SMD LED 12-215/R6C-AR1S1B/3C Datasheet - Size 1.7x1.7x0.7mm - Voltage 1.75-2.35V - Brilliant Red - English Technical Document

1. Product Overview

This document details the technical specifications for the 12-215 series SMD (Surface Mount Device) LED. This component is a brilliant red, mono-color LED designed for modern electronic assembly processes. Its primary advantages include a significantly reduced footprint compared to lead-frame type LEDs, enabling higher packing density on PCBs, reduced storage requirements, and ultimately contributing to more compact end-product designs. The lightweight construction further makes it ideal for miniature and portable applications.

1.1 Core Features and Compliance

The LED is supplied on 8mm tape wound on a 7-inch diameter reel, making it fully compatible with standard automatic pick-and-place equipment for high-volume manufacturing. It is designed to withstand both infrared and vapor phase reflow soldering processes. The product is constructed with Pb-free materials and is compliant with key environmental and safety regulations including the EU RoHS directive, EU REACH, and halogen-free requirements (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). The product itself is maintained within RoHS compliant specifications.

2. Technical Parameters: In-Depth Objective Interpretation

This section provides a detailed, objective analysis of the LED's key performance parameters as defined in the datasheet. All values are specified at an ambient temperature (Ta) of 25°C unless otherwise noted.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not operating conditions. The ratings for this LED are: a maximum reverse voltage (VR) of 5V; a continuous forward current (IF) of 25mA; a peak forward current (IFP) of 60mA permissible only under pulsed conditions (duty cycle 1/10 @ 1kHz); and a maximum power dissipation (Pd) of 60mW. The device can handle an electrostatic discharge (ESD) of 2000V per the Human Body Model (HBM). The operating temperature range is from -40°C to +85°C, with a slightly wider storage temperature range of -40°C to +90°C. The soldering temperature profile is critical: for reflow, a peak of 260°C for a maximum of 10 seconds is specified, while for hand soldering, the iron tip temperature must not exceed 350°C for a maximum of 3 seconds per terminal.

2.2 Electro-Optical Characteristics

The electro-optical characteristics define the device's performance under normal operating conditions. With a forward current (IF) of 20mA, the luminous intensity (Iv) has a typical bin range from 112.0 mcd to 225.0 mcd. The viewing angle (2θ1/2) is a wide 130 degrees. The light output is in the brilliant red spectrum, with a peak wavelength (λp) typically at 632 nm and a dominant wavelength (λd) ranging from 617.5 nm to 633.5 nm depending on the bin. The spectral bandwidth (Δλ) is typically 20 nm. The forward voltage (VF) required to achieve 20mA ranges from 1.75V to 2.35V. The reverse current (IR) is very low, with a maximum of 10 μA when a 5V reverse bias is applied.

3. Binning System Explanation

The LED is classified into bins for key parameters to ensure consistency in application. This allows designers to select parts that meet specific brightness and color requirements.

3.1 Luminous Intensity Binning

Luminous intensity is sorted into three bin codes: R1 (112.0 - 140.0 mcd), R2 (140.0 - 180.0 mcd), and S1 (180.0 - 225.0 mcd), all measured at IF=20mA.

3.2 Dominant Wavelength Binning

The dominant wavelength, which correlates with perceived color, is binned into four codes: E4 (617.5 - 621.5 nm), E5 (621.5 - 625.5 nm), E6 (625.5 - 629.5 nm), and E7 (629.5 - 633.5 nm), measured at IF=20mA.

3.3 Forward Voltage Binning

Forward voltage is binned into three codes: 0 (1.75 - 1.95 V), 1 (1.95 - 2.15 V), and 2 (2.15 - 2.35 V), measured at IF=20mA. The part number suffix (e.g., /3C) likely correlates to specific bin combinations.

4. Performance Curve Analysis

While the specific graphs are not detailed in the provided text, typical electro-optical characteristic curves for such an LED would include several key plots essential for design.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

This curve shows the relationship between the current flowing through the LED and the voltage across its terminals. It is non-linear, with a characteristic \"knee\" voltage (around the typical VF) above which current increases rapidly with small voltage increases. This highlights the critical need for current-limiting circuitry (like a series resistor or constant current driver) to prevent thermal runaway and destruction.

4.2 Luminous Intensity vs. Forward Current

This graph illustrates how light output increases with forward current. It is generally linear within the recommended operating range but will saturate at higher currents. Operating above the absolute maximum rating leads to efficiency drop and accelerated degradation.

4.3 Luminous Intensity vs. Ambient Temperature

The light output of an LED decreases as the junction temperature rises. This curve is crucial for applications operating in elevated temperature environments, as it helps designers derate the expected brightness or implement thermal management to maintain performance.

4.4 Spectral Distribution

A plot of relative intensity versus wavelength, showing the peak at ~632 nm and the ~20 nm spectral bandwidth, confirming the monochromatic brilliant red output.

5. Mechanical and Package Information

5.1 Package Dimensions and Polarity Identification

The LED has a compact, rectangular SMD package. A dimensioned drawing indicates a body size of approximately 1.7mm in length and width, with a height of around 0.7mm (specific tolerances are ±0.1mm unless noted). Polarity is clearly marked: the cathode is identified by a distinctive mark on the top of the package and a corresponding chamfer or notch on one side of the bottom view. Correct polarity orientation during assembly is mandatory for proper function.

6. Soldering and Assembly Guidelines

Proper handling and soldering are critical to reliability.

6.1 Current Limiting Requirement

An external current-limiting resistor or circuit is absolutely required. The LED's exponential I-V characteristic means a small increase in voltage can cause a large, destructive increase in current.

6.2 Storage and Moisture Sensitivity

The LEDs are packaged in a moisture-resistant bag with desiccant. The bag should not be opened until ready for use. Before opening, store at ≤30°C and ≤90% RH. After opening, the \"floor life\" is 1 year under ≤30°C and ≤60% RH. Unused parts should be resealed. If the desiccant indicator changes color or storage time is exceeded, a baking treatment at 60±5°C for 24 hours is required before reflow soldering.

6.3 Reflow Soldering Profile

A Pb-free reflow profile is specified. Key parameters include: a pre-heating stage between 150-200°C for 60-120 seconds; a time above liquidus (217°C) of 60-150 seconds; a peak temperature not exceeding 260°C, held for a maximum of 10 seconds; and maximum ramp-up and cool-down rates of 6°C/sec and 3°C/sec, respectively. Reflow should not be performed more than twice. Avoid mechanical stress on the package during heating and do not warp the PCB after soldering.

6.4 Hand Soldering and Repair

If hand soldering is necessary, use a soldering iron with a tip temperature <350°C, apply heat to each terminal for ≤3 seconds, and use a low-power iron (<25W). Allow a cooling interval of >2 seconds between terminals. Repair after initial soldering is discouraged. If unavoidable, a dual-head soldering iron must be used to simultaneously heat both terminals and avoid damaging the internal wire bonds due to thermal stress.

7. Packaging and Ordering Information

7.1 Reel and Tape Specifications

The components are delivered in embossed carrier tape on 7-inch diameter reels. Each reel contains 3000 pieces. Detailed dimensions for the carrier tape pockets and the reel are provided to ensure compatibility with automated feeders.

7.2 Label Explanation

The reel label contains several key fields: CPN (Customer's Product Number), P/N (Product Number), QTY (Packing Quantity), CAT (Luminous Intensity Rank/bin), HUE (Chromaticity/Dominant Wavelength Rank/bin), REF (Forward Voltage Rank/bin), and LOT No (Traceable Lot Number).

8. Application Suggestions

8.1 Typical Application Scenarios

This LED is well-suited for various indicator and backlighting roles. Common applications include backlighting for automotive dashboards and switches; status indicators and keypad backlighting in telecommunication devices like phones and fax machines; flat backlighting for small LCDs, switches, and symbols; and general-purpose indicator use in consumer electronics.

8.2 Design Considerations

Designers must consider several factors: 1) Always implement a series resistor or constant-current driver based on the supply voltage and the LED's forward voltage bin. 2) Account for thermal effects on luminous intensity, especially in enclosed spaces or high ambient temperatures. 3) Ensure the PCB pad layout matches the package dimensions and allows for proper solder fillet formation. 4) Follow the strict moisture sensitivity and reflow profile guidelines to prevent package cracking or delamination.

9. Technical Comparison and Differentiation

Compared to older through-hole LEDs, this SMD type offers a drastic reduction in size and weight, enabling modern miniaturized designs. The wide 130-degree viewing angle provides good off-axis visibility, which is advantageous for panel indicators. The use of AlGaInP semiconductor material is typical for high-efficiency red and amber LEDs, offering good brightness. Compliance with modern environmental standards (Pb-free, halogen-free) is a key differentiator for products targeting global markets with strict regulations.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Why is a current-limiting resistor mandatory?
A: The LED's forward voltage has a negative temperature coefficient and a sharp I-V curve. Without a resistor, any small increase in supply voltage or decrease in VF due to heating causes an exponential rise in current, leading to immediate failure.

Q: What do the bin codes (R1, E5, 0) mean for my design?
A: They specify the guaranteed ranges for brightness (CAT), color (HUE), and voltage (REF). For consistent appearance in a multi-LED array, specify tight bins for HUE and CAT. For power supply design, the voltage bin determines the resistor value calculation.

Q: Can I use this LED outdoors?
A: The operating temperature range extends to -40°C to +85°C, which covers many outdoor conditions. However, prolonged exposure to UV radiation and moisture may degrade the epoxy resin over time. For harsh environments, consider LEDs with conformal coating or specifically rated for outdoor use.

Q: How many times can I reflow this LED?
A: The datasheet explicitly states reflow soldering should not be done more than two times. Each reflow cycle subjects the package to thermal stress, potentially weakening internal bonds or causing delamination.

11. Practical Use Case Example

Scenario: Designing a status indicator panel with 10 uniform red LEDs.
1. Parameter Selection: Choose bins for consistency. Select HUE bin E6 (625.5-629.5 nm) and CAT bin R2 (140.0-180.0 mcd) for balanced color and brightness. Assume VF bin 1 (1.95-2.15V).
2. Circuit Design: Using a 5V supply. For the worst-case VF_min (1.95V), the required series resistor R = (Vsupply - VF) / IF = (5V - 1.95V) / 0.020A = 152.5Ω. For VF_max (2.15V), R = (5V - 2.15V) / 0.020A = 142.5Ω. Selecting a standard 150Ω resistor keeps the current between 19mA and 20.3mA, within the 25mA limit, and ensures consistent brightness across all units.
3. Layout: Place the 150Ω resistor in series with each LED. Follow the package drawing for the 1.7x1.7mm land pattern, ensuring correct cathode orientation.
4. Assembly: Follow the moisture storage and Pb-free reflow profile guidelines strictly.

12. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type material recombine with holes from the p-type material in the active region (composed of AlGaInP in this case). This recombination process releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material used. The epoxy resin package serves to protect the semiconductor chip, shape the light output beam (resulting in the 130° viewing angle), and provide the mechanical structure for soldering.

13. Technology Trends

The general trend in SMD LEDs continues toward higher efficiency (more lumens per watt), increased power density in smaller packages, and improved color rendering and consistency. There is also a strong drive for broader adoption of environmentally friendly materials and manufacturing processes. Integration of control electronics (like constant-current drivers) directly into LED packages is another evolving area, simplifying circuit design for the end user. For indicator-type LEDs, the focus remains on reliability, miniaturization, and cost-effectiveness for high-volume automated assembly.