SMD LED 0603 Blue Datasheet - Dimensions 1.6x0.8x0.6mm - Voltage 2.8-3.8V - Power 76mW - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a surface-mount device (SMD) light-emitting diode (LED) in the 0603 package size. The device features a water-clear lens and utilizes an InGaN (Indium Gallium Nitride) semiconductor structure to emit blue light. It is designed for automated assembly processes and is compatible with various reflow soldering techniques, making it suitable for high-volume electronics manufacturing.

1.1 Core Features and Advantages

The LED is characterized by several key features that enhance its usability and reliability in modern electronic applications. It is compliant with RoHS (Restriction of Hazardous Substances) directives, classifying it as a green product. The components are supplied in industry-standard 8mm tape on 7-inch diameter reels, facilitating compatibility with automated pick-and-place equipment. This packaging standard ensures efficient handling and reduces the risk of damage during the assembly process. The device is also designed to withstand the thermal profiles of both infrared (IR) and vapor phase reflow soldering processes, which are common in lead-free (Pb-free) assembly lines. Its package conforms to EIA (Electronic Industries Alliance) standards, and its electrical characteristics are compatible with standard integrated circuit (IC) drive levels.

1.2 Target Applications and Market

This blue SMD LED is intended for use in a wide range of ordinary electronic equipment. Typical applications include status indicators, backlighting for small displays, panel illumination, and decorative lighting in consumer electronics, office automation equipment, communication devices, and household appliances. Its small form factor and reliability make it a versatile component for designers seeking compact and efficient lighting solutions. It is important to note that this LED is not specifically rated for applications requiring exceptional reliability where failure could jeopardize life or health, such as in aviation, medical life-support systems, or safety-critical transportation controls. For such applications, consultation with the manufacturer for specialized products is necessary.

2. Technical Parameters: In-Depth Objective Interpretation

A thorough understanding of the electrical and optical parameters is crucial for successful circuit design and reliable operation.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operating the LED under conditions exceeding these values is not recommended. The absolute maximum ratings are specified at an ambient temperature (Ta) of 25°C.

• Power Dissipation (Pd): 76 mW. This is the maximum amount of power the LED package can dissipate as heat.
• Peak Forward Current (I_F(peak)): 100 mA. This current can only be applied under pulsed conditions with a 1/10 duty cycle and a pulse width of 0.1ms. Exceeding this in DC operation will cause damage.
• DC Forward Current (I_F): 20 mA. This is the recommended continuous forward current for normal operation.
• Derating: The maximum allowable DC forward current decreases linearly above 50°C ambient temperature at a rate of 0.25 mA per °C. This is critical for thermal management.
• Reverse Voltage (V_R): 5 V. Applying a reverse voltage higher than this can damage the LED junction. The datasheet explicitly notes that reverse voltage operation cannot be continuous.
• Operating Temperature Range: -20°C to +80°C. The device is guaranteed to function within this ambient temperature range.
• Storage Temperature Range: -30°C to +100°C.
• Soldering Conditions: The LED can withstand wave soldering at 260°C for 5 seconds, IR reflow at 260°C for 5 seconds, and vapor phase reflow at 215°C for 3 minutes.

2.2 Electrical & Optical Characteristics

These are the typical performance parameters measured at Ta=25°C and I_F=20mA, unless otherwise stated.

• Luminous Intensity (I_V): 28.0 to 180.0 mcd (millicandela). The wide range indicates the device is available in different brightness bins (see Section 3). Measurement is done with a filter approximating the CIE photopic eye-response curve.
• Viewing Angle (2θ_1/2): 130 degrees. This is the full angle at which the luminous intensity is half of the intensity measured on the central axis (0°). A wide viewing angle is typical for LEDs with a water-clear, non-diffused lens.
• Peak Emission Wavelength (λ_P): 468 nm. This is the wavelength at which the spectral power distribution is at its maximum.
• Dominant Wavelength (λ_d): 465.0 to 475.0 nm. This is the single wavelength perceived by the human eye that defines the color of the light, derived from the CIE chromaticity diagram.
• Spectral Line Half-Width (Δλ): 25 nm. This indicates the spectral bandwidth; a smaller value would indicate a more monochromatic light source.
• Forward Voltage (V_F): 2.80 to 3.80 V. The voltage drop across the LED when driven at 20mA. This parameter is also binned (see Section 3).
• Reverse Current (I_R): 10 μA (max). The leakage current when a reverse voltage of 5V is applied.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into bins based on key parameters. This allows designers to select parts that meet specific requirements for color and brightness uniformity in their application.

3.1 Forward Voltage Binning

LEDs are categorized by their forward voltage (V_F) at 20mA. The bin codes (D7 to D11) represent voltage ranges with a tolerance of ±0.1V within each bin. For example, bin D8 includes LEDs with V_F between 3.00V and 3.20V. Selecting LEDs from the same voltage bin can help achieve more uniform current sharing when multiple LEDs are connected in parallel.

3.2 Luminous Intensity Binning

This is a critical bin for brightness consistency. The bins (N, P, Q, R) define minimum and maximum luminous intensity values, each with a tolerance of ±15%. Bin N covers 28.0-45.0 mcd, while bin R covers the highest brightness range of 112.0-180.0 mcd. Using LEDs from the same intensity bin is essential for applications where uniform perceived brightness is important.

3.3 Dominant Wavelength Binning

This binning ensures color consistency. The two bins, AC (465.0-470.0 nm) and AD (470.0-475.0 nm), have a tight tolerance of ±1 nm. Bin AC represents a slightly shorter, more pure blue, while bin AD is a slightly longer, slightly greenish-blue. Consistent wavelength selection is key for color-critical indicator applications or when mixing colors.

4. Performance Curve Analysis

While the datasheet references typical characteristic curves, the provided data allows for analysis of performance trends.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

Based on the specified V_F range of 2.8-3.8V at 20mA, the LED exhibits a characteristic exponential I-V curve typical of a diode. The forward voltage has a negative temperature coefficient, meaning it decreases slightly as the junction temperature increases for a given current.

4.2 Luminous Intensity vs. Forward Current

The luminous intensity is approximately proportional to the forward current in the normal operating range (up to 20mA). However, efficiency may drop at very high currents due to increased junction temperature and other non-linear effects. The derating specification above 50°C is directly related to managing this thermal effect to maintain light output and longevity.

4.3 Spectral Distribution

With a peak wavelength of 468 nm and a dominant wavelength range of 465-475 nm, the LED emits in the blue region of the visible spectrum. The spectral half-width of 25 nm indicates a relatively narrow emission band, which is characteristic of InGaN-based blue LEDs.

5. Mechanical & Package Information

5.1 Package Dimensions

The LED uses the industry-standard 0603 package footprint, which nominally measures 1.6mm in length, 0.8mm in width, and 0.6mm in height. All dimensional tolerances are ±0.10mm unless otherwise specified. The package has a water-clear epoxy lens.

5.2 Polarity Identification and Pad Design

The cathode is typically marked, often by a green tint on the corresponding side of the package or a notch in the tape reel pocket. The datasheet includes suggested soldering pad dimensions to ensure a reliable solder joint and proper alignment during reflow. Following these land pattern recommendations is essential for good soldering yield and mechanical stability.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profiles

The datasheet provides two suggested infrared (IR) reflow profiles: one for normal (tin-lead) process and one for Pb-free process using SnAgCu solder paste. The Pb-free profile typically has a higher peak temperature (up to 260°C) but a similar time-above-liquidus. Adherence to these profiles is critical to prevent thermal damage to the LED epoxy or the semiconductor die.

6.2 Cleaning and Storage

If cleaning is required after soldering, only specified solvents like ethyl alcohol or isopropyl alcohol should be used at normal temperature for less than one minute. Unspecified chemicals may damage the package. For storage, LEDs removed from their original moisture-barrier bag should be reflowed within one week. For longer storage outside the original packaging, they must be stored in a dry environment (e.g., with desiccant) and may require a baking process (e.g., 60°C for 24 hours) before assembly to remove absorbed moisture and prevent \"popcorning\" during reflow.

7. Packaging and Ordering Information

The LEDs are supplied on 8mm wide embossed carrier tape wound on 7-inch (178mm) diameter reels. Each reel contains 3000 pieces. The tape and reel specifications comply with ANSI/EIA 481-1-A-1994. Empty pockets in the tape are sealed with a cover tape. The maximum number of consecutive missing components (skips) allowed is two. For quantities less than a full reel, a minimum packing quantity of 500 pieces is specified for remainder lots.

8. Application Suggestions and Design Considerations

8.1 Drive Circuit Design

LEDs are current-operated devices. The most reliable method to drive multiple LEDs is to use a series current-limiting resistor for each LED (Circuit Model A in the datasheet). This ensures uniform brightness despite variations in the forward voltage (V_F) of individual LEDs. Connecting multiple LEDs directly in parallel without individual resistors (Circuit Model B) is not recommended, as small differences in V_F can cause significant current imbalance, leading to uneven brightness and potential over-current in the LED with the lowest V_F.

8.2 Electrostatic Discharge (ESD) Protection

The LED is sensitive to electrostatic discharge. To prevent ESD damage during handling and assembly, the following precautions are mandatory: personnel must wear grounded wrist straps or anti-static gloves; all workstations, equipment, and storage racks must be properly grounded; and the use of ionizers is recommended to neutralize static charges in the work environment.

9. Technical Comparison and Differentiation

Compared to older LED technologies, this InGaN-based blue LED offers high efficiency and brightness in a miniature 0603 package. Its compatibility with lead-free, high-temperature reflow processes aligns it with modern environmental regulations and manufacturing trends. The availability of tight electrical and optical bins allows for high-precision applications where consistency is paramount. The wide 130-degree viewing angle makes it suitable for applications requiring broad illumination rather than a focused beam.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED with 3.3V directly?
A: Possibly, but not reliably. The forward voltage ranges from 2.8V to 3.8V. At 3.3V, an LED from the D11 bin (3.6-3.8V) may not light up at all, while one from the D7 bin (2.8-3.0V) would be severely over-driven. Always use a series resistor to set the current precisely to 20mA (or less), regardless of the supply voltage.

Q: Why is there such a large range in luminous intensity (28 to 180 mcd)?
A: This is the total production spread. For a specific order, you select a bin (N, P, Q, R) to get a much tighter range. This binning process ensures you receive LEDs with consistent brightness for your project.

Q: How do I achieve uniform color in my product?
A: Order LEDs from the same Dominant Wavelength bin (either AC or AD). Mixing bins can result in visibly different shades of blue.

11. Practical Design and Usage Case

Scenario: Designing a status indicator panel with 10 blue LEDs.
1. Brightness Requirement: Decide on the required brightness. For a high-ambient-light environment, select bin Q or R (71-180 mcd). For a dim environment, bin N or P may suffice.
2. Color Consistency: Specify a single Dominant Wavelength bin (e.g., AC) to ensure all indicators are the same shade of blue.
3. Circuit Design: Use a 5V supply. Calculate the series resistor for each LED: R = (V_supply - V_F) / I_F. Using the worst-case V_F from your selected voltage bin (e.g., D9 max of 3.4V), R = (5V - 3.4V) / 0.020A = 80 Ohms. Use the nearest standard value (82 Ohms). This ensures no LED exceeds 20mA even if its V_F is at the low end of the bin.
4. Layout: Follow the suggested pad layout from the datasheet for reliable soldering.
5. Assembly: Follow the recommended Pb-free reflow profile if applicable. Store opened reels in a dry cabinet if not used immediately.

12. Operating Principle Introduction

This LED is based on a semiconductor heterostructure made of Indium Gallium Nitride (InGaN). When a forward voltage is applied, electrons and holes are injected into the active region where they recombine. This recombination process releases energy in the form of photons (light). The specific composition of the InGaN alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light. For blue emission, a material with a relatively wide bandgap (~2.7 eV) is required. The water-clear epoxy lens serves to protect the semiconductor die and shape the light output, resulting in the wide viewing angle.

13. Technology Trends and Developments

The development of efficient blue LEDs based on InGaN was a foundational achievement in solid-state lighting, enabling the creation of white LEDs (via phosphor conversion) and full-color displays. Current trends in SMD LEDs like this 0603 type continue to focus on increasing luminous efficacy (more light output per electrical watt), improving color rendering and consistency, and enhancing reliability under higher temperature operating conditions. There is also ongoing development in miniaturization beyond the 0603 size (e.g., 0402, 0201 packages) for ultra-compact devices, as well as integration of control electronics within the LED package itself for \"smart\" lighting solutions. The drive for higher efficiency and lower cost per lumen remains a central theme in the industry.