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4.8mm Semi-Lens Silicon PIN Photodiode PD438B Datasheet - 4.8mm Diameter - Black Lens - English Technical Document

Technical datasheet for the PD438B, a 4.8mm diameter, high-speed, sensitive silicon PIN photodiode in a cylindrical side-view package with a black IR-filtering epoxy lens.
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PDF Document Cover - 4.8mm Semi-Lens Silicon PIN Photodiode PD438B Datasheet - 4.8mm Diameter - Black Lens - English Technical Document

1. Product Overview

The PD438B is a high-performance silicon PIN photodiode designed for applications requiring fast response and high sensitivity to infrared light. It is housed in a compact, cylindrical side-view plastic package with a diameter of 4.8mm. A key feature of this device is its epoxy package, which is formulated to act as an integrated infrared (IR) filter. This built-in filter is spectrally matched to common IR emitters, enhancing signal-to-noise ratio by selectively passing the target IR wavelength while attenuating unwanted visible light.

The core advantages of the PD438B include its fast response times, high photosensitivity, and small junction capacitance, making it suitable for high-speed detection circuits. The device is constructed using lead-free (Pb-free) materials and complies with relevant environmental regulations such as RoHS and EU REACH, ensuring its suitability for modern electronic manufacturing.

The primary target markets and applications for this photodiode are in consumer electronics and industrial sensing. It is ideally suited for use as a high-speed photo detector in systems like cameras, VCRs, and video cameras. Its characteristics also make it a reliable component in various optoelectronic switches and sensing modules where precise detection of IR signals is critical.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The device is designed to operate reliably within specified environmental and electrical limits. Exceeding these Absolute Maximum Ratings may cause permanent damage.

2.2 Electro-Optical Characteristics

These parameters, measured at a standard temperature of 25°C, define the core photodetection performance of the PD438B.

Tolerances for key parameters are specified: Luminous Intensity (±10%), Dominant Wavelength (±1nm), and Forward Voltage (±0.1V), ensuring consistency in production batches.

3. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate how key parameters vary with operating conditions. These are essential for circuit designers.

3.1 Spectral Sensitivity

The spectral response curve shows the relative sensitivity of the photodiode across different wavelengths. It will peak sharply around 940 nm due to the integrated IR-filtering epoxy, with significantly reduced sensitivity in the visible spectrum (400-700 nm). This curve is critical for ensuring the detector is matched to the emitter's wavelength.

3.2 Dark Current vs. Ambient Temperature

This curve typically shows an exponential increase in dark current (Id) as the ambient temperature rises. Designers must account for this increased noise floor in high-temperature applications or when detecting very low-light signals.

3.3 Reverse Light Current vs. Irradiance (Ee)

This graph demonstrates the linear relationship between the incident light power (irradiance) and the generated photocurrent (IL) when the diode is reverse-biased. The linearity is a key feature of PIN photodiodes, making them suitable for light measurement applications.

3.4 Terminal Capacitance vs. Reverse Voltage

The junction capacitance (Ct) decreases as the reverse bias voltage (VR) increases. This curve allows designers to select an operating bias voltage that optimizes the trade-off between speed (lower capacitance at higher voltage) and power consumption/heat.

3.5 Response Time vs. Load Resistance

The rise/fall time (tr/tf) is influenced by the RC time constant formed by the photodiode's junction capacitance and the external load resistance (RL). This curve shows how response time increases with larger load resistors, guiding the selection of RL for desired speed in transimpedance amplifier circuits.

3.6 Power Dissipation vs. Ambient Temperature

This derating curve indicates the maximum allowable power dissipation as a function of the ambient temperature. As temperature increases, the maximum safe power the device can handle decreases linearly, which is vital for thermal management in the system design.

4. Mechanical and Package Information

4.1 Package Dimensions

The PD438B is housed in a cylindrical side-view package with a nominal diameter of 4.8mm. The detailed mechanical drawing in the datasheet provides all critical dimensions including body diameter, length, lead spacing, and lead diameter. A standard tolerance of ±0.25mm applies to all package dimensions unless otherwise specified. The side-view configuration is designed for applications where the light path is parallel to the PCB surface.

4.2 Polarity Identification

The photodiode is a polarized component. The cathode is typically identified by a longer lead, a flat spot on the package, or a specific marking. The datasheet's package diagram clearly indicates the anode and cathode connections, which must be observed during assembly to ensure correct biasing (reverse bias for normal operation).

5. Soldering and Assembly Guidelines

To maintain reliability and prevent damage during the assembly process, specific soldering conditions must be followed.

6. Packaging and Ordering Information

6.1 Packing Specification

The standard packing flow for the PD438B is as follows: 500 pieces are packaged in one anti-static bag. Six of these bags are then placed into one inner carton. Finally, ten inner cartons are packed into one master shipping (outside) carton, resulting in a total of 30,000 pieces per master carton.

6.2 Label Specification

The label on the packaging contains several key identifiers:

This labeling ensures traceability and correct material handling throughout the supply chain.

7. Application Notes and Design Considerations

7.1 Typical Application Circuits

The PD438B is most commonly used in one of two circuit configurations:

  1. Photovoltaic Mode (Zero Bias): The photodiode is connected directly to a high-impedance load (like an op-amp input). This mode offers minimal dark current and noise but has slower response and lower linearity. It's suitable for low-speed, precision light measurement.
  2. Photoconductive Mode (Reverse Bias): The photodiode is connected with the cathode to a positive voltage and the anode to a virtual ground (e.g., the inverting input of a transimpedance amplifier). This is the recommended mode for the PD438B to leverage its high-speed capabilities. Reverse bias reduces junction capacitance (increasing speed) and improves linearity. The value of the feedback resistor in the transimpedance amplifier sets the gain (Vout = Iphoto * Rfeedback).

7.2 Design Considerations

8. Technical Comparison and Differentiation

The PD438B differentiates itself in the market through several key features:

Compared to larger photodiodes, it offers a smaller footprint. Compared to unfiltered photodiodes, it provides superior rejection of ambient visible light noise.

9. Frequently Asked Questions (FAQ)

Q1: What is the purpose of the black epoxy lens?
A1: The black epoxy is not just for appearance; it is formulated to be an effective infrared filter. It transmits the target IR wavelength (peaking at 940 nm) while absorbing much of the visible light, significantly reducing interference from ambient light sources like room lighting.

Q2: Should I operate the PD438B with or without a reverse bias voltage?
A2: For high-speed operation (as indicated by its 50 ns rise time), it is strongly recommended to operate the PD438B in photoconductive mode with a reverse bias, typically between 5V and 10V. This reduces junction capacitance and improves linearity and speed.

Q3: How do I convert the photocurrent into a usable voltage signal?
A3: The most common and effective method is to use a transimpedance amplifier (TIA) circuit. The photodiode connects between the inverting input and the output of an op-amp, with a feedback resistor determining the gain (Vout = -Iphoto * Rf). A small feedback capacitor is often added in parallel with the resistor to stabilize the circuit and limit bandwidth.

Q4: What is the significance of the "Dark Current" parameter?
A4: Dark current is the small current that flows through the photodiode when it is in complete darkness and under reverse bias. It acts as a noise source. A lower dark current (5 nA typical for the PD438B) means the device can detect weaker light signals without the signal being masked by its own noise.

Q5: Can this photodiode be used for visible light detection?
A5: While its spectral range starts at 400 nm (violet), its sensitivity in the visible spectrum is greatly attenuated by the IR-filtering epoxy lens. Its peak sensitivity is firmly in the infrared at 940 nm. For primary visible light detection, a photodiode without an IR-filtering package would be more appropriate.

10. Operational Principles

A PIN photodiode is a semiconductor device with a wide, lightly doped intrinsic (I) region sandwiched between a P-type and an N-type region. When photons with energy greater than the semiconductor's bandgap strike the device, they create electron-hole pairs in the intrinsic region. Under the influence of an external reverse bias electric field, these charge carriers are swept apart, generating a photocurrent that is proportional to the incident light intensity. The wide intrinsic region allows for several advantages: it creates a larger depletion region for photon absorption (increasing sensitivity), reduces junction capacitance (increasing speed), and allows operation at higher reverse voltages. The PD438B utilizes silicon, which has a bandgap suitable for detecting light from the visible to the near-infrared spectrum.

11. Disclaimer and Usage Notes

The information contained in this technical document is subject to change without notice. The graphs and typical values provided are for design guidance and do not represent guaranteed specifications. When implementing this component, designers must strictly adhere to the Absolute Maximum Ratings to prevent device failure. The manufacturer assumes no liability for any damage resulting from the use of this product outside its specified operating conditions. This product is not intended for use in safety-critical, life-supporting, military, automotive, or aerospace applications without prior consultation and specific qualification.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.