Table of Contents
- 1. Product Overview
- 1.1 Core Advantages and Product Positioning
- 1.2 Target Market and Applications
- 2. In-Depth Technical Parameter Analysis
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics (Ta=25°C)
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 3.3 Forward Voltage Binning
- 4. Mechanical and Package Information
- 4.1 Package Dimensions and Polarity
- 4.2 Packaging Specifications
- 5. Soldering and Assembly Guidelines
- 5.1 Reflow Soldering Profile
- 5.2 Hand Soldering Precautions
- 5.3 Moisture Sensitivity and Storage
- 6. Application Design Considerations
- 6.1 Circuit Design
- 6.2 Thermal Management
- 6.3 Optical Design
- 7. Technical Comparison and Differentiation
- 8. Frequently Asked Questions (FAQs)
- 9. Practical Design and Usage Examples
- 10. Operating Principle and Technology
- 11. Industry Trends and Context
1. Product Overview
The 19-213 is a surface-mount device (SMD) LED designed for a wide range of indicator and backlighting applications. Utilizing AlGaInP chip technology, it emits a brilliant red color. Its compact SMD package enables significant advantages in modern electronic design, including reduced board space, higher packing density, and suitability for automated assembly processes, making it ideal for miniaturized and high-volume production.
1.1 Core Advantages and Product Positioning
The primary advantage of this component is its miniature footprint, which directly contributes to smaller final product sizes and reduced storage requirements. It is fully compatible with standard infrared and vapor phase reflow soldering processes, aligning with modern, efficient PCB assembly lines. The product is compliant with key environmental regulations: it is Pb-free, RoHS compliant, REACH compliant, and meets halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). This makes it suitable for global markets with strict environmental controls. Its lightweight construction further enhances its use in portable and miniature applications.
1.2 Target Market and Applications
This LED is targeted at consumer electronics, industrial controls, and automotive interior applications. Specific use cases include:
- Backlighting for instrument cluster dashboards, switches, and control panels.
- Status indicators and keypad backlighting in telecommunication devices such as telephones and fax machines.
- Flat backlighting for LCD displays, symbols, and signage.
- General-purpose indicator applications across various electronic devices.
2. In-Depth Technical Parameter Analysis
Understanding the electrical and optical limits is critical for reliable circuit design and ensuring long-term performance.
2.1 Absolute Maximum Ratings
These ratings define the stress limits beyond which permanent damage to the device may occur. Operation should always be maintained within these limits.
- Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
- Continuous Forward Current (IF): 25 mA. The recommended operating current is 20 mA; 25 mA is the absolute maximum.
- Peak Forward Current (IFP): 60 mA. This is permissible only under pulsed conditions (duty cycle 1/10 @ 1 kHz) and must not be used for DC operation.
- Power Dissipation (Pd): 60 mW. This is the maximum power the package can dissipate at 25°C ambient temperature.
- Electrostatic Discharge (ESD) Human Body Model (HBM): 2000 V. Proper ESD handling procedures are necessary during assembly and handling.
- Operating Temperature (Topr): -40 to +85 °C. The device is rated for industrial temperature ranges.
- Storage Temperature (Tstg): -40 to +90 °C.
- Soldering Temperature: Reflow soldering peak temperature should not exceed 260°C for 10 seconds. For hand soldering, the iron tip temperature should be <350°C for <3 seconds per terminal.
2.2 Electro-Optical Characteristics (Ta=25°C)
These are the typical performance parameters measured at the standard test condition of 20 mA forward current.
- Luminous Intensity (Iv): 45 - 112 mcd (millicandela). The wide range is managed through a binning system (see Section 3).
- Viewing Angle (2θ1/2): 120 degrees (typical). This wide viewing angle makes it suitable for applications where visibility from various angles is important.
- Peak Wavelength (λp): 632 nm (typical). This is the wavelength at which the spectral power distribution is maximum.
- Dominant Wavelength (λd): 617.5 - 633.5 nm. This defines the perceived color of the light and is also subject to binning.
- Spectral Bandwidth (Δλ): 20 nm (typical). This indicates the spectral purity of the red emission.
- Forward Voltage (VF): 1.75 - 2.35 V at IF=20mA. A current-limiting resistor must be used in series with the LED to set the operating current based on the supply voltage and the specific VF of the LED (which varies by bin).
- Reverse Current (IR): < 10 µA at VR=5V.
3. Binning System Explanation
To ensure consistent color and brightness in production, LEDs are sorted into bins based on key parameters. The 19-213 uses a three-dimensional binning system.
3.1 Luminous Intensity Binning
LEDs are categorized into four bins (P1, P2, Q1, Q2) based on their measured luminous intensity at 20 mA. This allows designers to select the appropriate brightness level for their application, ensuring visual consistency across multiple units.
- P1: 45 - 57 mcd
- P2: 57 - 72 mcd
- Q1: 72 - 90 mcd
- Q2: 90 - 112 mcd
3.2 Dominant Wavelength Binning
The color (hue) is controlled by sorting LEDs into four wavelength bins (E4, E5, E6, E7). This is crucial for applications where color matching between multiple LEDs is important.
- E4: 617.5 - 621.5 nm
- E5: 621.5 - 625.5 nm
- E6: 625.5 - 629.5 nm
- E7: 629.5 - 633.5 nm
3.3 Forward Voltage Binning
Forward voltage is sorted into three bins (0, 1, 2). Knowing the VF bin is essential for accurate current-limiting resistor calculation, especially in battery-powered applications where efficiency is critical.
- 0: 1.75 - 1.95 V
- 1: 1.95 - 2.15 V
- 2: 2.15 - 2.35 V
The full part number 19-213/R6C-AP1Q2B/3T includes codes that specify these bin selections, allowing for precise component specification.
4. Mechanical and Package Information
4.1 Package Dimensions and Polarity
The LED is housed in a standard SMD package. The cathode is marked on the device body. Detailed dimensional drawings are provided in the datasheet, with critical tolerances of ±0.1mm. Designers must adhere to the recommended PCB land pattern to ensure proper soldering and alignment.
4.2 Packaging Specifications
The components are supplied on 8mm wide carrier tape wound onto 7-inch diameter reels. Each reel contains 3000 pieces. The packaging includes moisture-resistant measures: the reel is placed inside an aluminum moisture-proof bag along with a desiccant and an indicator label. This is essential for components sensitive to moisture absorption before soldering.
5. Soldering and Assembly Guidelines
Proper handling and soldering are vital to prevent damage and ensure reliability.
5.1 Reflow Soldering Profile
A lead-free (Pb-free) reflow profile is specified. Key parameters include:
- Pre-heating between 150-200°C for 60-120 seconds.
- Time above liquidus (217°C): 60-150 seconds.
- Peak temperature: 260°C maximum, held for no more than 10 seconds.
- Maximum heating rate: 6°C/sec; maximum cooling rate: 3°C/sec.
Reflow soldering should not be performed more than two times on the same LED.
5.2 Hand Soldering Precautions
If hand soldering is necessary, extreme care must be taken:
- Use a soldering iron with a tip temperature less than 350°C.
- Limit soldering time per terminal to 3 seconds or less.
- Use an iron with a power rating of 25W or less.
- Allow a cooling interval of at least 2 seconds between soldering each terminal.
5.3 Moisture Sensitivity and Storage
This component is moisture-sensitive. Adhere to the following storage conditions:
- Before opening: Store at ≤ 30°C and ≤ 90% Relative Humidity (RH).
- After opening: The "floor life" is 1 year under ≤ 30°C and ≤ 60% RH. Unused LEDs must be resealed in a moisture-proof bag with fresh desiccant.
- Baking: If the desiccant indicator shows saturation or the storage time is exceeded, bake the LEDs at 60 ± 5°C for 24 hours before use.
6. Application Design Considerations
6.1 Circuit Design
Current Limiting is Mandatory: An external series resistor is absolutely required to set the forward current. The LED's V-I characteristic is exponential; a small increase in voltage can cause a large, destructive increase in current. The resistor value (R) is calculated as R = (Vsupply - VF) / IF. Always use the maximum VF from the bin or datasheet for a conservative design that ensures IF never exceeds 20 mA under worst-case conditions.
6.2 Thermal Management
While the power dissipation is low (60 mW max), proper PCB layout can enhance longevity. Ensure adequate copper area around the LED pads to act as a heat sink, especially if operating at high ambient temperatures or near the maximum current.
6.3 Optical Design
The 120-degree viewing angle provides wide emission. For applications requiring directed light, secondary optics (lenses, light pipes) may be used. The water-clear resin lens is suitable for use with external color filters if a specific shade of red is needed.
7. Technical Comparison and Differentiation
The 19-213 differentiates itself through its combination of a standard, widely compatible SMD footprint, a well-defined binning structure for color and brightness consistency, and compliance with modern environmental standards. Compared to larger through-hole LEDs, it offers significant space savings and compatibility with automated assembly. Within the SMD red LED segment, its specific AlGaInP technology provides efficient red emission, and its detailed datasheet with clear binning and application notes supports robust design-in.
8. Frequently Asked Questions (FAQs)
Q: Can I drive this LED directly from a 3.3V or 5V logic supply?
A: No. You must always use a series current-limiting resistor. For example, with a 5V supply and a typical VF of 2.0V at 20mA, the resistor value would be (5V - 2V) / 0.02A = 150 Ohms. A 150-ohm resistor would be a good starting point.
Q: What does the "water clear" resin color mean?
A> It means the encapsulating lens of the LED is transparent, not diffused or tinted. The red color comes entirely from the light emitted by the semiconductor chip itself. This often results in a more saturated color appearance.
Q: How do I interpret the part number for ordering?
A> The suffix (e.g., /R6C-AP1Q2B/3T) contains codes for the performance bins. "Q2" likely refers to the luminous intensity bin (Q2: 90-112 mcd), and other characters specify the wavelength and voltage bins. Consult the manufacturer's detailed bin code guide for precise interpretation when consistency is critical.
Q: Is this LED suitable for automotive exterior lighting?
A> The datasheet includes an application restriction note advising that high-reliability applications like automotive safety/security systems may require a different product. For such applications, it is essential to verify with the component supplier if this specific part is qualified to the necessary automotive standards (e.g., AEC-Q102).
9. Practical Design and Usage Examples
Example 1: Dashboard Switch Backlighting. A cluster of five 19-213 LEDs is used to backlight a rocker switch. They are connected in parallel, each with its own 180-ohm resistor to a 12V automotive rail (derated for vehicle voltage transients). The wide viewing angle ensures even illumination across the switch graphic. The Q2 brightness bin is selected for good visibility in daylight.
Example 2: PCB Status Indicator. A single LED with a 1kΩ resistor is connected to a 3.3V microcontroller GPIO pin. The microcontroller drives the pin high to turn on the LED. The low current draw (approx. 1.3mA) minimizes power consumption in a battery-powered device. The E6 wavelength bin provides a consistent, standard red indicator color.
10. Operating Principle and Technology
The 19-213 LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. When a forward voltage is applied across the p-n junction, electrons and holes recombine in the active region, releasing energy in the form of photons. The specific composition of the AlGaInP alloy is engineered to produce photons in the red portion of the visible spectrum (approximately 632 nm). The generated light is emitted through a transparent epoxy lens, which also provides mechanical and environmental protection for the semiconductor die.
11. Industry Trends and Context
SMD LEDs like the 19-213 represent the mainstream in indicator and low-power lighting due to their manufacturability and cost-effectiveness. The industry trend continues towards higher efficiency (more lumens per watt), improved color consistency through tighter binning, and increased integration (e.g., LEDs with built-in current regulators or drivers). Environmental compliance (RoHS, REACH, halogen-free) has become a standard requirement. For red indicators, AlGaInP remains a dominant technology due to its efficiency and color quality, though other materials are used for different colors (e.g., InGaN for blue and green).
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |