrum. The viewing angle, defined as the full angle where intensity is half the peak value, is 120 degrees, providing a broad, even illumination pattern suitable for backlighting and indicator applications.

2.2 Electrical Characteristics

The forward voltage (Vf) is a critical parameter for circuit design. At 30 mA, the typical Vf is 2.05 Volts, with a range from 1.75V (Min) to 2.75V (Max). The absolute maximum continuous forward current is 50 mA, while a surge current of 100 mA for pulses ≤10 μs is permissible. The device is not designed for reverse bias operation. The Electrostatic Discharge (ESD) sensitivity, tested per Human Body Model (HBM), is rated at 2 kV, which is a standard level for handling with basic precautions.

3. Thermal Characteristics & Reliability

Thermal management is crucial for LED longevity and performance stability. The thermal resistance from the semiconductor junction to the solder point is specified in two ways: a \"real\" measurement (Rth JS real) with a maximum of 160 K/W, and an \"electrical\" method (Rth JS el) with a maximum of 125 K/W. The lower the thermal resistance, the more efficiently heat is conducted away from the LED chip. The maximum permissible junction temperature (Tj) is 125°C. The operating and storage temperature range is from -40°C to +110°C, confirming its suitability for harsh automotive environments. The device can withstand lead-free reflow soldering profiles with a peak temperature of 260°C for 30 seconds.

4. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters.

4.1 Luminous Intensity Binning

The luminous intensity is binned using an alphanumeric code system spanning from L1 (11.2-14 mcd) up to GA (18000-22400 mcd). For this specific part number (2214-UR0301H-AM), the possible output bins are highlighted and range from V2 (900-1120 mcd) to AB (1400-1800 mcd), with the typical value of 1120 mcd falling within the AA bin (1120-1400 mcd). Designers must consult the specific part number ordering information to know the exact bin supplied.

4.2 Dominant Wavelength Binning

The dominant wavelength is binned with 4-digit codes. The bins relevant to this red LED are in the 600-640 nm range. The possible output bins for this part cover the range from 2124 (621-624 nm) to 3033 (630-633 nm), with the typical 622 nm value belonging to the 2124 bin. A tolerance of ±1 nm is applied to the binning process.

4.3 Forward Voltage Binning

Forward voltage is binned using 4-digit codes representing the voltage range in tenths of a volt. For example, bin 1720 covers 1.75V to 2.00V. The typical Vf of 2.05V would fall into the 2022 bin (2.00-2.25V). Selecting LEDs from a tight Vf bin can simplify current-limiting circuit design in parallel arrays.

5. Performance Curve Analysis

The datasheet provides several graphs characterizing performance under varying conditions.

5.1 IV Curve & Relative Luminous Intensity

The Forward Current vs. Forward Voltage graph shows the exponential relationship typical of a diode. The Relative Luminous Intensity vs. Forward Current graph demonstrates that light output increases sub-linearly with current, emphasizing the importance of driving at the recommended current for optimal efficiency.

5.2 Temperature Dependence

Key graphs show the impact of junction temperature (Tj). The Relative Luminous Intensity vs. Junction Temperature curve shows that light output decreases as temperature increases, a phenomenon known as thermal droop. The Relative Forward Voltage vs. Junction Temperature graph shows Vf decreases linearly with increasing temperature, which can be used for indirect temperature monitoring. The Relative Wavelength Shift graph indicates the dominant wavelength increases slightly (red-shifts) with higher temperature.

5.3 Derating & Pulse Handling

The Forward Current Derating Curve dictates the maximum allowable continuous current based on the solder pad temperature. For example, at a solder point temperature (Ts) of 110°C, the maximum current is 35 mA. The Permissible Pulse Handling Capability chart defines the maximum single-pulse current amplitude for various pulse widths and duty cycles, useful for multiplexing or strobe applications.

6. Mechanical & Package Information

The LED uses the industry-standard PLCC-2 package. The \"2214\" designation typically refers to the package dimensions of approximately 2.2mm in length and 1.4mm in width. The mechanical drawing would detail the exact length, width, height, lead spacing, and cutout dimensions for the lens. The polarity is indicated by a cathode mark, typically a notch or a green marking on the package body. The recommended soldering pad layout is provided to ensure a reliable solder joint and proper thermal connection to the PCB.

7. Soldering & Assembly Guidelines

The component is compatible with lead-free reflow soldering processes. The recommended reflow profile includes a peak temperature of 260°C for 30 seconds, as defined in the Absolute Maximum Ratings. Precautions for use include standard ESD handling procedures, avoiding mechanical stress on the lens, and ensuring the soldering process does not exceed the specified thermal limits. Proper storage conditions are within the -40°C to +110°C temperature range in a low-humidity environment.

8. Application Suggestions

8.1 Typical Application Scenarios

The primary application is automotive interior lighting, such as backlighting for switches, buttons, and dashboard clusters. Its reliability and AEC-Q102 qualification make it ideal for this demanding environment. It is also suitable for general indicator lights, status displays, and backlighting in consumer electronics and industrial equipment where a bright, reliable red indication is needed.

8.2 Design Considerations

Circuit designers must implement a proper current-limiting scheme, typically a series resistor or constant current driver, based on the forward voltage bin and supply voltage. Thermal design is essential; the PCB layout should provide adequate copper area (thermal pad) to dissipate heat, especially when operating at high ambient temperatures or near the maximum current. For consistent color and brightness in an array, specifying tight wavelength and intensity bins or using electronic calibration may be necessary.

9. Technical Comparison & Differentiation

Compared to non-automotive grade LEDs, this component's key differentiators are its AEC-Q102 qualification and extended temperature range (-40°C to +110°C), which are mandatory for automotive applications. Its Corrosion Robustness Class A1 rating indicates enhanced resistance to sulfur and other corrosive atmospheres, a common issue in automotive environments. The PLCC-2 package offers a good balance of size, solderability, and light output compared to smaller chip-scale packages or larger through-hole LEDs.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the recommended operating current?
A: The standard test condition and typical performance are given at 30 mA. It can be operated from 5 mA to its absolute maximum of 50 mA, but efficiency and lifetime are optimized at or near the typical current.

Q: How does temperature affect brightness?
A: As shown in the performance curves, luminous intensity decreases as junction temperature rises. Effective heat sinking is crucial to maintain stable light output.

Q: Can I drive this LED with a 5V supply?
A: Yes, but a series resistor is required to limit the current. The resistor value R = (Supply Voltage - LED Vf) / Desired Current. Use the maximum Vf from the bin or datasheet for a conservative design.

Q: What does the viewing angle of 120° mean?
A> It means the angular spread where the luminous intensity is at least half of its peak value (measured on-center). It provides a very wide field of view.

11. Practical Design Case Study

Consider designing a backlight for an automotive switch panel with 10 identical red LEDs. The system voltage is 12V (automotive battery). To ensure longevity, we choose to drive each LED at 25 mA (below the 30mA typical). Assuming we use LEDs from the highest Vf bin (2.75V max), the series resistor for each LED would be: R = (12V - 2.75V) / 0.025A = 370 Ohms. A standard 360 or 390 Ohm resistor would be suitable. The PCB layout would group the LEDs and connect their thermal pads to a common copper pour to dissipate heat. To ensure uniform appearance, specifying LEDs from the same dominant wavelength and luminous intensity bin is advised.

12. Operating Principle Introduction

This is a semiconductor light-emitting diode. When a forward voltage exceeding its characteristic forward voltage (~2V for red) is applied, electrons and holes recombine within the active region of the semiconductor chip (typically based on Aluminum Gallium Indium Phosphide - AlGaInP for red). This recombination process releases energy in the form of photons (light). The specific material composition and structure determine the wavelength (color) of the emitted light. The plastic package encapsulates and protects the chip, incorporates a leadframe for electrical connection, and includes a molded lens that shapes the light output beam.

13. Technology Trends

The general trend in SMD LEDs like this is towards higher efficiency (more light output per watt of electrical input), which reduces power consumption and thermal load. There is also a drive for increased reliability and longer operational lifetimes, especially for automotive and industrial applications. Package miniaturization continues, but the PLCC-2 remains popular due to its excellent balance of performance, cost, and ease of assembly. Furthermore, integration of features like built-in current regulation or protection diodes within the package is a growing trend to simplify circuit design.