LED Lamp 264-7SURD/S530-A3 Datasheet - Brilliant Red - 20mA - 125mcd - English Technical Document

1. Product Overview

This document provides the technical specifications for a high-brightness, brilliant red LED lamp. The device is part of a series engineered for applications demanding superior luminous output. It utilizes AlGaInP chip technology encapsulated in a red diffused resin, resulting in a distinct and vibrant red emission. The product is designed with reliability and robustness as core principles, ensuring consistent performance in various electronic assemblies.

The LED is compliant with key environmental and safety standards, including RoHS, EU REACH, and is Halogen Free (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). It is available in different viewing angles and can be supplied on tape and reel for automated assembly processes, catering to high-volume manufacturing needs.

2. Technical Parameters: In-Depth Objective Interpretation

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be continuously applied to the LED without risk of degradation.
• Peak Forward Current (IFP): 60 mA. This rating applies under pulsed conditions with a duty cycle of 1/10 at 1 kHz. Exceeding this in steady-state operation will likely cause failure.
• Reverse Voltage (VR): 5 V. Applying a reverse bias voltage greater than this can break down the LED's semiconductor junction.
• Power Dissipation (Pd): 60 mW. This is the maximum power the package can dissipate, calculated as Forward Voltage (VF) x Forward Current (IF).
• Operating & Storage Temperature: The device is rated for operation from -40°C to +85°C and can be stored from -40°C to +100°C.
• Soldering Temperature (Tsol): The leads can withstand 260°C for 5 seconds during soldering processes.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of Ta=25°C and IF=20mA, providing the baseline performance data.

• Luminous Intensity (Iv): Typical value is 125 mcd (millicandela), with a minimum of 63 mcd. This quantifies the perceived brightness of the red light output to the human eye.
• Viewing Angle (2θ1/2): 60 degrees (typical). This is the full angle at which the luminous intensity drops to half of its peak value, defining the beam spread.
• Peak Wavelength (λp): 632 nm (typical). This is the wavelength at which the spectral power distribution reaches its maximum.
• Dominant Wavelength (λd): 624 nm (typical). This is the single wavelength perceived by the human eye, defining the color hue (brilliant red).
• Forward Voltage (VF): Ranges from 1.7V (min) to 2.4V (max), with a typical value of 2.0V at 20mA. This is the voltage drop across the LED when operating.
• Reverse Current (IR): Maximum of 10 µA when a 5V reverse bias is applied.

Measurement uncertainties are noted: ±0.1V for VF, ±10% for Iv, and ±1.0nm for λd.

3. Binning System Explanation

The datasheet indicates the use of a binning system for key parameters, as referenced in the packing label explanation. This system ensures color and brightness consistency within defined tolerances for production batches.

• CAT (Ranks of Luminous Intensity): Bins for the luminous output (Iv).
• HUE (Ranks of Dominant Wavelength): Bins for the color point (λd), crucial for applications requiring precise color matching.
• REF (Ranks of Forward Voltage): Bins for the forward voltage drop (VF), which can be important for driver design and power management.

Specific bin code values and their ranges are not detailed in this excerpt but are typically provided in separate binning documents from the manufacturer.

4. Performance Curve Analysis

The datasheet includes several characteristic graphs that illustrate device behavior under varying conditions.

4.1 Relative Intensity vs. Wavelength

This spectral distribution curve shows the light output as a function of wavelength, centered around the 632 nm peak. The narrow bandwidth (Δλ typ. 20 nm) confirms a saturated red color.

4.2 Directivity Pattern

A polar plot illustrating the spatial distribution of light, correlating with the 60-degree viewing angle. It shows how intensity decreases from the center axis.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

This graph shows the exponential relationship between current and voltage, typical of a diode. The curve helps in designing current-limiting circuitry.

4.4 Relative Intensity vs. Forward Current

Shows that light output increases with current but may become sub-linear at higher currents due to efficiency droop and thermal effects.

4.5 Relative Intensity vs. Ambient Temperature

Demonstrates the negative temperature coefficient of light output. Luminous intensity decreases as the ambient temperature rises, which is critical for thermal management in the application.

4.6 Forward Current vs. Ambient Temperature

May illustrate derating guidelines, showing how the maximum permissible forward current should be reduced at higher ambient temperatures to stay within the power dissipation limits.

5. Mechanical and Package Information

5.1 Package Dimension Drawing

A detailed mechanical drawing is provided showing the LED's physical dimensions. Key notes include: all dimensions are in millimeters, the flange height must be less than 1.5mm, and the general tolerance is ±0.25mm unless otherwise specified. The drawing defines lead spacing, body size, and overall shape, which are essential for PCB footprint design.

5.2 Polarity Identification

The cathode is typically identified by a flat side on the LED lens or a shorter lead. The datasheet drawing should clearly indicate this, which is vital for correct installation to prevent reverse bias.

6. Soldering and Assembly Guidelines

Proper handling is critical to maintain LED performance and reliability.

6.1 Lead Forming

• Bend leads at a point at least 3mm from the epoxy bulb base.
• Perform forming before soldering.
• Avoid stressing the package; stress can damage internal bonds or crack the epoxy.
• Cut leads at room temperature.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress.

6.2 Storage

• Store at ≤30°C and ≤70% RH. Shelf life is 3 months after shipment.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

6.3 Soldering

General Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering: Iron tip temperature max 300°C (for a 30W iron), soldering time max 3 seconds.

Wave/DIP Soldering: Preheat temperature max 100°C for max 60 seconds. Solder bath temperature max 260°C for max 5 seconds.

Profile: A recommended soldering temperature profile graph is included, showing preheat, soak, reflow, and cooling zones to minimize thermal shock.

Critical Notes:

• Avoid stress on leads during high-temperature phases.
• Do not solder (dip or hand) more than once.
• Protect the LED from mechanical shock until it cools to room temperature after soldering.
• Avoid rapid cooling from peak temperature.
• Use the lowest effective soldering temperature.

6.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Avoid ultrasonic cleaning. If absolutely required, pre-qualify the process to ensure no damage occurs.

6.5 Heat Management

A brief but crucial note emphasizes that thermal management must be considered during the application design stage. The operating current should be set with the junction temperature in mind, as excessive heat reduces light output and lifespan.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packed in an anti-static bag, placed in an inner carton, and then in an outside carton for shipping protection.

Packing Quantity: Minimum 200 to 1000 pieces per bag. Four bags are packed in one inner carton. Ten inner cartons are packed in one outside carton.

7.2 Label Explanation

The packing label contains several codes:

• CPN: Customer's Production Number
• P/N: Production Number (e.g., 264-7SURD/S530-A3)
• QTY: Packing Quantity
• CAT, HUE, REF: Binning codes for Luminous Intensity, Dominant Wavelength, and Forward Voltage, respectively.
• LOT No: Manufacturing Lot Number for traceability.

8. Application Suggestions

8.1 Typical Application Scenarios

Listed applications include TV sets, monitors, telephones, and computers. This indicates use as indicator lights, backlighting for small displays, or status LEDs in consumer electronics and IT equipment.

8.2 Design Considerations

• Current Limiting: Always use a series resistor or constant current driver to limit IF to the desired value (e.g., 20mA for typical brightness), never connect directly to a voltage source.
• Thermal Design: Ensure the PCB and surrounding environment allow for adequate heat dissipation, especially if operating near maximum ratings or in enclosed spaces.
• Optical Design: The 60-degree viewing angle is suitable for wide viewing. Consider lens or light guide design if beam shaping is required.
• ESD Protection: Although not highly sensitive, standard ESD handling precautions are recommended during assembly.

9. Technical Comparison and Differentiation

While a direct comparison with other part numbers is not provided in this single datasheet, the key differentiating features of this LED series can be inferred:

• Material: Use of AlGaInP semiconductor material, which is highly efficient for red and amber colors, compared to older technologies.
• Brightness: Positioned as a \"higher brightness\" series within its category.
• Compliance: Full compliance with modern environmental regulations (RoHS, REACH, Halogen-Free) is a significant advantage.
• Robustness: The datasheet emphasizes reliable and robust construction, suggesting good mechanical and thermal endurance.

10. Frequently Asked Questions (Based on Technical Parameters)

Q1: What resistor value should I use with a 5V supply to achieve 20mA?
A1: Using Ohm's Law: R = (V_supply - VF) / IF. With V_supply=5V, VF(typ)=2.0V, IF=0.02A, R = (5-2)/0.02 = 150 Ω. Use a standard 150 Ω resistor. Always calculate for worst-case VF(min) to ensure current does not exceed limits.

Q2: Can I drive this LED with a 3.3V supply?
A2: Yes. Using the same calculation: R = (3.3-2.0)/0.02 = 65 Ω. A 68 Ω standard resistor would be appropriate. Ensure the supply can provide the required current.

Q3: Why does the light output decrease at high temperatures?
A3: This is a fundamental characteristic of semiconductor LEDs. Increased temperature raises the non-radiative recombination rate inside the chip, reducing the internal quantum efficiency (IQE), thus lowering light output.

Q4: What is the difference between Peak Wavelength and Dominant Wavelength?
A4: Peak Wavelength (λp) is the physical peak of the emitted spectrum. Dominant Wavelength (λd) is the single wavelength of monochromatic light that would match the color perception of the LED's light. For a saturated color like this red, they are close but not identical.

11. Practical Use Case Example

Scenario: Designing a status indicator panel for a network router.
The LED (264-7SURD/S530-A3) is selected for its bright red output and reliability. Four LEDs are used to indicate Power, Internet, Wi-Fi, and Ethernet activity.
Design Steps:
1. PCB Layout: Place LEDs according to the mechanical drawing, ensuring 3mm clearance from solder pads to any lens cutout in the panel.
2. Circuit Design: Using a 3.3V system rail, calculate series resistor: R = (3.3V - 2.0V) / 0.02A = 65Ω. Select 68Ω, 1/8W resistors. The power dissipation in the resistor is I^2*R = (0.02^2)*68 = 0.0272W, well within rating.
3. Thermal Consideration: The panel is vented, and LEDs are spaced apart. Estimated operating ambient is 45°C. Referencing the \"Relative Intensity vs. Ambient Temp\" curve, output will be slightly reduced but acceptable.
4. Assembly: Follow the wave soldering profile specified. After assembly, perform a visual inspection and functional test.

12. Principle Introduction

This LED operates on the principle of electroluminescence in a semiconductor p-n junction. The active region is composed of Aluminum Gallium Indium Phosphide (AlGaInP). When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn defines the wavelength (color) of the emitted light—in this case, in the red spectrum (~624-632 nm). The red diffused epoxy resin package serves to protect the semiconductor chip, act as a primary lens to shape the light output, and diffuse the light to create a uniform appearance.

13. Development Trends

The evolution of indicator LEDs like this one follows several industry trends:

• Increased Efficiency: Ongoing material science and epitaxial growth improvements aim to produce more light (lumens) per unit of electrical input power (watts), reducing energy consumption.
• Miniaturization: While through-hole packages remain popular for robustness, there is a parallel trend towards smaller surface-mount device (SMD) packages for high-density PCB designs.
• Enhanced Reliability and Lifetime: Improvements in packaging materials, die attach techniques, and phosphor technology (for white LEDs) continue to push rated lifetimes longer, even under higher operating temperatures.
• Color Consistency and Binning: Tighter binning tolerances for dominant wavelength, luminous flux, and forward voltage are becoming standard, enabling better color matching in multi-LED applications without manual sorting.
• Integration: Trends include integrating current-limiting resistors or control ICs within the LED package to simplify circuit design.