SMD LED 19-223/R7G6C-A01/2T Datasheet - Package 2.0x1.25x0.8mm - Voltage 2.0-2.4V - Multi-Color - English Technical Document

1. Product Overview

The 19-223 is a compact, multi-color Surface Mount Device (SMD) LED designed for modern electronic applications requiring high-density packaging and reliable performance. This component represents a significant advancement over traditional lead-frame LEDs, enabling the development of smaller, lighter, and more efficient end products.

1.1 Core Advantages and Product Positioning

The primary advantage of the 19-223 SMD LED is its miniature footprint. Its significantly reduced size compared to leaded components allows for smaller printed circuit board (PCB) designs, higher component packing density, reduced storage space requirements, and ultimately, the creation of more compact equipment. Its lightweight construction further makes it ideal for portable and miniature applications where weight is a critical factor.

1.2 Target Markets and Applications

This LED is versatile and targets several key application areas:

• Automotive & Instrumentation: Backlighting for dashboard indicators and switches.
• Telecommunications: Status indicators and backlighting in telephones, fax machines, and other communication devices.
• Consumer Electronics: Flat backlighting for liquid crystal displays (LCDs), switch illumination, and symbol lighting.
• General Purpose Indication: A reliable solution for a wide range of status indication needs across various industries.

2. Technical Specifications Deep Dive

This section provides a detailed, objective analysis of the LED's key technical parameters as defined in the datasheet.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed.

• Reverse Voltage (V_R): 5V. This is a relatively low value, emphasizing that this LED is not designed for reverse-bias operation and requires protection in circuits where reverse voltage might occur.
• Continuous Forward Current (I_F): 25 mA for both R7 (Dark Red) and G6 (Brilliant Yellow Green) chips.
• Peak Forward Current (I_FP): 60 mA (duty cycle 1/10 @ 1kHz). This allows for brief pulses of higher current, useful for multiplexing or achieving higher instantaneous brightness.
• Power Dissipation (P_d): 60 mW. This parameter, combined with the forward voltage, dictates the maximum sustainable forward current under given thermal conditions.
• Electrostatic Discharge (ESD) Human Body Model (HBM): 2000V. This indicates a moderate level of ESD robustness, but standard ESD handling precautions are still necessary during assembly.
• Operating & Storage Temperature: -40°C to +85°C (operating), -40°C to +90°C (storage). This wide range ensures reliability in harsh environments.
• Soldering Temperature: Compatible with reflow soldering (peak 260°C for 10 sec max) and hand soldering (350°C for 3 sec max).

2.2 Electro-Optical Characteristics

These are the typical performance parameters measured at Ta=25°C and I_F=20mA, unless otherwise specified.

• Luminous Intensity (I_v): 18.0 - 72.0 mcd (Min - Max range). The typical value falls within this binning range (see Section 3). A tolerance of ±11% applies.
• Viewing Angle (2θ_1/2): 130 degrees (typical). This wide viewing angle is suitable for applications requiring broad visibility.
• Peak Wavelength (λ_p): R7: 639 nm (typical), G6: 575 nm (typical). Defines the spectral peak of the emitted light.
• Dominant Wavelength (λ_d): R7: 631 nm (typical), G6: 573 nm (typical). This is the single wavelength perceived by the human eye, closely related to the color.
• Spectral Bandwidth (Δλ): 20 nm (typical) for both. Indicates the spectral purity of the emitted color.
• Forward Voltage (V_F): 2.00V (typical), 2.40V (max). This low forward voltage is beneficial for low-power and battery-operated devices.
• Reverse Current (I_R): 10 μA (max) at V_R=5V.

3. Binning System Explanation

The luminous output of LEDs varies from unit to unit. A binning system is used to categorize parts based on key performance parameters.

3.1 Luminous Intensity Binning

Both the R7 and G6 chips are sorted into three intensity bins (M, N, P) when driven at I_F=20mA:

• Bin M: 18.0 - 28.5 mcd
• Bin N: 28.5 - 45.0 mcd
• Bin P: 45.0 - 72.0 mcd

This allows designers to select LEDs with consistent brightness levels for their application, ensuring uniform appearance in multi-LED arrays.

4. Performance Curve Analysis

The datasheet provides typical characteristic curves that are crucial for understanding the LED's behavior under different operating conditions.

4.1 Luminous Intensity vs. Forward Current

The curve shows a non-linear relationship. While intensity generally increases with current, the efficiency (lumens per watt) may decrease at higher currents due to increased heat generation. Operating near the maximum continuous current (25mA) requires careful thermal management.

4.2 Luminous Intensity vs. Ambient Temperature

Luminous intensity decreases as ambient temperature rises. This thermal derating is a critical design consideration, especially for applications in high-temperature environments or where the LED is driven at high currents. The forward current derating curve provides the maximum allowable current at elevated temperatures to prevent exceeding the power dissipation limit.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

This exponential curve is fundamental. The LED begins to conduct and emit light at a specific threshold voltage (~1.8V for these devices). A small increase in voltage beyond this point causes a large increase in current. This underscores the necessity of using a current-limiting resistor or constant-current driver to prevent thermal runaway.

4.4 Spectrum Distribution

The graphs show the relative spectral power distribution. The R7 chip emits in the red region (~639nm peak), while the G6 chip emits in the yellow-green region (~575nm peak). The 20nm bandwidth indicates moderately saturated colors.

4.5 Radiation Pattern

The polar diagram confirms the 130-degree viewing angle, showing a near-Lambertian emission pattern where intensity is highest at 0° (perpendicular to the chip) and decreases towards the edges.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a compact SMD package. Key dimensions (in mm, tolerance ±0.1mm unless noted) include a body size of approximately 2.0mm in length, 1.25mm in width, and 0.8mm in height. The datasheet provides a detailed dimensional drawing including pad layout, which is essential for PCB footprint design.

5.2 Polarity Identification

The cathode is typically identified by a marking on the package or a chamfered corner, as shown in the dimension diagram. Correct polarity must be observed during assembly.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The component is compatible with infrared and vapor phase reflow processes. The recommended Pb-free profile includes: a pre-heating stage (150-200°C for 60-120s), a time above liquidus (217°C for 60-150s), a peak temperature of 260°C maximum for 10 seconds maximum, and controlled cooling rates. Reflow should not be performed more than two times.

6.2 Storage and Moisture Sensitivity

The LEDs are packaged in moisture-resistant bags with desiccant. Precautions are critical:

• Do not open the bag until ready for use.
• After opening, use within 168 hours (7 days) if stored at ≤30°C and ≤60% RH.
• If the exposure time is exceeded, a baking treatment (60±5°C for 24 hours) is required before soldering to prevent "popcorning" damage during reflow.

6.3 Design Precautions

• Current Limiting: An external series resistor is mandatory to set the operating current. The steep I-V curve means a slight voltage increase can cause a destructive current surge.
• Mechanical Stress: Avoid applying stress to the LED body during soldering or board handling. Do not warp the PCB after assembly.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The product is supplied in 8mm tape on 7-inch diameter reels, compatible with standard automatic pick-and-place equipment. Each reel contains 2000 pieces. Detailed carrier tape and reel dimensions are provided in the datasheet.

7.2 Label Explanation

The reel label includes codes for:

• Product Number (P/N)
• Packing Quantity (QTY)
• Luminous Intensity Rank (CAT)
• Chromaticity & Dominant Wavelength Rank (HUE)
• Forward Voltage Rank (REF)
• Lot Number (LOT No.)

8. Application Suggestions and Design Considerations

8.1 Typical Application Circuits

The most basic drive circuit consists of a voltage source (V_CC), a current-limiting resistor (R_S), and the LED in series. R_S = (V_CC - V_F) / I_F. For stable brightness over temperature and supply voltage variations, a constant-current driver is recommended.

8.2 Thermal Management

Although small, power dissipation (up to 60mW) must be considered. Ensure adequate copper area on the PCB connected to the LED's thermal pad (if applicable) or surrounding ground plane to act as a heat sink, especially when operating at high ambient temperatures or high currents.

8.3 Optical Design

The wide 130-degree viewing angle may require secondary optics (lenses, light guides) if a more focused beam is needed. The water-clear resin color of the package is suitable for applications where the true chip color is desired.

9. Technical Comparison and Differentiation

The 19-223 LED differentiates itself through its combination of a very small form factor, availability in two distinct colors (red and yellow-green) from the same package footprint, and compliance with modern environmental standards (RoHS, REACH, Halogen-Free). Compared to larger LEDs, it enables significant space savings. The use of AlGaInP material for both colors provides good luminous efficiency.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Why is a current-limiting resistor absolutely necessary?
A: The forward voltage is relatively stable, but the current increases exponentially with small voltage increases above the threshold. Without a resistor, the current can quickly exceed the maximum rating (25mA) and destroy the LED.

Q: Can I drive this LED with a 3.3V or 5V logic supply?
A: Yes, but you must calculate the appropriate series resistor. For example, with a 3.3V supply and a target I_F of 20mA, using a typical V_F of 2.0V: R = (3.3V - 2.0V) / 0.020A = 65 Ohms. A standard 68 Ohm resistor would be suitable.

Q: What does the "±11% tolerance" on luminous intensity mean for my design?
A: It means individual LEDs, even from the same bin, can vary in brightness by up to 11% from the nominal bin value. For applications requiring uniform appearance (e.g., backlight arrays), you may need to select tighter bins or implement current calibration.

11. Practical Design Case Study

Scenario: Designing a compact status indicator panel with four LEDs (two red, two green) for a portable device powered by a 3.7V Li-ion battery.

Design Steps:

1. Current Selection: Choose I_F = 15 mA for a balance of good brightness and lower power consumption, extending battery life.
2. Resistor Calculation: Assuming worst-case V_F = 2.4V. R_S = (3.7V - 2.4V) / 0.015A ≈ 86.7 Ohms. Use a standard 91 Ohm or 100 Ohm resistor.
3. PCB Layout: Place the LEDs with correct polarity. Include a small copper pour connected to the cathode pads to aid in heat dissipation.
4. Thermal Check: Power per LED: P = V_F * I_F ≈ 2.0V * 0.015A = 30mW, well below the 60mW maximum. Total for four LEDs is 120mW, which is manageable on a small board.
5. Storage/Assembly: Schedule PCB assembly to use the LED reels within 7 days of opening the moisture-proof bags.

12. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type material recombine with holes from the p-type material in the active region. This recombination process releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material used. The 19-223 utilizes AlGaInP (Aluminum Gallium Indium Phosphide) material systems, which are efficient emitters in the red to yellow-green spectrum.

13. Technology Trends

The evolution of SMD LEDs like the 19-223 follows several clear industry trends: continuous miniaturization to enable ever-smaller end products, improvements in luminous efficacy (more light output per watt of electrical input), enhanced reliability and longevity, and strict adherence to environmental regulations (halogen-free, RoHS). The drive towards higher-density packaging pushes advancements in thermal management at the package level and more precise binning systems to ensure color and brightness consistency in automated high-volume manufacturing.