Side Looking SMD LED Orange 5A - Ultra Bright AlInGaP - 5V Reverse Voltage - 75mW Power - English Technical Datasheet

1. Product Overview

This document details the specifications for a high-performance, side-looking Surface Mount Device (SMD) Light Emitting Diode (LED). The device utilizes an ultra-bright Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor chip to produce orange light. It is designed with a water-clear lens package, offering a wide viewing angle suitable for various indicator and backlighting applications where side emission is required. The product is compliant with RoHS (Restriction of Hazardous Substances) directives, classifying it as a green product. Its design is compatible with standard automated pick-and-place equipment and infrared (IR) reflow soldering processes, making it ideal for high-volume manufacturing. The LEDs are supplied on 8mm tape mounted on 7-inch diameter reels, adhering to EIA (Electronic Industries Alliance) standard packaging.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The absolute maximum ratings define the limits beyond which permanent damage to the device may occur. These values are specified at an ambient temperature (Ta) of 25°C and must not be exceeded under any operating conditions.

• Power Dissipation (Pd): 75 mW. This is the maximum amount of power the LED package can dissipate as heat without degrading performance or causing failure.
• Continuous Forward Current (IF): 30 mA DC. The maximum steady-state current that can be applied continuously.
• Peak Forward Current: 80 mA. This is permissible only under pulsed conditions with a duty cycle of 1/10 and a pulse width of 0.1ms. Exceeding the DC current rating in pulsed mode allows for higher instantaneous brightness.
• Reverse Voltage (VR): 5 V. The maximum voltage that can be applied in the reverse bias direction across the LED. Exceeding this can cause junction breakdown.
• Electrostatic Discharge (ESD) Threshold (HBM): 1000 V (Human Body Model). This indicates the device's sensitivity to static electricity; proper ESD handling procedures are mandatory.
• Operating Temperature Range: -30°C to +85°C. The ambient temperature range over which the LED is designed to function correctly.
• Storage Temperature Range: -40°C to +85°C. The temperature range for safe storage when the device is not powered.
• Infrared Reflow Soldering Condition: 260°C peak temperature for a maximum of 10 seconds. This defines the thermal profile the package can withstand during assembly.

2.2 Electro-Optical Characteristics

These parameters are measured at Ta=25°C and define the typical performance of the LED under normal operating conditions. The test current (IF) for most optical parameters is 5 mA.

• Luminous Intensity (Iv): Ranges from a minimum of 11.2 millicandelas (mcd) to a typical value of 71.0 mcd at 5 mA. Intensity is measured using a sensor filtered to match the photopic (human eye) response curve (CIE).
• Viewing Angle (2θ1/2): 130 degrees. This is the full angle at which the luminous intensity drops to half of its value measured on the central axis. A wide viewing angle is characteristic of side-looking LEDs with a water-clear lens.
• Peak Emission Wavelength (λP): 611 nanometers (nm). This is the wavelength at which the spectral power output of the LED is at its maximum.
• Dominant Wavelength (λd): 605 nm. Derived from the CIE chromaticity diagram, this is the single wavelength that best represents the perceived color (orange) of the LED to the human eye.
• Spectral Line Half-Width (Δλ): 17 nm. This parameter indicates the spectral purity or bandwidth of the emitted light, measured as the full width at half of the maximum intensity (FWHM).
• Forward Voltage (VF): Between 1.6 V (min) and 2.3 V (max) at IF=5mA. This is the voltage drop across the LED when it is conducting current.
• Reverse Current (IR): Maximum of 10 microamperes (μA) when a reverse voltage (VR) of 5V is applied. A low reverse current is desirable.

3. Binning System Explanation

The luminous intensity of LEDs can vary from batch to batch. To ensure consistency for the end-user, devices are sorted into intensity bins based on measured performance at 5 mA. The bin code defines the guaranteed minimum and maximum luminous intensity for LEDs marked with that code. The tolerance within each bin is +/- 15%.

• Bin Code L: 11.2 mcd (Min) to 18.0 mcd (Max)
• Bin Code M: 18.0 mcd (Min) to 28.0 mcd (Max)
• Bin Code N: 28.0 mcd (Min) to 45.0 mcd (Max)
• Bin Code P: 45.0 mcd (Min) to 71.0 mcd (Max)

This system allows designers to select LEDs with a known brightness range for their application, aiding in achieving uniform illumination in multi-LED designs.

4. Performance Curve Analysis

While specific graphical curves are referenced in the datasheet (e.g., Fig.1 for spectral distribution, Fig.6 for viewing angle), their typical behavior can be described based on semiconductor physics and standard LED characteristics.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The AlInGaP material has a characteristic forward voltage typically between 1.6V and 2.3V at 5mA. The I-V curve is exponential; a small increase in forward voltage results in a large increase in forward current. Therefore, driving the LED with a constant current source is highly recommended over a constant voltage source to prevent thermal runaway and ensure stable light output.

4.2 Luminous Intensity vs. Forward Current

The light output (luminous intensity) is approximately proportional to the forward current over a significant range. However, efficiency tends to decrease at very high currents due to increased heat generation within the chip (droop effect). Operating at or below the recommended DC current ensures optimal efficiency and longevity.

4.3 Temperature Dependence

Like all semiconductors, LED performance is temperature-sensitive. As the junction temperature increases:

• Forward Voltage (VF): Decreases slightly.
• Luminous Intensity (Iv): Decreases. The light output of AlInGaP LEDs has a negative temperature coefficient.
• Dominant Wavelength (λd): May shift slightly, typically towards longer wavelengths (red shift) as temperature rises.

Proper thermal management in the application (e.g., adequate PCB copper area for heat sinking) is crucial for maintaining consistent performance and lifetime.

4.4 Spectral Distribution

The spectral output curve will show a primary peak at approximately 611 nm (orange-red). The 17 nm half-width indicates a relatively narrow emission spectrum compared to white or broad-spectrum LEDs, which is typical for monochromatic AlInGaP devices.

5. Mechanical and Package Information

5.1 Package Dimensions

The datasheet includes a detailed dimensional drawing of the SMD package. Key features include the side-looking lens geometry, the location and size of the cathode and anode terminals, and the overall package footprint. All dimensions are provided in millimeters with a standard tolerance of ±0.10 mm unless otherwise specified. The side-viewing design directs light parallel to the mounting plane of the PCB.

5.2 Polarity Identification and Pad Design

The LED has an anode (+) and cathode (-) terminal. The datasheet provides a suggested soldering pad layout (land pattern) for PCB design. This layout is optimized for reliable soldering and mechanical stability. It also indicates the recommended soldering direction to ensure uniform solder fillets and prevent tombstoning (one end lifting off the pad during reflow). Following these guidelines is essential for high-yield manufacturing.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A suggested infrared (IR) reflow profile for lead-free (Pb-free) solder processes is provided. Key parameters of this profile include:

• Pre-heat/Soak Zone: Ramp-up to 150-200°C to activate flux and gradually heat the assembly, minimizing thermal shock.
• Reflow Zone: Temperature rises to a peak of 260°C maximum. The time above liquidus (typically ~217°C for SnAgCu solder) and the time within 5°C of the peak temperature are critical for joint formation.
• Peak Temperature & Time: The package must not exceed 260°C for more than 10 seconds. This limit is critical to prevent damage to the LED's epoxy lens and internal wire bonds.
• Cooling Zone: Controlled cool-down to solidify the solder joints properly.

The profile is based on JEDEC standards, but final board-level profiling is recommended due to variations in PCB design, solder paste, and oven characteristics.

6.2 Hand Soldering

If hand soldering is necessary, use a temperature-controlled soldering iron. The iron tip temperature should not exceed 300°C, and the soldering time per lead should be limited to a maximum of 3 seconds. Hand soldering should be performed only once to avoid thermal stress.

6.3 Cleaning

If cleaning after soldering is required, only use specified solvents. Immersing the LED in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute is acceptable. Do not use unspecified chemical cleaners as they may damage the package material or lens.

6.4 Storage and Handling

• ESD Precautions: The device is sensitive to Electrostatic Discharge (ESD). Always use wrist straps, anti-static mats, and properly grounded equipment when handling.
• Moisture Sensitivity: While the original sealed packaging with desiccant protects the devices, once opened, LEDs should be stored in an environment not exceeding 30°C and 60% relative humidity. For extended storage outside the original bag, use a sealed container with desiccant. If stored open for more than one week, a bake-out at approximately 60°C for at least 20 hours is recommended before reflow soldering to remove absorbed moisture and prevent \"popcorning\" (package cracking during reflow).

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The LEDs are supplied on embossed carrier tape with a protective cover tape. Key specifications include:

• Carrier Tape Width: 8 mm.
• Reel Diameter: 7 inches.
• Quantity per Reel: 4000 pieces (full reel).
• Minimum Pack Quantity: 500 pieces for remainder quantities.
• Pocket Sealing: Empty pockets on the tape are sealed with cover tape.
• Missing Lamps: A maximum of two consecutive missing LEDs (empty pockets) is allowed per the specification.

The packaging conforms to ANSI/EIA-481 specifications, ensuring compatibility with standard automated assembly equipment.

8. Application Notes and Design Considerations

8.1 Typical Application Scenarios

This side-looking orange LED is suitable for a variety of applications requiring a wide, side-emitting light pattern, including:

• Status Indicators: On consumer electronics, industrial control panels, and networking equipment where a wide viewing angle is beneficial.
• Backlighting: For edge-lit panels, membrane switch overlays, or symbols where light needs to be directed laterally.
• Automotive Interior Lighting: For dashboard or console illumination (subject to specific automotive-grade qualification).
• Appliance Displays: Indicating power, mode, or function on household appliances.

8.2 Circuit Design Considerations

• Current Limiting: Always use a series current-limiting resistor or a dedicated constant-current LED driver. The resistor value can be calculated using Ohm's Law: R = (Vsupply - VF) / IF. Ensure the resistor's power rating is sufficient (P = IF² * R).
• Reverse Voltage Protection: Although the LED can withstand 5V in reverse, it is good practice to avoid applying any reverse bias. In AC or bipolar circuits, consider adding a reverse-parallel diode for protection.
• Thermal Management: For operation at or near the maximum DC current, ensure the PCB provides adequate thermal relief. Connecting the LED pads to copper pour areas helps dissipate heat.
• Dimming: For brightness control, Pulse Width Modulation (PWM) is the preferred method over analog current reduction, as it maintains a consistent color temperature.

9. Technical Comparison and Differentiation

This AlInGaP orange LED offers specific advantages:

• vs. Traditional Orange LEDs (e.g., GaAsP): AlInGaP technology provides significantly higher luminous efficiency and brightness, better temperature stability, and longer operational lifetime.
• vs. Phosphor-Converted Orange LEDs: As a direct-emitting semiconductor, it offers a more saturated, pure orange color (narrow spectrum at ~605 nm dominant wavelength) compared to the broader spectrum of phosphor-converted types. It also typically has faster response times.
• Side-Looking vs. Top-View Package: The primary differentiator is the direction of light emission. This package is specifically engineered to emit light parallel to the PCB, solving design challenges where vertical space is limited or where illumination of a side surface is needed.

10. Frequently Asked Questions (FAQ)

10.1 What is the difference between peak wavelength and dominant wavelength?

Peak Wavelength (λP) is the physical wavelength where the LED emits the most optical power. Dominant Wavelength (λd) is a calculated value based on human color perception (CIE chart) that best represents the color we see. For monochromatic LEDs like this orange one, they are often close but not identical.

10.2 Can I drive this LED at 20 mA continuously?

Yes. The absolute maximum continuous forward current is 30 mA. Operating at 20 mA is within specification. Remember to recalculate the required current-limiting resistor value based on the forward voltage at 20 mA (which may be slightly higher than at 5 mA).

10.3 Why is a constant current driver recommended?

An LED's forward voltage has a negative temperature coefficient and can vary from unit to unit. A constant voltage source with a series resistor provides basic current limiting, but the current can still drift with temperature. A constant current source ensures stable light output and protects the LED from overcurrent conditions regardless of VF variations.

10.4 How do I interpret the bin code when ordering?

The bin code (e.g., L, M, N, P) specifies the guaranteed luminous intensity range at 5 mA. For applications requiring uniform brightness, specify and use LEDs from the same bin code. For less critical applications, a mix may be acceptable.

11. Design and Usage Case Study

Scenario: Backlighting a Raised Tactile Button on a Medical Device Panel. The button cap is opaque with a translucent icon, and it sits 2mm above the PCB. A top-view LED would shine upwards, wasting light. A side-looking LED mounted adjacent to the button can direct its 130-degree beam sideways into the edge of the button cap, efficiently illuminating the icon from within. The wide viewing angle ensures even illumination across the icon. The orange color provides a clear \"standby\" or \"warning\" indication. The SMD package allows for compact, low-profile assembly compatible with automated production and cleaning processes required for medical equipment.

12. Technology Principle Introduction

This LED is based on Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material grown epitaxially on a substrate. When a forward voltage is applied, electrons and holes are injected into the active region where they recombine, releasing energy in the form of photons (light). The specific ratio of aluminum, indium, and gallium in the crystal lattice determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, orange (~605-611 nm). The \"ultra-bright\" characteristic is achieved through advanced chip design and efficient light extraction from the semiconductor material into the package. The side-looking effect is created by the specific molded lens geometry which uses internal reflection and refraction to redirect light from the top-emitting chip out through the side of the package.

13. Industry Trends and Developments

The trend in indicator and signal LEDs continues towards higher efficiency, smaller packages, and greater reliability. AlInGaP technology is mature but continues to see incremental improvements in lumen-per-watt output. There is also a growing emphasis on precise color binning and tighter tolerances for applications requiring color consistency, such as full-color displays or automotive clusters. The adoption of side-looking and right-angle packages is increasing with the miniaturization of electronics, allowing for innovative backlighting and status indication solutions in space-constrained designs. Furthermore, integration with onboard controllers (smart LEDs) and improved compatibility with high-temperature soldering processes are ongoing areas of development to meet the demands of advanced automotive and industrial applications.