SMD LED 0201 Blue Datasheet - Dimensions 0.6x0.3x0.25mm - Voltage 2.8-3.8V - Power 80mW - English Technical Document

1. Product Overview

This document details the specifications for a miniature Surface-Mount Device (SMD) Light Emitting Diode (LED) in the 0201 package size. This component is designed for automated printed circuit board (PCB) assembly and is ideal for space-constrained applications. The LED emits blue light using an InGaN (Indium Gallium Nitride) semiconductor material, with a water-clear lens for optimal light output.

1.1 Core Advantages and Target Market

The primary advantages of this LED include its extremely compact footprint, compatibility with high-volume automated placement equipment, and suitability for lead-free infrared (IR) reflow soldering processes. It is designed to meet RoHS (Restriction of Hazardous Substances) compliance. Its target applications span a wide range of consumer and industrial electronics, including but not limited to status indicators, backlighting for front panels and keypads, signal luminaries in telecommunications equipment, office automation devices, home appliances, and indoor signage. The miniature size makes it particularly valuable in portable devices like smartphones, tablets, and wearable technology.

2. Technical Parameters: In-Depth Objective Interpretation

This section provides a detailed breakdown of the LED's operational limits and performance characteristics under standard test conditions.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These ratings are specified at an ambient temperature (Ta) of 25°C. The maximum continuous DC forward current (IF) is 20 mA. A higher peak forward current of 100 mA is permissible but only under pulsed conditions with a 1/10 duty cycle and a pulse width of 0.1 ms. The maximum power dissipation is 80 mW. The device is rated for operation within a temperature range of -40°C to +85°C and can be stored in environments from -40°C to +100°C.

2.2 Electro-Optical Characteristics

The Electro-Optical Characteristics are measured at Ta=25°C with a forward current (IF) of 20 mA, unless otherwise noted. The luminous intensity (Iv) has a typical range from 90.0 mcd to 224.0 mcd, measured using a sensor filtered to match the CIE photopic eye-response curve. The viewing angle (2θ1/2), defined as the full angle at which intensity drops to half its axial value, is typically 110 degrees, indicating a wide viewing pattern. The peak emission wavelength (λp) is centered at 468 nm. The dominant wavelength (λd), which defines the perceived color, ranges from 465 nm to 475 nm. The spectral bandwidth (Δλ) is approximately 25 nm. The forward voltage (VF) required to drive 20 mA through the LED typically falls between 2.8 V and 3.8 V. The reverse current (IR) is specified to be 10 μA maximum at a reverse voltage (VR) of 5V; it is critical to note that the device is not designed for operation under reverse bias.

3. Binning System Explanation

To ensure consistency in production, LEDs are sorted into bins based on key parameters. This allows designers to select components that meet specific requirements for color, brightness, and electrical behavior.

3.1 Forward Voltage (VF) Binning

LEDs are categorized into five voltage bins (D7 through D11). Each bin represents a 0.2 V range, starting from 2.8-3.0 V (D7) up to 3.6-3.8 V (D11). The tolerance within each bin is ±0.10 V. This binning helps in designing stable current-driver circuits, especially when multiple LEDs are connected in series.

3.2 Luminous Intensity (IV) Binning

Luminous output is sorted into four intensity bins: Q2 (90.0-112.0 mcd), R1 (112.0-140.0 mcd), R2 (140.0-180.0 mcd), and S1 (180.0-224.0 mcd). The tolerance for each intensity bin is ±11%. This allows for selection based on application brightness needs, ensuring visual consistency in multi-LED arrays.

3.3 Dominant Wavelength (WD) Binning

The color (dominant wavelength) is controlled through two bins: AC (465.0-470.0 nm) and AD (470.0-475.0 nm). The tolerance for each wavelength bin is ±1 nm. This tight control is essential for applications where specific color points or color mixing is required.

4. Performance Curve Analysis

While specific graphical curves are referenced in the datasheet (e.g., Figure 1 for spectral distribution, Figure 5 for viewing angle), their typical implications are analyzed here. The forward current vs. forward voltage (I-V) characteristic will show the exponential relationship typical of a diode. The luminous intensity is generally proportional to the forward current within the specified operating range. The peak emission wavelength may exhibit a slight negative shift with increasing junction temperature, meaning the blue light may become very slightly shorter in wavelength as the device heats up. The wide 110-degree viewing angle curve indicates a near-Lambertian emission pattern, providing good off-axis visibility.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED conforms to the EIA standard 0201 package outline. Key dimensions include a typical body length of 0.6 mm, a width of 0.3 mm, and a height of 0.25 mm. All dimensional tolerances are ±0.2 mm unless otherwise specified. The package features two anode/cathode terminals for surface mounting.

5.2 Recommended PCB Attachment Pad

A land pattern design is provided for reliable soldering. The recommended pad layout is optimized for infrared or vapor phase reflow processes, ensuring proper solder fillet formation and mechanical stability. Adherence to this pattern is crucial to prevent tombstoning (component standing up on one end) during reflow, especially for such a small component.

5.3 Polarity Identification

Polarity must be observed during assembly. The datasheet should be consulted for the specific marking or internal die structure that identifies the cathode. Incorrect polarity connection will prevent the LED from illuminating and applying reverse voltage beyond the maximum rating can damage the device.

6. Soldering and Assembly Guidelines

6.1 IR Reflow Soldering Profile

A suggested reflow profile compliant with J-STD-020B for lead-free (Pb-free) processes is provided. Key parameters include a preheat zone (typically 150-200°C for up to 120 seconds), a controlled ramp to a peak temperature not exceeding 260°C, and a time above liquidus (TAL) appropriate for the solder paste used. The total time at peak temperature should be limited to a maximum of 10 seconds. It is emphasized that the optimal profile depends on the specific PCB design, solder paste, and oven, so board-level characterization is recommended.

6.2 Hand Soldering

If hand soldering is necessary, extreme care must be taken. A soldering iron tip temperature should not exceed 300°C, and the contact time with the LED terminal should be limited to a maximum of 3 seconds for a single soldering event only. Excessive heat can damage the semiconductor die or the plastic package.

6.3 Storage and Handling Conditions

The LEDs are moisture-sensitive. When stored in their original sealed moisture-proof bag with desiccant, they should be kept at ≤30°C and ≤70% Relative Humidity (RH) and used within one year. Once the bag is opened, the \"floor life\" is 168 hours (7 days) under conditions of ≤30°C and ≤60% RH. Components exposed beyond this time require a baking procedure (approximately 60°C for at least 48 hours) to remove absorbed moisture before reflow to prevent \"popcorning\" or package cracking during soldering.

6.4 Cleaning

If cleaning after soldering is required, only specified solvents should be used. Immersing the LED in ethyl alcohol or isopropyl alcohol at room temperature for less than one minute is acceptable. The use of unspecified or aggressive chemicals can damage the package material, lens, or internal bonds.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The LEDs are supplied packaged for automated assembly. They are mounted in 12 mm wide embossed carrier tape. This tape is wound onto a standard 7-inch (178 mm) diameter reel. Each full reel contains 4000 pieces. For quantities less than a full reel, a minimum pack quantity of 500 pieces is available. The packaging conforms to ANSI/EIA-481 specifications.

7.2 Part Number Interpretation

The part number typically encodes key attributes. While the full naming convention may be proprietary, it generally includes the package size (0201), the color (Blue, indicated by \"B\"), and potentially the performance bin codes. The exact product is identified by the full part number as listed in the datasheet header.

8. Application Suggestions

8.1 Typical Application Circuits

The LED must be driven with a constant current source, not a constant voltage, for stable and reliable operation. A simple series resistor is the most common current-limiting method. The resistor value (R) is calculated as R = (Vsupply - VF) / IF, where VF is the forward voltage from the datasheet (using the maximum value for a conservative design) and IF is the desired forward current (e.g., 20 mA). For example, with a 5V supply and a VF of 3.8V, R = (5 - 3.8) / 0.02 = 60 Ω. A 62 Ω or 68 Ω standard value resistor would be suitable. For precision or battery-powered applications, dedicated LED driver ICs are recommended.

8.2 Design Considerations and Notes

Thermal Management: Although power dissipation is low (80 mW max), ensuring adequate PCB copper area around the pads helps dissipate heat, maintaining LED efficiency and longevity, especially in high ambient temperature environments.
ESD Protection: Like all semiconductor devices, LEDs are sensitive to Electrostatic Discharge (ESD). Proper ESD handling procedures should be followed during assembly.
Optical Design: The water-clear lens provides a bright point source. For diffused or shaped light output, external light guides, diffusers, or lenses may be incorporated into the product housing.
Current Derating: Operating the LED at currents below the maximum rating (e.g., 15 mA instead of 20 mA) can significantly improve its operational lifetime and reduce thermal stress.

9. Technical Comparison and Differentiation

The 0201 package represents one of the smallest commercially available SMD LED footprints, offering a significant size advantage over 0402 or 0603 packages for ultra-miniaturized designs. The use of InGaN technology provides high-efficiency blue light emission. The combination of a wide 110-degree viewing angle and a clear lens differentiates it from narrower-angle or diffused-lens variants, making it suitable for applications requiring broad visibility. Its compatibility with standard lead-free reflow profiles aligns it with modern, RoHS-compliant manufacturing processes.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED with a 3.3V supply?
A: Yes, but careful design is needed. Since the forward voltage (2.8-3.8V) is close to the supply voltage, the current-limiting resistor value will be very small, making the current highly sensitive to variations in VF and Vsupply. A dedicated low-dropout constant current driver is recommended for stable operation from a 3.3V rail.
Q: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (λp) is the wavelength at the highest point in the LED's spectral output curve. Dominant wavelength (λd) is a calculated value that represents the single wavelength of a pure monochromatic light that would appear to have the same color to the human eye. λd is more relevant for color perception and matching.
Q: Why is there a reverse current specification if the device is not for reverse operation?
A: The reverse current (IR) is a leakage specification tested under a controlled 5V reverse bias. It is a quality and parameter test, not an operating condition. Applying reverse voltage in-circuit can damage the device.
Q: How do I interpret the bin codes when ordering?
A: You can specify the desired VF, IV, and WD bin codes (e.g., D9, R2, AC) to ensure you receive LEDs with tightly grouped characteristics for your application, though this may affect availability and cost.

11. Practical Design and Usage Case

Case: Status Indicator on a Wearable Device PCB
A designer is creating a compact fitness tracker. Board space is extremely limited. A single blue LED is needed to indicate Bluetooth pairing status and low battery. The 0201 LED is selected for its minimal footprint. The designer chooses an intensity bin R1 (112-140 mcd) for adequate visibility. The LED is driven by a GPIO pin on the system microcontroller through a 100Ω series resistor (calculated for a 3.0V battery and typical VF). The PCB layout follows the recommended pad geometry. During assembly, the manufacturer uses the provided lead-free reflow profile. The moisture-sensitive components are baked prior to use as the PCBs were stored for over a week after the reel was opened. The final product has a reliable, bright status indicator that consumes minimal space and power.

12. Principle of Operation Introduction

An LED is a semiconductor p-n junction diode. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the junction region. When these charge carriers recombine, energy is released in the form of photons (light). The color (wavelength) of the emitted light is determined by the energy bandgap of the semiconductor material. This specific LED uses an InGaN (Indium Gallium Nitride) compound semiconductor, which has a bandgap corresponding to blue light emission. The water-clear epoxy lens encapsulates the semiconductor die, provides mechanical protection, and shapes the light output pattern.

13. Technology Trends

The trend in indicator and backlight LEDs continues toward further miniaturization, increased efficiency (more light output per unit of electrical power, measured in lumens per watt), and higher reliability. Package designs are evolving to improve thermal performance, allowing for higher drive currents in small packages. There is also ongoing development in wavelength stability over temperature and lifetime. The adoption of advanced semiconductor materials and epitaxial growth techniques enables tighter control over color points and higher brightness from ever-smaller chip sizes. Integration, such as incorporating current-limiting resistors or protection diodes within the LED package itself, is another trend to simplify circuit design and save board space.