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LTC-5753JD-01 LED Display Datasheet - 0.56-inch Digit Height - Hyper Red (650nm) - 2.6V Forward Voltage - 70mW Power Dissipation - English Technical Document

Complete technical datasheet for the LTC-5753JD-01, a 0.56-inch quadruple-digit seven-segment AlInGaP Hyper Red LED display. Includes specifications, pinout, dimensions, electrical/optical characteristics, and application guidelines.
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PDF Document Cover - LTC-5753JD-01 LED Display Datasheet - 0.56-inch Digit Height - Hyper Red (650nm) - 2.6V Forward Voltage - 70mW Power Dissipation - English Technical Document

1. Product Overview

The LTC-5753JD-01 is a high-performance, quadruple-digit, seven-segment alphanumeric display module designed for applications requiring clear, bright numeric readouts. Its primary function is to visually represent numerical data across four distinct digits, each composed of seven individually addressable LED segments plus a decimal point. The device is engineered for integration into instrumentation panels, industrial control systems, test equipment, consumer electronics, and any interface where reliable, multi-digit numeric display is essential.

The core advantage of this display lies in its use of AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor technology for the Hyper Red LED chips. This material system is renowned for its high efficiency and excellent luminous intensity in the red-orange spectrum. The display features a light gray face with white segments, which significantly enhances contrast and readability under various lighting conditions, contributing to its "excellent character appearance." The device is categorized for luminous intensity, ensuring consistent brightness levels across production batches for uniform visual performance in multi-unit installations.

2. Technical Specifications Deep Dive

This section provides a detailed, objective analysis of the key technical parameters defined in the datasheet, explaining their significance for design and application.

2.1 Photometric and Optical Characteristics

The optical performance is central to the display's functionality. The key parameters are measured under standardized test conditions (typically Ta=25°C).

2.2 Electrical and Thermal Characteristics

These parameters define the electrical operating limits and conditions for reliable and safe use.

2.3 Absolute Maximum Ratings and Environmental Limits

These are stress limits that must not be exceeded under any circumstances, even momentarily. Operation beyond these ratings may cause permanent damage.

3. Binning and Categorization System

The datasheet explicitly states that the device is "categorized for luminous intensity." This indicates a production binning process. While specific bin codes are not provided in this excerpt, typical categorization for such displays involves grouping units based on measured luminous intensity at a standard test current (e.g., IF=1mA). This ensures that designers sourcing multiple displays for a single product can achieve uniform brightness across all units, which is vital for professional-looking end products. It is implied that other key parameters like forward voltage and dominant wavelength are also controlled within specified tolerances to guarantee consistent performance.

4. Performance Curve Analysis

The datasheet references "Typical Electrical / Optical Characteristic Curves." While the specific graphs are not detailed in the provided text, standard curves for such devices typically include:

These curves allow designers to predict performance under non-standard operating conditions and optimize their driver circuits for efficiency and longevity.

5. Mechanical and Packaging Information

5.1 Physical Dimensions and Outline

The package drawing is referenced. Key features of a standard 4-digit, 0.56-inch display include an overall module size that houses four side-by-side digits, a pin spacing compatible with standard DIP (Dual In-line Package) sockets or PCB footprints, and a segment height of 14.2 mm. The "continuous uniform segments" feature suggests a seamless appearance between digits, often achieved with a single, molded faceplate. Tolerances on dimensions are typically ±0.25 mm unless otherwise specified.

5.2 Pin Connection and Circuit Diagram

The device has a 12-pin configuration. It utilizes a Common Cathode multiplexing architecture. This means the cathode (negative side) of all LEDs for a specific digit are connected together internally, while the anodes (positive side) for each segment type (A-G, DP) are shared across all digits.

The internal circuit diagram would show four sets of seven LEDs (plus DP) arranged with their anodes tied to the segment lines and their cathodes tied to the respective digit lines. This structure is fundamental to the multiplexing drive technique.

6. Soldering and Assembly Guidelines

Adherence to the specified soldering profile is non-negotiable for reliability. The absolute maximum rating for solder temperature is 260°C for 3 seconds. In practice, a lead-free reflow profile with a peak temperature slightly below this maximum (e.g., 250°C) is recommended to provide a safety margin. The measurement point (1.6mm below seating plane) is critical as it represents the temperature at the package leads, not necessarily the hot air temperature in the reflow oven. Prolonged exposure to high temperature can damage the internal wire bonds, degrade the LED epoxy, or cause delamination. Manual soldering with an iron should be performed quickly and with adequate thermal relief on the PCB pad. Proper ESD (Electrostatic Discharge) handling procedures should always be followed during assembly.

7. Application Suggestions

7.1 Typical Application Circuits

The LTC-5753JD-01 is designed for multiplexed (multiplex) operation. A typical driver circuit involves a microcontroller or dedicated display driver IC (e.g., MAX7219, TM1637). The driver sequentially activates (sinks current to ground) one digit cathode at a time while applying the correct pattern of segment anode voltages (through current-limiting resistors) for that digit. This cycle repeats at a high frequency (typically >100Hz), exploiting persistence of vision to make all four digits appear continuously lit. This method drastically reduces the required number of driver pins from 36 (4 digits * 9 segments) to just 12 (8 segments + 4 digits).

7.2 Design Considerations and Best Practices

8. Technical Comparison and Differentiation

Compared to older technologies like standard GaAsP or GaP red LEDs, the AlInGaP Hyper Red LED offers significantly higher luminous efficiency, resulting in greater brightness for the same drive current or lower power consumption for the same brightness. The 650nm wavelength provides a vibrant, deep red color. Compared to common anode configurations, the common cathode configuration is often more convenient to interface with modern microcontrollers, which are better at sinking current (to ground) than sourcing it. The 0.56-inch digit height places it in a category suitable for medium-distance viewing, larger than miniature SMD displays but smaller than large panel-mounted units.

9. Frequently Asked Questions (FAQ)

Q: Can I drive this display with a constant DC voltage without multiplexing?
A: Technically yes, but it is highly inefficient and requires a large number of I/O pins (one per segment per digit). Multiplexing is the intended and optimal method of operation.

Q: Why is the peak current rating so much higher than the continuous current rating?
A: This is due to thermal limits. During a short pulse, the LED junction does not have time to heat up significantly, allowing a higher instantaneous current without exceeding the maximum junction temperature. This property is exploited in multiplexing.

Q: What is the purpose of the luminous intensity matching ratio?
A: It guarantees visual uniformity. Without this specification, one segment (e.g., segment A) might be noticeably brighter or dimmer than another (e.g., segment D) in the same digit, creating an uneven, unprofessional appearance.

Q: How do I calculate the average power consumption?
A: For a multiplexed display, calculate the power for one segment when lit (IF_peak * VF), multiply by the number of segments lit in a typical digit (e.g., 7 for an "8"), then multiply by the duty cycle (1/4 for 4-digit mux). This gives the average power for one digit. Multiply by 4 for total module power. Remember to include the driver IC's own consumption.

10. Operational Principle

The device operates on the principle of electroluminescence in a semiconductor p-n junction. When a forward bias voltage exceeding the diode's turn-on voltage (approximately 2.1-2.6V) is applied across an AlInGaP LED segment, electrons and holes are injected into the active region where they recombine. This recombination process releases energy in the form of photons (light) with a wavelength characteristic of the AlInGaP material bandgap, which is in the hyper red region (~650nm). The internal circuit is arranged in a matrix (common cathode per digit, common anodes per segment type) to enable time-division multiplexing, where only one digit is electrically active at any instant, but all appear lit due to rapid sequential scanning.

11. Industry Context and Trends

Displays like the LTC-5753JD-01 represent a mature and reliable technology. While newer display technologies like OLEDs and high-resolution dot-matrix LCDs offer more flexibility for graphics and custom fonts, seven-segment LED displays remain dominant in applications prioritizing extreme reliability, high brightness, wide viewing angles, low cost, and simplicity—especially in industrial, automotive, and outdoor environments. The trend within this segment is towards higher efficiency (more lumens per watt), allowing for lower power consumption and reduced heat generation, and towards surface-mount device (SMD) packages for automated assembly, though through-hole packages like this one remain popular for prototyping, repair, and certain ruggedized applications. The use of advanced semiconductor materials like AlInGaP over older GaAsP is a direct result of this efficiency-driven trend.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.