Table of Contents
- 1. Product Overview
- 1.1 Core Advantages and Target Market
- 2. In-Depth Technical Parameter Analysis
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics
- 3. Performance Curve Analysis
- 3.1 Spectrum Distribution
- 3.2 Forward Current vs. Forward Voltage (I-V Curve)
- 3.3 Forward Current Derating Curve
- 4. Mechanical & Packaging Information
- 4.1 Package Dimensions
- 4.2 Internal Circuit Diagram and Polarity
- 5. Soldering & Assembly Guidelines
- 6. Packaging & Ordering Information
- 6.1 Packing Specifications
- 6.2 Label Explanation
- 7. Application Design Considerations
- 7.1 Driving Circuit Design
- 7.2 Design for Reliability
- 8. Technical Comparison & Differentiation
- 9. Frequently Asked Questions (Based on Technical Parameters)
- 10. Practical Design Case Study
- 11. Operating Principle
- 12. Technology Trends
1. Product Overview
The ELT-512SYGWA/S530-E2 is a high-reliability, seven-segment alphanumeric display designed for clear digital readouts in various electronic applications. It belongs to the category of through-hole displays, featuring a standard industrial footprint for easy integration into existing PCB designs. The core value proposition of this component lies in its combination of good visibility, standardized packaging, and compliance with modern environmental regulations.
The device is constructed with a gray surface and white, diffused segments. This specific design enhances contrast and readability, particularly in environments with bright ambient light, making it suitable for applications where display clarity is paramount. The emitted color is a brilliant yellow-green, achieved through the use of AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. This material choice is known for its efficiency and specific color output in the yellow-green spectrum.
1.1 Core Advantages and Target Market
The primary advantages of this display module include its low power consumption, which is critical for battery-operated or energy-efficient devices. It is categorized for luminous intensity, allowing designers to select components with consistent brightness levels for uniform panel appearance. Furthermore, the device is Pb-free and RoHS compliant, meeting international standards for the restriction of hazardous substances, which is essential for modern electronics manufacturing.
The target applications are clearly oriented towards functional, industrial, and consumer interfaces. Key markets include:
- Home Appliances: Timers, temperature displays, control panel readouts on ovens, microwaves, washing machines, etc.
- Instrument Panels: Test and measurement equipment, industrial control systems, automotive diagnostic tools (secondary displays).
- Digital Readout Displays: Any device requiring numeric or limited alphanumeric output, such as clocks, counters, scales, and simple data loggers.
2. In-Depth Technical Parameter Analysis
This section provides a detailed, objective interpretation of the electrical, optical, and thermal parameters specified in the datasheet. Understanding these limits and characteristics is crucial for reliable circuit design.
2.1 Absolute Maximum Ratings
The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.
- Reverse Voltage (VR): 5V. Exceeding this voltage in reverse bias can cause junction breakdown.
- Forward Current (IF): 25 mA DC. This is the maximum continuous current allowed through one segment.
- Peak Forward Current (IFP): 60 mA. This higher current is permissible only under pulsed conditions (duty cycle ≤ 10%, frequency ≤ 1 kHz), which can be used for multiplexing or brief intensity boosting.
- Power Dissipation (Pd): 60 mW. This is the maximum power that can be safely dissipated as heat, typically calculated as VF * IF.
- Operating & Storage Temperature: -40°C to +85°C (operating), -40°C to +100°C (storage). The wide range ensures functionality in harsh environments.
- Soldering Temperature: 260°C for ≤ 5 seconds. This guides wave or hand soldering processes.
2.2 Electro-Optical Characteristics
These parameters are measured under standard test conditions (Ta=25°C) and define the device's performance.
- Luminous Intensity (Iv): 2.8 mcd (Min), 4.5 mcd (Typ) at IF=10mA. This is the average light output per segment. The datasheet notes a ±10% tolerance on this value. The categorization mentioned in the features refers to sorting devices based on measured Iv into consistent bins.
- Peak Wavelength (λp): 575 nm (Typ). This is the wavelength at which the spectral emission is strongest.
- Dominant Wavelength (λd): 573 nm (Typ). This is the wavelength perceived by the human eye, defining the color (yellow-green).
- Spectral Bandwidth (Δλ): 20 nm (Typ). This indicates the range of wavelengths emitted, centered around the peak.
- Forward Voltage (VF): 2.0V (Typ), 2.4V (Max) at IF=20mA. Designers must ensure the driving circuit can provide at least this voltage. A ±0.1V tolerance is specified.
- Reverse Current (IR): 100 µA (Max) at VR=5V. This is the small leakage current when the device is reverse-biased.
3. Performance Curve Analysis
The datasheet provides typical characteristic curves which are essential for understanding behavior under non-standard conditions.
3.1 Spectrum Distribution
The spectrum curve (Relative Luminous Intensity vs. Wavelength) would show a bell-shaped distribution centered around 575 nm with a typical width (FWHM) of 20 nm. This confirms the yellow-green color point and allows for analysis in applications sensitive to specific wavelengths.
3.2 Forward Current vs. Forward Voltage (I-V Curve)
This curve is non-linear. For a typical AlGaInP LED, the voltage remains relatively low until the turn-on threshold (around 1.8-2.0V for this color), after which it increases more steeply with current. The specified VF of 2.0V at 20mA is a point on this curve. Designers use this to calculate series resistor values: R = (Vsupply - VF) / IF.
3.3 Forward Current Derating Curve
This critical graph shows the maximum allowable continuous forward current as a function of the ambient temperature. As temperature increases, the maximum safe current decreases linearly from 25 mA at 25°C to 0 mA at the maximum junction temperature (implied by the curve's endpoint, likely around 100-110°C). This is due to reduced heat dissipation capability at higher ambient temperatures. For reliable operation above 25°C, the driving current must be reduced accordingly.
4. Mechanical & Packaging Information
4.1 Package Dimensions
The display has a digit height of 14.22 mm (0.56 inches). The detailed dimension drawing shows a standard dual in-line package (DIP) footprint. Key mechanical notes include a standard tolerance of ±0.25mm unless otherwise specified. The pin spacing and overall dimensions are designed for compatibility with standard PCB layouts and sockets.
4.2 Internal Circuit Diagram and Polarity
The internal circuit diagram reveals a common-cathode configuration. All cathodes (negative terminals) of the seven segments (and typically the decimal point, if present) are connected internally to one or two common pins. The anode (positive terminal) of each segment is brought out to a separate pin. This configuration is common for multiplexed driving, where the common cathode is switched to ground while the desired segment anodes are driven high.
5. Soldering & Assembly Guidelines
While specific reflow profiles are not provided for this through-hole component, the datasheet gives clear limits for hand or wave soldering.
- Soldering: The maximum soldering temperature is 260°C, and the exposure time at this temperature must not exceed 5 seconds. This prevents thermal damage to the plastic package and the internal wire bonds.
- Electrostatic Discharge (ESD) Protection: The device is sensitive to ESD. The datasheet strongly recommends standard ESD control measures during handling and assembly: using grounded wrist straps, ESD-safe workstations, conductive floor mats, and proper grounding for all equipment. If insulating materials are present, ionizers or other charge-neutralizing methods should be employed.
- Storage Conditions: Devices should be stored within the specified temperature range of -40°C to +100°C in a dry, ESD-safe environment.
6. Packaging & Ordering Information
6.1 Packing Specifications
The components are packed in tubes for automated insertion or manual handling. The standard packing flow is: 13 pieces per tube → 63 tubes per box → 4 boxes per carton. This totals 3,276 pieces per carton (13 * 63 * 4).
6.2 Label Explanation
The packaging label contains several codes:
- CPN: Customer's Product Number (for customer reference).
- P/N: The manufacturer's Product Number (ELT-512SYGWA/S530-E2).
- QTY: Packing Quantity.
- CAT: Luminous Intensity Rank (the binning category).
- LOT No: Traceable Lot Number for quality control.
7. Application Design Considerations
7.1 Driving Circuit Design
To drive a single segment at the typical 20mA forward current with a 5V supply, a series current-limiting resistor is required. Using the typical VF of 2.0V: R = (5V - 2.0V) / 0.020A = 150 Ω. A standard 150Ω resistor would result in IF ≈ 20mA. The power dissipated in the resistor is (3V * 0.02A) = 60 mW, so a 1/8W (125mW) or 1/4W resistor is suitable. For multiplexing multiple digits, the peak current per segment can be higher (up to IFP=60mA) but the average current must remain within the continuous IF limit, calculated by duty cycle.
7.2 Design for Reliability
Thermal Management: Observe the current derating curve. In a high-temperature environment (e.g., inside an appliance), reduce the driving current to prevent overheating and premature aging. ESD Protection: Incorporate ESD protection diodes on PCB lines connected to the display pins, especially if the interface is exposed to user contact. Viewing Angle: The white diffused segments provide a wide viewing angle, but the exact angular intensity distribution is not specified. For critical viewing applications, prototyping is recommended.
8. Technical Comparison & Differentiation
Compared to older technologies or smaller displays, the ELT-512SYGWA/S530-E2 offers specific advantages:
- vs. Incandescent or VFD Displays: Much lower power consumption, longer lifetime, and no filament to burn out. However, it requires current regulation, not just voltage.
- vs. Smaller LED Displays (e.g., 0.3\"): Larger digit size (0.56\") offers better visibility from a distance, at the cost of a larger PCB footprint.
- vs. LCDs: LEDs are emissive and therefore easily readable in low-light conditions without a backlight, but consume more power than reflective LCDs in bright light.
- Key Differentiator: The combination of the specific yellow-green color (AlGaInP), the industrial-standard 0.56\" size, the common-cathode configuration, and RoHS compliance makes it a well-defined solution for a specific set of applications.
9. Frequently Asked Questions (Based on Technical Parameters)
Q1: Can I drive this display directly from a microcontroller pin? A: No. A typical MCU pin can source/sink only 20-25mA, which is the limit for one segment. Driving multiple segments or the common cathode (which carries the sum of currents of lit segments) would exceed the MCU's capability. Use transistor drivers or dedicated LED driver ICs.
Q2: Why is my display dimmer than expected? A: First, verify the forward current. A higher series resistor than calculated will reduce current and brightness. Second, check the luminous intensity bin (CAT code); you may have a unit from the lower end of the range (closer to 2.8 mcd). Third, ensure the forward voltage of your specific unit is not at the high end of the tolerance, which would also reduce current for a fixed resistor value.
Q3: Is heat sinking required? A: For continuous operation at the maximum IF of 25mA near room temperature, no additional heat sink is typically needed for a single digit. However, if multiple digits are packed densely or operated in a high ambient temperature, the PCB layout should allow for some heat dissipation through the copper traces connected to the pins.
10. Practical Design Case Study
Scenario: Designing a simple 4-digit timer for a kitchen appliance operating at up to 50°C ambient.
Design Steps:
- Current Selection: Consult the derating curve. At 50°C, the maximum continuous current is derated. Assuming a linear derating from 25mA@25°C to 0mA@~100°C, the allowable current at 50°C is approximately 18-20mA. We choose 15mA per segment for a safety margin and longevity.
- Resistor Calculation: Using Vsupply = 5V, VF (max) = 2.4V, IF = 15mA. R = (5 - 2.4) / 0.015 = 173 Ω. Use the next standard value, 180 Ω. Re-calculate actual current with typical VF: I = (5 - 2.0) / 180 = 16.7mA (acceptable).
- Driver Circuit: Use a microcontroller with a 4-to-16 decoder/driver IC (like a 74HC595 shift register with current-limiting resistors) or a dedicated multiplexing LED driver. The common cathode of each digit will be switched by a PNP transistor or an N-channel MOSFET capable of sinking the total current of up to 8 lit segments (8 * 16.7mA ≈ 134mA).
- PCB Layout: Place the current-limiting resistors close to the driver IC, not the display. Ensure the traces to the common cathode pins are wide enough to handle the peak cathode current.
11. Operating Principle
A seven-segment display is an assembly of light-emitting diodes (LEDs) arranged in a figure-eight pattern. Each segment (named a, b, c, d, e, f, g, and sometimes dp for decimal point) is an individual LED. By applying a forward voltage (exceeding the diode's turn-on voltage, ~2.0V here) and limiting the current with a series resistor, electrons and holes recombine in the AlGaInP semiconductor's active region, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the wavelength (color) of the emitted light, in this case, yellow-green (573-575 nm). The white diffused resin over the LED chip scatters the light, creating a uniformly lit segment appearance.
12. Technology Trends
While traditional through-hole seven-segment displays like this one remain vital for reliability and ease of service in industrial and appliance applications, the overall trend in display technology is moving towards surface-mount device (SMD) packages for higher density and automated assembly. Furthermore, for more complex information, dot-matrix OLED or TFT LCDs are increasingly common. However, for simple, bright, low-cost, and highly reliable numeric readouts, LED seven-segment displays continue to have a strong position. Future developments may include even higher efficiency materials, integrated driver circuitry within the package, and a wider range of colors and sizes in SMD formats, but the fundamental principle and application of discrete segment displays is expected to persist in specific market segments.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |