SMD LED Amber AlInGaP 120-Degree Viewing Angle - Electrical & Optical Characteristics Datasheet - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-brightness, surface-mount device (SMD) Light Emitting Diode (LED) utilizing an Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material to produce an amber light output. The device is housed in a water-clear lens package, designed specifically for automated assembly processes and applications where space constraints are a primary concern.

1.1 Core Advantages and Target Market

The primary application focus for this LED is within the automotive sector, specifically for vehicle accessory lighting. Its design prioritizes compatibility with modern manufacturing techniques, including automated pick-and-place equipment and lead-free infrared (IR) reflow soldering processes. Key features that support its use in demanding environments include compliance with RoHS (Restriction of Hazardous Substances) directives, preconditioning to JEDEC Level 3 moisture sensitivity standards, and packaging on industry-standard 12mm tape and 7-inch reels for efficient handling.

2. In-Depth Technical Parameter Analysis

A thorough understanding of the device's operating limits and performance under standard conditions is critical for reliable circuit design.

2.1 Absolute Maximum Ratings

These values define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed. Key ratings include a maximum power dissipation of 500 mW, a peak forward current of 400 mA (under pulsed conditions with a 1/10 duty cycle and 0.1ms pulse width), and a continuous DC forward current operating range from 5 mA to 200 mA. The device is rated for an operating and storage temperature range of -40°C to +100°C. It can withstand infrared reflow soldering at a peak temperature of 260°C for a maximum of 10 seconds.

2.2 Thermal Characteristics

Effective thermal management is essential for LED performance and longevity. The junction-to-ambient thermal resistance (RθJA) is typically 50 °C/W when measured on an FR4 substrate with a 1.6mm thickness and a 16mm² copper pad. The junction-to-solder point thermal resistance (RθJS) is typically 30 °C/W, providing a more direct path for heat dissipation into the printed circuit board (PCB). The maximum allowable junction temperature (Tj) is 125°C.

2.3 Electrical and Optical Characteristics

Measured at an ambient temperature (Ta) of 25°C and a forward current (IF) of 140 mA, the device exhibits the following typical performance. The luminous intensity (Iv) ranges from a minimum of 7.1 candela (cd) to a maximum of 11.2 cd. It features a wide viewing angle (2θ½) of 120 degrees, defined as the off-axis angle where luminous intensity drops to half of its axial value. The light emission is characterized by a peak wavelength (λP) of 625 nm and a dominant wavelength (λd) between 612 nm and 624 nm, defining its amber color. The spectral bandwidth (Δλ) is approximately 18 nm. Electrically, the forward voltage (VF) ranges from 1.90V to 2.50V at 140 mA, and the reverse current (IR) is a maximum of 10 μA at a reverse voltage (VR) of 12V.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into performance bins. This device uses a three-code system (e.g., F/EA/3) printed on the label.

3.1 Forward Voltage (Vf) Binning

LEDs are categorized into four voltage bins (C, D, E, F) based on their forward voltage at 140 mA, with each bin having a range of 0.15V and a tolerance of ±0.1V. For example, bin 'F' includes LEDs with Vf between 2.35V and 2.50V.

3.2 Luminous Intensity (Iv) Binning

Two intensity bins (EA, EB) are defined. Bin 'EA' covers luminous intensity from 7.1 cd to 9.0 cd (approximately 19.5 to 24.8 lumens), while bin 'EB' covers 9.0 cd to 11.2 cd (approximately 24.8 to 31.6 lumens). Tolerance on each intensity bin is ±11%.

3.3 Dominant Wavelength (Wd) Binning

The amber color is controlled through three wavelength bins (2, 3, 4). Bin '2' is for 612-616 nm, bin '3' for 616-620 nm, and bin '4' for 620-624 nm. The tolerance for each wavelength bin is ±1 nm.

4. Performance Curve Analysis

Graphical data provides insight into device behavior under varying conditions.

4.1 Spatial Distribution (Radiation Pattern)

The provided polar diagram illustrates the spatial distribution of light intensity. The curve confirms the 120-degree viewing angle, showing a smooth, wide beam pattern typical of LEDs with a water-clear dome lens, which is suitable for applications requiring broad area illumination rather than a focused spot.

4.2 Forward Current vs. Forward Voltage & Luminous Intensity

While specific IV and LI curves are referenced but not displayed in the excerpt, typical analysis would involve examining the relationship between forward current (IF) and forward voltage (VF), which is non-linear. Similarly, the curve of luminous intensity versus forward current typically shows a sub-linear increase, where efficiency may decrease at very high currents due to thermal effects. Designers use these curves to select appropriate drive currents to achieve desired brightness while managing power dissipation and efficiency.

5. Mechanical and Package Information

5.1 Device Dimensions and Polarity

The package drawing (referenced in the datasheet) provides critical mechanical dimensions in millimeters, with a standard tolerance of ±0.2 mm unless otherwise specified. A crucial design note is that the ANODE lead frame also serves as the primary heat sink for the LED. Proper identification of the anode and cathode (typically indicated by a marking on the package or a difference in lead shape/size) is essential for correct electrical connection.

5.2 Recommended PCB Pad Design

A land pattern diagram is provided to guide PCB layout for infrared reflow soldering. Adhering to this recommended pad geometry is vital for achieving reliable solder joints, ensuring proper thermal and electrical connection, and managing the heat dissipation path from the LED's thermal pad (anode) into the PCB.

6. Soldering, Assembly, and Handling Guidelines

6.1 IR Reflow Soldering Profile

The datasheet specifies a lead-free IR reflow profile compliant with J-STD-020. Key parameters include a preheat stage, a defined temperature ramp-up rate, a peak body temperature not exceeding 260°C, and a time above liquidus (TAL) appropriate for the solder paste used. Following this profile is critical to prevent thermal shock and damage to the LED package or die.

6.2 Storage and Moisture Sensitivity

This product is classified as Moisture Sensitivity Level (MSL) 2A per JEDEC J-STD-020. When the moisture-proof bag is sealed, it should be stored at ≤30°C and ≤70% RH, with a recommended use-within period of one year. Once the bag is opened, the LEDs should be stored at ≤30°C and ≤60% RH and should be soldered within one year. For components stored out of bag for extended periods (>1 year), a bake at 60°C for at least 48 hours is recommended prior to assembly to remove absorbed moisture and prevent \"popcorning\" during reflow.

6.3 Cleaning

If cleaning after soldering is necessary, only specified solvents should be used. The datasheet recommends immersion in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute. Unspecified chemicals may damage the LED's epoxy lens or package.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The LEDs are supplied on 12mm wide embossed carrier tape wound onto 7-inch (178mm) diameter reels. Standard reel quantity is 1000 pieces. The tape uses a top cover to seal empty pockets. Packaging follows ANSI/EIA-481 standards. For remainder quantities, a minimum pack of 500 pieces is available.

8. Application Notes and Design Considerations

8.1 Intended Use and Limitations

This LED is designed for ordinary electronic equipment, including the specified automotive accessory applications. It is not intended for use in safety-critical or life-support systems (e.g., aviation, medical devices) without prior consultation and specific qualification. For such high-reliability applications, specialized products with appropriate certifications are required.

8.2 Circuit Design Considerations

1. Current Limiting: LEDs are current-driven devices. A series resistor or constant-current driver circuit is mandatory to limit the forward current to within the 5-200 mA DC range and prevent damage from overcurrent. The chosen current will directly affect brightness, forward voltage, and junction temperature.
2. Thermal Management: To maintain performance and longevity, the maximum junction temperature of 125°C must not be exceeded. This requires careful PCB design: using the recommended pad size, incorporating thermal vias under the anode pad to conduct heat to inner or bottom copper layers, and ensuring adequate airflow in the end application.
3. Reverse Voltage Protection: The device has a maximum reverse voltage rating of 12V (for test purposes only) and is not designed for operation in reverse bias. In circuits where reverse voltage is possible (e.g., AC coupling or in series/parallel arrays), external protection such as a parallel diode is necessary.

9. Technical Comparison and Differentiation

Compared to older technologies like Gallium Arsenide Phosphide (GaAsP) amber LEDs, this AlInGaP-based device offers significantly higher luminous efficiency and better temperature stability of color and output. The 120-degree viewing angle provided by the water-clear lens offers a broader, more uniform illumination compared to LEDs with diffused or narrow-angle lenses, making it suitable for indicator and backlighting applications where wide visibility is needed. Its compatibility with automated SMT assembly and standard IR reflow profiles differentiates it from through-hole LEDs, enabling lower-cost, higher-volume manufacturing.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (λP) is the single wavelength at which the emission spectrum has its maximum intensity. Dominant wavelength (λd) is the single wavelength of monochromatic light that, when combined with a specified white reference, matches the perceived color of the LED. λd is more relevant for color specification in applications.

Q: Can I drive this LED with a 3.3V supply without a current-limiting resistor?
A: No. With a typical Vf of around 2.2V, connecting it directly to 3.3V would cause excessive current to flow, likely exceeding the 200 mA maximum and destroying the LED. A series resistor or constant-current driver is always required.

Q: Why is the anode also the heat sink?
A> In many SMD LED packages, one of the electrical leads (often the anode) is physically larger and connected to a thermal pad underneath the chip. This design provides a low-resistance path for heat to flow from the semiconductor junction out to the PCB, improving thermal performance.

Q: What does \"preconditioning to JEDEC level 3\" mean?
A: It means the LEDs have been subjected to a standardized moisture absorption and reflow simulation test (JEDEC Level 3) during qualification. This ensures they can withstand the moisture and heat of a typical solder reflow process after being exposed to a factory floor environment for a specified period (168 hours).

11. Practical Application Example

Scenario: Dashboard Illumination for a Vehicle Accessory
A designer is creating an illuminated control panel for an aftermarket automotive accessory. They require a durable, bright amber indicator for a mode selection button. They select this LED for its automotive suitability, wide viewing angle (ensuring visibility from various driver positions), and compatibility with automated PCB assembly. In their design, they:
1. Use a constant-current driver IC set to 140 mA to ensure consistent brightness across all units and compensate for minor Vf variations.
2. Design the PCB with the exact recommended land pattern, including a cluster of thermal vias under the anode pad connected to a large ground plane on an inner layer for heat spreading.
3. Specify the bin code F/EB/3 to their supplier to ensure tight control on color (620-624 nm dominant wavelength) and high brightness (9.0-11.2 cd).
4. Follow the J-STD-020 reflow profile during manufacturing and implement proper handling procedures for the MSL 2A components.

12. Technology Principle Introduction

This LED is based on Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material grown on a substrate. When a forward voltage is applied across the p-n junction, electrons and holes are injected into the active region where they recombine. This recombination process releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the AlInGaP material, which is engineered during the crystal growth process to produce amber light (~612-624 nm). The water-clear epoxy lens encapsulates the semiconductor die, provides environmental protection, and shapes the emitted light into the desired radiation pattern (120-degree viewing angle in this case).

13. Industry Trends and Developments

The general trend in SMD LEDs for automotive and general lighting is toward higher efficacy (more lumens per watt), improved color consistency and stability over temperature and lifetime, and increased power density in smaller packages. There is also a drive for broader adoption of advanced packaging techniques to improve thermal performance. For amber signals, AlInGaP remains the dominant high-efficiency technology. Research continues into next-generation materials like perovskite semiconductors for potential future applications, but AlInGaP is expected to remain prevalent in the automotive sector due to its proven reliability, performance, and cost-effectiveness.