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0.28-inch Quadruple Digit Seven-Segment LED Display Datasheet - Digit Height 7mm - Super Red Color - English Technical Document

Technical datasheet for a 0.28-inch (7mm) digit height, quadruple-digit, seven-segment LED display utilizing AlInGaP super red LED chips. Includes specifications, pinout, ratings, and characteristics.
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PDF Document Cover - 0.28-inch Quadruple Digit Seven-Segment LED Display Datasheet - Digit Height 7mm - Super Red Color - English Technical Document

1. Product Overview

This document details the specifications for a 0.28-inch (7 mm) digit height, quadruple-digit, seven-segment LED display. The device is designed for applications requiring clear, bright numeric readouts with excellent visibility. It utilizes advanced AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor technology for its light-emitting elements, specifically engineered to produce a super red color output. The display features a gray face and white segments, which contributes to high contrast and superior character appearance under various lighting conditions.

The core design philosophy focuses on providing a reliable, solid-state solution with low power requirements, making it suitable for a wide range of consumer, industrial, and instrumentation products where numeric data presentation is critical.

2. Key Features and Advantages

The display incorporates several design features that enhance its performance and usability:

3. Technical Specifications Deep Dive

3.1 Electrical and Optical Characteristics

The performance of the display is defined under standard test conditions at an ambient temperature (TA) of 25°C. Key parameters include:

3.2 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation outside these limits is not advised.

4. Mechanical and Package Information

The device comes in a standard LED display package. The provided dimensional drawing specifies the exact physical footprint, including the spacing between digits, overall height, width, depth, and the position and diameter of the pins. All dimensions are provided in millimeters with a standard tolerance of ±0.25 mm unless otherwise noted. This information is critical for PCB (Printed Circuit Board) layout and mechanical integration into the end product's enclosure.

5. Pin Configuration and Internal Circuit

The display has a 16-pin configuration. It is configured as a multiplex common cathode type. This means each digit's cathode is connected separately, while the anodes for corresponding segments (e.g., all 'A' segments) are connected together across digits. This architecture allows for multiplexing, where digits are illuminated one at a time in rapid succession, reducing the total number of required driver pins and overall power consumption.

The pinout is as follows:

An internal circuit diagram typically shows the interconnection of the LED chips for each segment and digit, clarifying the multiplexed common cathode structure.

6. Binning System Explanation

The datasheet indicates that the devices are "Categorized for Luminous Intensity." This refers to a binning or sorting process based on measured light output. During manufacturing, slight variations occur. By testing and grouping units into specific intensity bins (e.g., a range of µcd values), manufacturers and designers can ensure that all displays used in a single product or production batch have very similar brightness levels. This prevents noticeable variations in display intensity between units, which is essential for product quality and user experience. Designers should specify the required bin when ordering to guarantee consistency.

7. Performance Curve Analysis

The datasheet references "Typical Electrical / Optical Characteristic Curves." While the specific graphs are not detailed in the text, such curves typically included in full datasheets are vital for design:

8. Soldering and Assembly Guidelines

Based on the Absolute Maximum Ratings, the device can withstand wave or reflow soldering processes. The key parameter specified is the solder temperature profile: 260°C for 3 seconds at a point 1/16 inch (1.6 mm) below the seating plane. This aligns with common lead-free soldering profiles. Designers and assemblers must ensure their soldering processes do not exceed this thermal stress to prevent damage to the internal wire bonds or the LED chips themselves. Standard ESD (Electrostatic Discharge) precautions should be observed during handling.

9. Application Suggestions and Design Considerations

9.1 Typical Application Scenarios

This display is well-suited for any device requiring a clear, reliable numeric readout:

9.2 Design Considerations

10. Technical Comparison and Differentiation

The primary differentiator of this display is the use of AlInGaP technology for the super red color. Compared to older technologies like standard GaAsP (Gallium Arsenide Phosphide) red LEDs, AlInGaP offers significantly higher luminous efficiency, resulting in greater brightness for the same input current, or equivalent brightness at lower power. It also generally provides better temperature stability and color purity. The gray face with white segments is a specific design choice to maximize contrast, which may offer an advantage over all-red or all-green displays in high-ambient-light conditions.

11. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the purpose of the "No Connection" pins?
A: They are physically present pins that are not electrically connected to any internal element. They may be used for mechanical stability during soldering or to fit a standard package footprint. They must not be used for electrical connections.

Q: How do I calculate the current-limiting resistor for a segment?
A: Use Ohm's Law: R = (Vsupply - VF) / IF. For a 5V supply, typical VF of 2.6V, and desired IF of 20 mA: R = (5 - 2.6) / 0.02 = 120 Ω. Always use the maximum VF from the datasheet for a conservative design to avoid overcurrent.

Q: Can I drive this display without multiplexing?
A: Direct drive (static drive) is theoretically possible by individually addressing each segment of each digit, but it would require a very high number of I/O pins (4 digits * 7 segments + decimal + indicators = over 30 pins) and is highly inefficient. Multiplexing is the intended and practical method.

Q: What does "Luminous Intensity Matching Ratio 2:1" mean?
A> It means the measured luminous intensity of any one segment or digit will not be more than twice the intensity of any other segment or digit under the same test conditions. It defines the maximum allowable variation within a device.

12. Operational Principle

A seven-segment display is composed of seven rectangular LED segments (labeled A through G) arranged in a figure '8' pattern, plus an additional circular LED for a decimal point (DP). By selectively illuminating specific combinations of these segments, all decimal digits (0-9) and some letters can be formed. In a multiplexed common cathode design like this one, all the anodes for a given segment type across all digits are connected together (e.g., all 'A' segment anodes). Each digit has its own separate cathode connection. To display a number, the microcontroller activates (sets high) the anode lines corresponding to the segments needed for that digit and simultaneously activates (sets low/sinks current) the cathode line for that specific digit. It holds this for a short period (e.g., 1-5 ms), then moves to the next digit, cycling through all digits rapidly. The human eye's persistence of vision blends these rapid pulses into a stable, seemingly continuously lit multi-digit number.

13. Industry Trends and Context

While seven-segment LED displays remain a robust, cost-effective, and highly reliable solution for numeric readouts, the industry has seen a parallel growth in alternative technologies. Dot-matrix OLED and LCD displays offer far greater flexibility for displaying alphanumeric characters, symbols, and even simple graphics. However, for applications where only numbers need to be displayed with utmost clarity, brightness, wide viewing angle, and simplicity of interface, LED seven-segment displays like this one continue to be a preferred choice. The trend within this segment is towards higher efficiency materials (like AlInGaP replacing older ones), lower operating voltages, smaller package sizes for higher density, and integrated driver circuitry to simplify design. The device described here represents a mature and optimized implementation of this enduring technology.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.