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LTF-2502KR LED Display Datasheet - 0.26-inch Digit Height - AlInGaP Super Red - 2.6V Forward Voltage - English Technical Document

Complete technical datasheet for the LTF-2502KR, a 0.26-inch five-digit seven-segment AlInGaP Super Red LED display. Includes specifications, ratings, pinout, dimensions, and application guidelines.
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PDF Document Cover - LTF-2502KR LED Display Datasheet - 0.26-inch Digit Height - AlInGaP Super Red - 2.6V Forward Voltage - English Technical Document

1. Product Overview

The LTF-2502KR is a five-digit, seven-segment alphanumeric display module. Its primary function is to provide a clear, bright numerical readout for electronic equipment. The core technology utilizes AlInGaP (Aluminum Indium Gallium Phosphide) LED chips grown on a GaAs substrate, which is known for producing high-efficiency red light. The device features a black face with white segment markings, creating a high-contrast appearance suitable for various lighting conditions. It is designed as a multiplex common anode display, meaning the anodes of each digit are connected together internally, requiring a time-division multiplexing drive scheme to illuminate each digit sequentially.

1.1 Key Features and Advantages

1.2 Device Identification

The part number LTF-2502KR specifically denotes a multiplex common anode display using AlInGaP Super Red LED chips, configured with a right-hand decimal point.

2. Technical Specifications Deep Dive

This section provides a detailed, objective analysis of the device's operational limits and performance characteristics under standard test conditions (Ta=25°C).

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

2.2 Electrical & Optical Characteristics

These are the typical performance parameters under normal operating conditions.

3. Binning System Explanation

The LTF-2502KR employs a luminous intensity binning system to ensure consistency. Devices are sorted into bins (F, G, H, J, K) based on their measured light output at a specific test current. This allows designers to select displays from the same bin to achieve uniform brightness across multiple units in an assembly, preventing noticeable hue or brightness variations. The bin ranges are defined by minimum and maximum luminous intensity values in microcandelas (µcd).

4. Performance Curve Analysis

The datasheet includes typical characteristic curves (graphical data) which are essential for detailed design analysis. These curves visually represent the relationship between key parameters, helping engineers optimize performance.

5. Mechanical & Package Information

5.1 Package Dimensions

The display conforms to a specific mechanical outline. All primary dimensions are provided in millimeters with a standard tolerance of ±0.25 mm unless otherwise specified. Key dimensional notes include a pin tip shift tolerance of ±0.4 mm and limits on visual defects such as foreign material (≤10 mil), ink contamination (≤20 mil), bubbles in segments (≤10 mil), and reflector bending (≤1% of length).

5.2 Pin Connection and Circuit Diagram

The device has a 16-pin configuration, though not all pins are active. The internal circuit diagram reveals a multiplexed common anode structure. The pinout is as follows:

This arrangement requires an external driver circuit to sequentially enable each common anode (digit) while driving the appropriate segment cathode lines to form the desired number.

6. Soldering, Assembly & Storage Guidelines

6.1 Soldering and Assembly

6.2 Storage Conditions

Proper storage is critical to prevent oxidation of the pins and maintain performance.

7. Application Recommendations

7.1 Intended Use and Design Considerations

The display is designed for ordinary electronic equipment in office, communication, and household applications. For safety-critical applications (aviation, medical, etc.), consultation with the manufacturer is required prior to use. Key design considerations include:

7.2 Typical Application Scenarios

Due to its multiplexed design, medium brightness, and clear red digits, the LTF-2502KR is well-suited for:

8. Technical Comparison & Differentiation

Compared to older technologies like standard GaAsP (Gallium Arsenide Phosphide) red LEDs, the AlInGaP technology used in the LTF-2502KR offers significant advantages:

9. Frequently Asked Questions (Based on Technical Parameters)

Q1: Why is a multiplexed drive scheme used?

A1: Multiplexing significantly reduces the number of required driver pins. A non-multiplexed 5-digit, 7-segment display would need 5x8=40 pins (including decimal). This multiplexed version requires only 5 (anodes) + 8 (cathodes) = 13 active pins, simplifying PCB design and reducing cost.

Q2: What does "common anode" mean for my driver circuit?

A2: In a common anode configuration, you supply a positive voltage (through a current-limiting element or switch) to the anode of the digit you wish to illuminate. You then sink current to ground by pulling the cathodes of the desired segments low. The driver IC must be configured to source current for the anodes.

Q3: How do I select the appropriate current-limiting resistor?

A3: Use the formula R = (Vsupply - VF) / IF. Use the maximum VF (2.6V) from the datasheet to ensure sufficient current at the lower end of the tolerance range. Choose IF based on your desired brightness, ensuring it does not exceed the continuous current rating (25 mA, derated for temperature).

Q4: Why is binning important?

A4: Manufacturing variations cause slight differences in light output between individual LEDs. Binning sorts them into groups with similar performance. Using displays from the same bin guarantees visual consistency in your product, which is critical for user perception of quality.

10. Design and Usage Case Study

Scenario: Designing a digital timer for a kitchen appliance requiring a 5-digit display (MM:SS or HH:MM format).

Design Steps:

  1. Component Selection: The LTF-2502KR is chosen for its appropriate digit size, red color for good visibility, and multiplexed interface to save microcontroller pins.
  2. Driver Circuit: A dedicated LED driver IC with multiplexing support is selected. The design uses constant current drivers set to 10 mA per segment to achieve good brightness (typ. 11700 µcd) while staying well within the 25 mA limit.
  3. Thermal Consideration: The appliance's internal ambient temperature is estimated to reach 50°C. Using the derating factor (0.33 mA/°C above 25°C), the maximum allowable continuous current per segment is calculated: 25 mA - [0.33 mA/°C * (50°C-25°C)] = 25 mA - 8.25 mA = 16.75 mA. The chosen 10 mA is safe.
  4. PCB Layout: The display is placed on the PCB with careful attention to the pinout. Decoupling capacitors are placed near the driver IC. Traces for the common anode lines are sized to handle the peak current of all segments in one digit (up to 8 segments * 10 mA = 80 mA).
  5. Software: The microcontroller firmware implements a timer interrupt routine to refresh the display. It cycles through each digit (common anode), turning on the corresponding segments for that digit's value with a duty cycle that prevents flicker.
  6. Procurement Note: The Bill of Materials (BOM) specifies "LTF-2502KR, Bin H" to ensure all displays for production have matched brightness.

11. Operating Principle

The fundamental principle is based on electroluminescence in a semiconductor p-n junction. When a forward voltage exceeding the diode's turn-on threshold is applied, electrons from the n-type AlInGaP layer recombine with holes from the p-type layer. This recombination event releases energy in the form of photons (light). The specific composition of the AlInGaP alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, red at approximately 631 nm. The seven-segment structure is formed by arranging multiple individual LED chips (or chip segments) in the classic "8" pattern, with each segment electrically isolated and independently addressable.

12. Technology Trends

While discrete seven-segment displays like the LTF-2502KR remain vital for specific applications, broader display technology trends are relevant:

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.