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ITR20002 Photointerrupter Datasheet - Side-Looking Package - 940nm Wavelength - English Technical Document

Complete technical specifications and application guide for the ITR20002 side-looking infrared photointerrupter module, featuring a GaAlAs IR LED and silicon phototransistor.
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PDF Document Cover - ITR20002 Photointerrupter Datasheet - Side-Looking Package - 940nm Wavelength - English Technical Document

1. Product Overview

The ITR20002 is a compact, side-looking infrared photointerrupter module. It integrates an infrared emitting diode and an NPN silicon phototransistor mounted side-by-side on a converging optical axis within a black thermoplastic housing. This configuration is designed for object detection, position sensing, and non-contact switching applications by interrupting the infrared beam path between the emitter and detector.

1.1 Core Features and Advantages

1.2 Target Applications

The module is designed for a variety of optoelectronic sensing tasks, including:

2. Technical Parameter Deep-Dive

This section provides a detailed, objective interpretation of the key electrical and optical parameters specified in the datasheet.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

2.2 Electro-Optical Characteristics (Ta=25°C)

These are the typical operating parameters under specified test conditions.

3. Performance Curve Analysis

The datasheet references typical characteristic curves for both the IR emitter and the phototransistor. While the exact graphs are not reproduced here, their significance is explained.

3.1 IR Emitter Curves

These curves typically illustrate the relationship between forward current (IF) and forward voltage (VF) at different temperatures, showing the negative temperature coefficient of VF. They may also show relative radiant intensity vs. forward current and the angular radiation pattern, which is crucial for understanding the beam spread in the side-looking package.

3.2 Phototransistor Curves

These curves are essential for circuit design. They typically include:

4. Mechanical and Package Information

4.1 Package Dimensions

The ITR20002 comes in a standard side-looking, through-hole package. The dimensional drawing in the datasheet provides critical measurements for PCB layout and mechanical integration. Key features include the lead spacing, package body dimensions, and the location of the optical aperture. The note specifies that tolerances are ±0.25mm unless otherwise stated on the dimensioned drawing.

4.2 Polarity Identification

For through-hole packages, polarity is typically indicated by the physical shape of the package (a flat or notch) or by the length of the leads. The datasheet drawing should clearly mark the anode and cathode of the IR LED and the collector and emitter of the phototransistor. Correct polarity is essential for device operation and to prevent damage.

5. Application and Design Guidelines

5.1 Typical Application Circuit

A basic application involves driving the IR LED with a current-limiting resistor connected to a voltage source. The phototransistor is typically connected in a common-emitter configuration: the collector is pulled up to a supply voltage through a load resistor (RL), and the emitter is grounded. The output signal is taken from the collector. The value of RL affects the output voltage swing, speed, and current consumption. A smaller RL provides faster switching but a smaller voltage swing; a larger RL gives a larger swing but slower response.

5.2 Design Considerations

6. Packaging and Ordering Information

6.1 Label Specification

The product label contains several codes:

6.2 Packing Specification

The standard packing is 150 pieces per bag, 5 bags per box, and 10 boxes per carton. This information is vital for inventory planning and production line feeding.

7. Technical Comparison and Positioning

The ITR20002 represents a classic, cost-effective solution for object detection. Its key differentiators are its specific side-looking mechanical form factor and converging optical axis, which are designed for detecting objects passing through a specific slot or gap. Compared to reflective sensors, it offers higher reliability and consistency as it is less dependent on the reflectivity of the target object. Compared to transmissive sensors with opposed emitters and detectors, it allows for a more compact mechanical design where the object breaks the beam within a single module. The 940nm wavelength is a common standard, offering a good balance between component availability, cost, and ambient light rejection.

8. Frequently Asked Questions (FAQ)

8.1 What is the typical sensing distance or gap?

The datasheet specifies the IC(ON) test condition as "with reflector in 5mm away." This suggests the device is optimized for very short-range detection, likely in the range of a few millimeters. The actual usable gap depends on the drive current to the IR LED, the sensitivity of the receiver circuit, and the required signal margin.

8.2 How do I protect the device from electrical transients?

For the IR LED, a simple series resistor is usually sufficient. For the phototransistor operating in noisy environments, consider adding a small capacitor (e.g., 1-10nF) across the collector and emitter to filter high-frequency noise, keeping in mind this will slow the response time. For harsh industrial environments, additional external clamping diodes or TVS diodes may be required on the input/output lines.

8.3 Can I use this for speed sensing on a rotating slotted disk?

Yes, this is a common application. The maximum switching frequency will be limited by the rise/fall times (typically ~20-25μs), which theoretically allows frequencies up to roughly 20 kHz. In practice, the frequency will be lower due to circuit and duty cycle constraints. Ensure the slots and gaps on the disk are wide enough to allow the phototransistor to fully switch on and off.

9. Operational Principle

The ITR20002 operates on the principle of transmitted light interruption. The internal infrared emitting diode (IRED) is forward-biased, causing it to emit light at a peak wavelength of 940nm. The NPN silicon phototransistor, positioned on a converging axis, normally receives this radiation when nothing obstructs the path. Photons with sufficient energy strike the base region of the phototransistor, generating electron-hole pairs. This photocurrent acts as a base current, which is then amplified by the transistor's current gain (beta), resulting in a much larger collector current. When an opaque object is placed in the gap between the emitter and detector, the light path is interrupted. The photocurrent ceases, and the transistor turns off, causing the collector current to drop to a very low value (the dark current). This on/off change in collector current provides a digital signal indicating the presence or absence of an object.

10. Disclaimer and Reliability Notes

The information provided in this technical document is based on the original datasheet. Key disclaimers and notes from the manufacturer include:

It is the responsibility of the designer to validate the device's suitability and performance in their specific application.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.