Reverse Mount SMD LED Orange 611nm - EIA Package - 30mA - 75mW - English Datasheet

1. Product Overview

This document details the specifications for a high-brightness, reverse mount Surface Mount Device (SMD) Light Emitting Diode (LED). The device utilizes an Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor chip, which is renowned for its efficiency and performance in the orange-red wavelength spectrum. The LED is housed in a standard EIA-compliant package with a water-clear lens, designed for applications requiring reliable and consistent orange illumination. Its primary design advantages include compatibility with automated pick-and-place assembly systems and suitability for high-temperature infrared (IR) reflow soldering processes, making it ideal for modern, volume electronics manufacturing.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The device's operational limits are defined under an ambient temperature (Ta) of 25°C. Exceeding these ratings may cause permanent damage.

• Power Dissipation (Pd): 75 mW. This is the maximum amount of power the device can safely dissipate as heat.
• Peak Forward Current (I_FP): 80 mA. This current is permissible only under pulsed conditions, specifically at a 1/10 duty cycle with a 0.1ms pulse width, allowing for brief high-intensity flashes.
• Continuous Forward Current (I_F): 30 mA. This is the maximum recommended current for continuous DC operation, which defines the standard operating point for luminous intensity measurements.
• Reverse Voltage (V_R): 5 V. Applying a reverse voltage beyond this limit can break down the LED's PN junction.
• Operating & Storage Temperature Range: -55°C to +85°C. The device is rated for industrial-grade temperature resilience.
• IR Reflow Soldering Peak Temperature: 260°C for a maximum of 10 seconds, compliant with lead-free (Pb-free) assembly requirements.

2.2 Electro-Optical Characteristics

Key performance parameters are measured at Ta=25°C with a forward current (I_F) of 20 mA, unless otherwise stated.

• Luminous Intensity (I_V): Ranges from a minimum of 45.0 mcd to a typical value of 90.0 mcd. Intensity is measured using a sensor filtered to match the photopic (CIE) human eye response curve.
• Viewing Angle (2θ_1/2): 130 degrees. This wide viewing angle, defined as the full angle where intensity drops to half its axial value, indicates a Lambertian or near-Lambertian emission pattern suitable for area lighting or indicators requiring wide visibility.
• Peak Wavelength (λ_P): 611 nm. This is the wavelength at which the spectral power distribution reaches its maximum.
• Dominant Wavelength (λ_d): 605 nm. Derived from CIE chromaticity coordinates, this single wavelength best represents the perceived color (orange) of the LED.
• Spectral Bandwidth (Δλ): 17 nm. This narrow bandwidth is characteristic of AlInGaP technology, providing saturated color purity.
• Forward Voltage (V_F): Typically 2.4 V, with a maximum of 2.4 V at I_F=20mA. Designers must account for this voltage drop when calculating series current-limiting resistors.
• Reverse Current (I_R): Maximum 10 μA at V_R=5V, indicating good junction quality.
• Capacitance (C): 40 pF at 0V bias and 1 MHz. This parameter is relevant for high-frequency switching or multiplexing applications.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on luminous intensity measured at 20mA.

• Bin Code P: 45.0 – 71.0 mcd
• Bin Code Q: 71.0 – 112.0 mcd
• Bin Code R: 112.0 – 180.0 mcd
• Bin Code S: 180.0 – 280.0 mcd

A tolerance of +/-15% is applied within each intensity bin. The datasheet does not specify separate wavelength or forward voltage bins for this part number, suggesting tight control on those parameters or a single-bin offering.

4. Performance Curve Analysis

While specific graphical curves are referenced but not displayed in the provided text, typical relationships for such LEDs can be inferred and are critical for design:

• I-V (Current-Voltage) Curve: Exhibits the standard exponential diode characteristic. The forward voltage has a negative temperature coefficient, meaning V_F decreases slightly as junction temperature rises.
• Luminous Intensity vs. Forward Current: Intensity is approximately proportional to forward current in the normal operating range but will saturate at very high currents due to thermal and efficiency droop.
• Luminous Intensity vs. Ambient Temperature: For AlInGaP LEDs, luminous intensity typically decreases as ambient (and junction) temperature increases. This thermal derating must be considered in high-temperature environments.
• Spectral Distribution: A narrow, Gaussian-like curve centered around 611 nm (peak) with a 17 nm half-width, confirming its monochromatic orange output.

5. Mechanical and Package Information

5.1 Package Dimensions and Polarity

The LED conforms to a standard EIA package outline. Key dimensional notes include:

• All dimensions are provided in millimeters, with a general tolerance of ±0.10 mm unless specified otherwise.
• The "reverse mount" designation typically indicates that the LED is mounted with its primary light-emitting surface facing the printed circuit board (PCB), with light exiting through an aperture or being reflected. The exact mechanical drawing would clarify the lens orientation relative to the pads.
• Polarity is indicated on the device package (e.g., a cathode mark, notch, or dot) and must be correctly aligned with the PCB footprint.

5.2 Recommended Solder Pad Design

A suggested solder pad land pattern is provided to ensure proper soldering, mechanical stability, and thermal relief during reflow. Following this footprint is crucial to prevent tombstoning (component standing up) or poor solder joint formation.

6. Assembly and Handling Guidelines

6.1 Soldering Process

The device is fully compatible with infrared (IR) reflow soldering processes using lead-free (Pb-free) solder. A suggested reflow profile is provided, adhering to JEDEC standards.

• Preheat: 150–200°C for a maximum of 120 seconds to gradually heat the board and activate flux.
• Peak Temperature: Maximum 260°C. The device must not exceed this temperature.
• Time Above Liquidus: The profile should limit the time the device spends above the solder's melting point to what is necessary for a reliable joint, typically around 10 seconds maximum at peak temperature.
• Soldering Iron: If hand soldering is necessary for repair, a maximum tip temperature of 300°C with a contact time of 3 seconds or less is recommended, and only once.

6.2 Cleaning

If post-solder cleaning is required, only specified solvents should be used. Recommended agents are ethyl alcohol or isopropyl alcohol at room temperature, with an immersion time of less than one minute. Unspecified chemicals may damage the epoxy lens or package.

6.3 Storage and Moisture Sensitivity

The LEDs are moisture-sensitive (MSL 2a).

• Sealed Bag: Store at ≤30°C and ≤90% RH. Shelf life is one year when the original moisture-barrier bag with desiccant is unopened.
• Opened Bag: After opening, the storage environment should not exceed 30°C / 60% RH. Components should be subjected to IR reflow within 672 hours (28 days).
• Extended Exposure: For storage beyond 672 hours out of the original bag, bake at approximately 60°C for at least 20 hours before soldering to remove absorbed moisture and prevent "popcorning" (package cracking during reflow).

6.4 Electrostatic Discharge (ESD) Precautions

LEDs are susceptible to damage from electrostatic discharge. Handling precautions include using grounded wrist straps, anti-static gloves, and ensuring all equipment and work surfaces are properly grounded.

7. Packaging and Ordering

• Tape and Reel: The devices are supplied on 8mm wide embossed carrier tape wound onto 7-inch (178mm) diameter reels.
• Quantity per Reel: 3000 pieces.
• Minimum Order Quantity (MOQ): 500 pieces for remainder quantities.
• Packaging Standards: Complies with ANSI/EIA-481 specifications. The tape has a cover seal, and a maximum of two consecutive empty pockets is allowed.

8. Application Notes and Design Considerations

8.1 Typical Application Scenarios

This orange LED is suitable for a wide range of indicator and illumination applications, including but not limited to:

• Status indicators on consumer electronics, industrial control panels, and networking equipment.
• Backlighting for legends on switches, keypads, or membrane panels.
• Automotive interior lighting (non-critical).
• Signage and decorative lighting where orange color is required.

Important Notice: The device is intended for standard electronic equipment. Applications requiring exceptional reliability where failure could risk life or health (e.g., aviation, medical life-support, transportation safety systems) require prior consultation and qualification.

8.2 Drive Circuit Design

An LED is a current-driven device. A series current-limiting resistor is mandatory when driving from a voltage source to set the desired operating current and prevent thermal runaway. The resistor value (R_s) can be calculated using Ohm's Law: R_s = (V_supply - V_F) / I_F. For stable operation over temperature, constant current drivers are recommended, especially for designs operating near maximum ratings or in varying thermal environments.

8.3 Thermal Management

While the package is small, managing the 75mW maximum power dissipation is important for longevity and maintaining light output. Adequate copper area on the PCB connected to the thermal pads (if any) or the LED's solder joints helps conduct heat away from the junction. Operating at lower currents than the maximum 30mA significantly reduces power dissipation and junction temperature, extending operational life.

9. Technical Comparison and Differentiation

Key advantages of this specific LED platform include:

• Reverse Mount Capability: Offers design flexibility for creating specific optical effects or achieving a low-profile installation where the light source is hidden.
• AlInGaP Technology: Provides higher efficiency and better temperature stability for orange/red colors compared to older technologies like GaAsP.
• Wide Viewing Angle (130°): Delivers broad, even illumination ideal for panel indicators.
• Robust Assembly Compatibility: Certified for automated placement and standard lead-free IR reflow profiles, reducing manufacturing complexity and cost.

10. Frequently Asked Questions (FAQ)

Q1: What is the difference between peak wavelength (611nm) and dominant wavelength (605nm)?
A1: Peak wavelength is the physical peak of the light spectrum emitted. Dominant wavelength is a calculated value based on human color perception (CIE chart) that best matches the perceived hue. For monochromatic LEDs like this, they are close but not identical.

Q2: Can I drive this LED at 30mA continuously?
A2: Yes, 30mA is the maximum continuous DC forward current rating. However, for optimal lifetime and reliability, driving at a lower current (e.g., 20mA) is often recommended, as it reduces junction temperature and stress.

Q3: Why is there a binning system for luminous intensity?
A3: Manufacturing variations cause slight differences in light output. Binning sorts LEDs into groups with similar performance, allowing designers to select a bin that meets their brightness requirements and ensures consistency across multiple units in a product.

Q4: How critical is the 672-hour floor life after opening the bag?
A4: It is very important for reliable soldering. Exceeding this exposure time without a bake cycle can lead to absorbed moisture vaporizing during reflow, potentially causing internal delamination or cracks in the LED package.

11. Design and Usage Case Study

Scenario: Designing a Status Indicator Panel for an Industrial Router.
A designer needs multiple orange "Activity" LEDs on a front panel. They choose this LED for its brightness, wide viewing angle, and compatibility with automated assembly. The design uses a 3.3V supply rail. Targeting a standard operating current of 20mA, the series resistor is calculated: R = (3.3V - 2.4V) / 0.020A = 45 Ohms. A standard 47-ohm resistor is selected. The PCB layout uses the recommended solder pad footprint and includes a small thermal relief connection to a ground plane for heat dissipation. The LEDs are specified from Bin Code Q (71-112 mcd) to ensure adequate and uniform brightness. The assembled boards pass through a standard lead-free reflow oven using the JEDEC-compliant profile, resulting in reliable solder joints with no thermal damage to the components.

12. Technology Principle Introduction

This LED is based on Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material grown on a substrate. When a forward voltage is applied across the PN junction, electrons and holes recombine in the active region, releasing energy in the form of photons—a process called electroluminescence. The specific ratio of aluminum, indium, and gallium in the crystal lattice determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, orange (~605-611 nm). The water-clear epoxy lens encapsulates the chip, providing mechanical protection, shaping the light output beam (130° viewing angle), and enhancing light extraction efficiency.

13. Industry Trends and Developments

The trend in SMD indicator LEDs continues towards higher efficiency (more light output per unit of electrical input), improved color consistency through tighter binning, and enhanced reliability under higher temperature soldering and operating conditions. There is also a drive for miniaturization while maintaining or increasing optical performance. Furthermore, integration with onboard electronics (like built-in current limiting resistors or driver ICs) in more advanced packages is becoming more common for simplified design. The use of AlInGaP for orange/red/amber colors remains the dominant high-performance technology, though ongoing research into novel materials like perovskites may offer future alternatives.