Table of Contents
- 1. Product Overview
- 2. In-Depth Technical Parameter Analysis
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics
- 3. Performance Curve Analysis
- 4. Mechanical and Package Information
- 4.1 Package Dimensions
- 4.2 Polarity Identification
- 5. Soldering and Assembly Guidelines
- 6. Packaging and Ordering Information
- 7. Application Suggestions
- 7.1 Typical Application Scenarios
- 7.2 Design Considerations
- 8. Technical Comparison and Differentiation
- 9. Frequently Asked Questions (Based on Technical Parameters)
- 10. Practical Design and Usage Examples
- 11. Operating Principle Introduction
- 12. Industry Trends and Developments
1. Product Overview
The PD438C is a high-speed, highly sensitive silicon PIN photodiode housed in a cylindrical side-view plastic package. Its primary function is to convert incident light, particularly in the infrared spectrum, into an electrical current. A key feature of this component is that the epoxy package itself acts as an integrated infrared (IR) filter, which is spectrally matched to common IR emitters. This design simplifies system integration by reducing the need for external filtering. The device is characterized by fast response times, high photosensitivity, and a small junction capacitance, making it suitable for applications requiring quick and accurate light detection.
2. In-Depth Technical Parameter Analysis
2.1 Absolute Maximum Ratings
The device is designed to operate reliably within the following absolute limits, beyond which permanent damage may occur. The maximum reverse voltage (VR) is 32V. The power dissipation (Pd) must not exceed 150 mW. The operational temperature range (Topr) is from -40°C to +85°C, while the storage temperature (Tstg) extends from -40°C to +100°C. For assembly, the soldering temperature (Tsol) should be kept at 260°C for a duration not exceeding 5 seconds to prevent thermal damage to the package and semiconductor die.
2.2 Electro-Optical Characteristics
Under standard test conditions (Ta=25°C), the PD438C exhibits the following key performance parameters. Its spectral response bandwidth (λ0.5) ranges from 400 nm to 1100 nm, with a peak sensitivity wavelength (λp) typically at 940 nm, aligning it perfectly with common infrared light sources. When illuminated with an irradiance of 5 mW/cm² at 940 nm, the typical open-circuit voltage (VOC) is 0.35V. The short-circuit current (ISC) is typically 18 µA under 1 mW/cm² at 940 nm. Under a reverse bias of 5V and the same irradiance, the reverse light current (IL) is typically 18 µA (min. 10.2 µA). The dark current (Id), which is the leakage current in the absence of light, is typically 5 nA (max. 30 nA) at a reverse voltage of 10V. The total terminal capacitance (Ct) is typically 25 pF at 3V reverse bias and 1 MHz. The rise and fall times (tr/tf) are both typically 50 ns when operating with a 10V reverse bias and a 1 kΩ load resistor.
3. Performance Curve Analysis
The datasheet provides several characteristic curves that are crucial for design engineers. The Spectral Sensitivity curve shows the relative responsivity of the photodiode across its operational wavelength range, confirming the peak at 940 nm. The Power Dissipation vs. Ambient Temperature graph illustrates the derating of the maximum allowable power as the operating temperature increases, which is essential for thermal management. The Dark Current vs. Ambient Temperature curve demonstrates how the leakage current increases with temperature, a critical factor for low-light or high-temperature applications. The Reverse Light Current vs. Irradiance (Ee) plot shows the linear relationship between incident light power and the generated photocurrent, confirming the device's predictable response. The Terminal Capacitance vs. Reverse Voltage curve indicates how the junction capacitance decreases with increasing reverse bias, which directly impacts the device's speed. Finally, the Response Time vs. Load Resistance graph shows how the rise/fall time is affected by the external load, guiding the selection of an appropriate load resistor for speed-critical circuits.
4. Mechanical and Package Information
4.1 Package Dimensions
The PD438C is packaged in a cylindrical side-view format with a nominal diameter of 4.8mm. The detailed mechanical drawing specifies all critical dimensions including lead spacing, package height, and lens geometry. The drawing notes that dimensional tolerances are typically ±0.25mm unless otherwise specified. The side-view configuration is particularly useful for applications where the light path is parallel to the mounting surface, such as in slot sensors or edge detection systems.
4.2 Polarity Identification
The device is a two-terminal component. The cathode is typically identified by a longer lead, a notch, or a flat spot on the package body. Correct polarity connection is essential when applying reverse bias for optimal performance in photoconductive mode.
5. Soldering and Assembly Guidelines
The component is rated for soldering at a peak temperature of 260°C. It is critical that the time above the liquidus temperature (typically around 217°C for lead-free solder) is limited to a maximum of 5 seconds to prevent excessive thermal stress on the epoxy package and the internal wire bonds. Standard reflow or wave soldering profiles for lead-free assemblies are generally applicable. Care should be taken to avoid mechanical stress on the leads during handling and placement.
6. Packaging and Ordering Information
The standard packing specification is 500 pieces per bag. Six bags are combined into one inner carton, and ten inner cartons constitute one master shipping carton, resulting in a total of 30,000 pieces per master carton. The product label includes fields for the customer's part number (CPN), the manufacturer's part number (P/N), packing quantity (QTY), and lot traceability information (LOT No.).
7. Application Suggestions
7.1 Typical Application Scenarios
The PD438C is well-suited for a variety of optoelectronic applications. Its high speed makes it ideal for high-speed photo detection in data communication links or pulse sensing. It is commonly used in consumer electronics such as cameras and camcorders (VCRs, video cameras) for autofocus systems, light metering, or tape-end detection. It serves as a reliable sensor in optoelectronic switches and interrupters for position sensing, object detection, and rotary encoder systems. The integrated IR filter makes it particularly effective in systems paired with 940 nm IR LEDs, filtering out unwanted visible light.
7.2 Design Considerations
When designing a circuit with the PD438C, several factors must be considered. For speed optimization, operate the photodiode with a sufficient reverse bias (e.g., 5V-10V) to minimize junction capacitance and use a low-value load resistor, as shown in the response time vs. load resistance curve, though this trades off with output voltage swing. A transimpedance amplifier (TIA) configuration is often preferred for converting the small photocurrent into a usable voltage while maintaining bandwidth. For noise-sensitive applications, the dark current specification and its temperature dependence are critical; cooling the device or using synchronous detection techniques may be necessary. The linearity of the photocurrent with irradiance simplifies optical power measurement designs. Ensure the optical aperture and alignment are correct for the side-view package orientation.
8. Technical Comparison and Differentiation
Compared to standard photodiodes without a lens or filter, the PD438C offers a distinct advantage due to its integrated semi-lens and IR-filtering epoxy. This eliminates the need for a separate optical filter, reducing component count, assembly complexity, and cost. The side-view package is a specific form factor that solves integration challenges in space-constrained designs where top-view sensors cannot be used. Its combination of relatively high speed (50 ns) and good sensitivity (18 µA at 1 mW/cm²) offers a balanced performance profile for many mid-range applications, positioning it between very high-speed, low-sensitivity devices and slower, high-sensitivity photodiodes.
9. Frequently Asked Questions (Based on Technical Parameters)
Q: What is the purpose of the "semi-lens"?
A: The semi-lens helps to focus incoming light onto the active area of the silicon chip, increasing the effective collection area and thus the responsivity (sensitivity) of the device compared to a flat window.
Q: Why is the peak sensitivity at 940 nm?
A: Silicon's inherent absorption properties peak in the near-infrared region. 940 nm is a very common wavelength for infrared emitters (LEDs), as it is invisible to the human eye and readily available. The epoxy is tuned to match this.
Q: Should I use this photodiode in photovoltaic (zero bias) or photoconductive (reverse bias) mode?
A: For highest speed and linearity, photoconductive mode (applying a reverse bias, e.g., 5V) is recommended. It reduces junction capacitance and widens the depletion region. Photovoltaic mode (zero bias) offers lower noise (no dark current) but is slower.
Q: How does temperature affect performance?
A: As shown in the curves, dark current increases significantly with temperature, which can be a source of noise. The photocurrent itself also has a slight temperature coefficient. For stable operation, temperature compensation or a controlled environment may be necessary in precision applications.
10. Practical Design and Usage Examples
Example 1: Infrared Proximity Sensor: An IR LED pulses at 940 nm. The reflected light is detected by the PD438C. The side-view package allows both emitter and detector to be placed on the same PCB, facing the same direction. The integrated IR filter in the PD438C helps reject ambient visible light, improving the signal-to-noise ratio of the reflected IR signal. A microcontroller measures the photodiode's current via a TIA to determine object presence or distance.
Example 2: Slotted Optical Switch: The PD438C is mounted on one side of a U-shaped bracket, facing an IR LED on the other side. An object passing through the slot interrupts the beam. The fast response time (50 ns) allows for detecting very high-speed events or encoding rapid motion.
11. Operating Principle Introduction
A PIN photodiode is a semiconductor device with a wide, lightly doped intrinsic (I) region sandwiched between a P-type and an N-type region. When photons with energy greater than the semiconductor's bandgap (for silicon, wavelengths shorter than ~1100 nm) strike the device, they generate electron-hole pairs in the intrinsic region. Under the influence of the built-in electric field (in photovoltaic mode) or an applied reverse bias (in photoconductive mode), these charge carriers are swept apart, creating a measurable photocurrent that is proportional to the incident light intensity. The wide intrinsic region allows for a larger depletion volume, which improves quantum efficiency (sensitivity) and reduces junction capacitance, enabling higher speed operation compared to a standard PN photodiode.
12. Industry Trends and Developments
The market for photodiodes like the PD438C continues to be driven by trends in automation, consumer electronics, and communication. There is a constant push for higher speed to support faster data transmission in optical links. Improved sensitivity (lower noise, higher responsivity) allows for operation with lower-power emitters or over longer distances. Miniaturization is another key trend, leading to photodiodes in smaller surface-mount packages. Furthermore, integration is advancing, with more devices incorporating the photodiode, amplifier, and sometimes even digital logic into a single package (e.g., photodiode arrays, integrated optical sensors). The PD438C, with its integrated optical filter, represents a step in this integration trend, simplifying the bill of materials for system designers.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |