SMD LED 19-219/R6C-AM1N2VY/3T Datasheet - Size 1.6x0.8x0.65mm - Voltage 1.7-2.2V - Brilliant Red - English Technical Document

1. Product Overview

The 19-219 is a surface-mount device (SMD) LED designed for high-density, miniature applications. It utilizes AlGaInP chip technology to produce a brilliant red light output. Its primary advantage lies in its compact size, which enables significant reductions in PCB footprint, storage space, and overall equipment size compared to traditional lead-frame LEDs. The component is lightweight and compliant with modern manufacturing and environmental standards, including RoHS, REACH, and halogen-free requirements.

1.1 Core Features and Advantages

• Ultra-Compact Package: The small form factor (1.6mm x 0.8mm) allows for higher packing density and miniaturization of end products.
• Manufacturing Compatibility: Supplied in 8mm tape on 7-inch reels, making it fully compatible with automated pick-and-place assembly equipment.
• Robust Soldering: Compatible with both infrared and vapor phase reflow soldering processes, suitable for high-volume production.
• Environmental Compliance: The product is Pb-free, RoHS compliant, REACH compliant, and meets halogen-free specifications (Br <900ppm, Cl <900ppm, Br+Cl <1500ppm).
• Mono-Color Type: Emits a single, brilliant red color.

1.2 Target Applications

This LED is ideal for applications requiring small, reliable indicator lights or backlighting in confined spaces.

• Backlighting for instrument panel dashboards and switches.
• Status indicators and keypad backlighting in telecommunication devices (telephones, fax machines).
• Flat backlighting for LCD panels, switches, and symbols.
• General-purpose indicator applications across consumer and industrial electronics.

2. Technical Specifications and Objective Interpretation

This section provides a detailed breakdown of the absolute maximum ratings and standard electro-optical characteristics. All data is measured at an ambient temperature (Ta) of 25°C unless otherwise specified.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Continuous Forward Current (I_F): 25 mA. The DC current that can be continuously applied.
• Peak Forward Current (I_FP): 60 mA (at 1/10 duty cycle, 1kHz). For pulsed operation only.
• Power Dissipation (P_d): 60 mW. The maximum allowable power loss as heat.
• Electrostatic Discharge (ESD) Human Body Model (HBM): 2000 V. Indicates a moderate level of ESD sensitivity; standard ESD handling precautions are necessary.
• Operating Temperature (T_opr): -40°C to +85°C. The ambient temperature range for reliable operation.
• Storage Temperature (T_stg): -40°C to +90°C.
• Soldering Temperature: Reflow: 260°C max for 10 seconds. Hand soldering: 350°C max for 3 seconds per terminal.

2.2 Electro-Optical Characteristics

Typical performance parameters measured at I_F = 5mA.

• Luminous Intensity (I_v): 18 - 45 mcd (millicandela). A measure of perceived brightness. The wide range is managed through binning (see Section 3).
• Viewing Angle (2θ_1/2): 130 degrees (typical). This wide viewing angle makes it suitable for applications where the LED may not be viewed head-on.
• Peak Wavelength (λ_p): 632 nm (typical). The wavelength at which the spectral output is strongest.
• Dominant Wavelength (λ_d): 617.5 - 633.5 nm. The single-wavelength perception of the emitted color, which is also binned.
• Spectral Bandwidth (Δλ): 20 nm (typical). The width of the emitted spectrum at half its maximum intensity.
• Forward Voltage (V_F): 1.7 - 2.2 V. The voltage drop across the LED when conducting 5mA. This parameter is binned for design consistency.
• Reverse Current (I_R): 10 μA max at V_R=5V. A measure of leakage current in the off-state.

Note on Tolerances: Luminous intensity has a ±11% tolerance, dominant wavelength ±1nm, and forward voltage ±0.05V from the binned values.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins. The 19-219 uses three independent binning parameters.

3.1 Luminous Intensity Binning

LEDs are sorted into four bins (M1, M2, N1, N2) based on their measured luminous intensity at 5mA.

• M1: 18.0 - 22.5 mcd
• M2: 22.5 - 28.5 mcd
• N1: 28.5 - 36.0 mcd
• N2: 36.0 - 45.0 mcd

3.2 Dominant Wavelength Binning

LEDs are sorted into four bins (E3, E4, E5, E6) to control the precise shade of red.

• E3: 617.5 - 621.5 nm
• E4: 621.5 - 625.5 nm
• E5: 625.5 - 629.5 nm
• E6: 629.5 - 633.5 nm

3.3 Forward Voltage Binning

LEDs are sorted into five bins (19, 20, 21, 22, 23) to group devices with similar electrical characteristics, aiding in current matching for multi-LED designs.

• 19: 1.7 - 1.8 V
• 20: 1.8 - 1.9 V
• 21: 1.9 - 2.0 V
• 22: 2.0 - 2.1 V
• 23: 2.1 - 2.2 V

4. Performance Curve Analysis

The datasheet provides several key graphs that illustrate the LED's behavior under varying conditions.

4.1 Relative Luminous Intensity vs. Ambient Temperature

This curve shows that luminous intensity decreases as ambient temperature increases. The output is relatively stable from -40°C to approximately 25°C but shows a more pronounced decline at higher temperatures, typical of LED behavior due to increased non-radiative recombination.

4.2 Forward Current Derating Curve

This graph defines the maximum allowable forward current as a function of ambient temperature. To prevent overheating and ensure long-term reliability, the forward current must be reduced when operating at high ambient temperatures (above ~25°C).

4.3 Forward Current vs. Forward Voltage (I-V Curve)

This fundamental characteristic shows the exponential relationship between current and voltage. The curve is essential for designing the current-limiting circuitry (usually a series resistor). The "knee" of the curve, where conduction begins, is around 1.6V to 1.7V.

4.4 Luminous Intensity vs. Forward Current

This plot demonstrates that light output increases with forward current, but the relationship is not perfectly linear, especially at higher currents. It helps designers choose an operating point that balances brightness with efficiency and device stress.

4.5 Spectrum Distribution

The spectral output graph shows a single peak centered around 632 nm (typical), confirming the monochromatic brilliant red emission with a typical full width at half maximum (FWHM) of 20 nm.

4.6 Radiation Pattern

The polar diagram illustrates the 130-degree viewing angle, showing the angular distribution of light intensity, which is nearly Lambertian (cosine distribution).

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a very compact footprint with the following key dimensions (in mm, tolerances ±0.1mm unless noted):

• Length: 1.60
• Width: 0.80
• Height: 0.65 ±0.1
• Land pad (cathode) dimensions: 0.70 x 0.20 ±0.05

5.2 Polarity Identification and Pad Design

The cathode (negative terminal) is clearly marked on the top of the package. The recommended solder pad layout is provided to ensure a reliable solder joint and proper alignment during reflow. The datasheet notes that the pad dimensions are for reference and can be modified based on specific PCB design requirements.

6. Soldering and Assembly Guidelines

Proper handling is critical for the reliability of SMD components.

6.1 Reflow Soldering Profile (Pb-free)

A specific temperature profile is recommended:

• Pre-heating: 150-200°C for 60-120 seconds.
• Time Above Liquidus (TAL): 60-150 seconds above 217°C.
• Peak Temperature: Maximum of 260°C, held for a maximum of 10 seconds.
• Heating/Cooling Rate: Maximum 6°C/sec heating, 3°C/sec cooling.

Critical Note: Reflow soldering should not be performed more than two times on the same LED.

6.2 Hand Soldering

If hand soldering is necessary, extreme care must be taken:

• Use a soldering iron with a tip temperature less than 350°C.
• Limit soldering time to 3 seconds per terminal.
• Use an iron with a capacity of 25W or less.
• Allow an interval of at least 2 seconds between soldering each terminal to prevent thermal shock.

6.3 Storage and Moisture Sensitivity

The LEDs are packaged in a moisture-resistant bag with desiccant.

• Before Opening: Store at ≤30°C and ≤90% Relative Humidity (RH).
• After Opening (Floor Life): 1 year under ≤30°C and ≤60% RH. Unused LEDs should be resealed in a moisture-proof package.
• Baking: If the desiccant indicator changes color or the storage time is exceeded, bake the LEDs at 60 ±5°C for 24 hours before use in a reflow process.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The components are supplied in an 8mm wide embossed carrier tape wound on a standard 7-inch (178mm) diameter reel. Each reel contains 3000 pieces.

7.2 Label Explanation

The reel label contains several key codes that identify the specific binned characteristics of the LEDs on that reel:

• CAT: Luminous Intensity Rank (e.g., M1, N2).
• HUE: Chromaticity/Dominant Wavelength Rank (e.g., E4, E5).
• REF: Forward Voltage Rank (e.g., 20, 21).
• Other information includes Customer Part Number (CPN), Manufacturer Part Number (P/N), Quantity (QTY), and Lot Number (LOT No).

8. Application Design Considerations

8.1 Current Limiting is Mandatory

The datasheet explicitly warns that an external current-limiting resistor must be used. LEDs exhibit a sharp exponential I-V characteristic; a small increase in voltage can cause a large, potentially destructive increase in current. The resistor value (R) can be calculated using Ohm's Law: R = (V_supply - V_F) / I_F, where V_F is the forward voltage from the bin or typical characteristics, and I_F is the desired operating current (≤25mA DC).

8.2 Thermal Management

While a low-power device, thermal considerations are still important for longevity. Adhere to the forward current derating curve at elevated ambient temperatures. Ensure the PCB pad design provides adequate thermal relief if necessary, though the recommended pad is primarily for electrical and mechanical connection.

8.3 ESD Protection

With an ESD rating of 2000V (HBM), standard ESD precautions should be followed during handling and assembly to prevent latent damage.

9. Technical Comparison and Differentiation

The 19-219 LED's primary differentiators are its combination of a very small 1.6mm x 0.8mm footprint with a relatively wide 130-degree viewing angle and its comprehensive three-parameter binning system (Intensity, Wavelength, Voltage). This allows designers to achieve consistent optical performance in space-constrained applications where visual uniformity is critical, such as in multi-LED backlight arrays or indicator panels. Compared to larger SMD LEDs or through-hole LEDs, it offers superior density. Compared to other miniature LEDs, its detailed binning provides greater control over the final product's appearance.

10. Frequently Asked Questions (FAQ)

10.1 What resistor value should I use with a 5V supply?

Using the maximum typical V_F of 2.2V and a target I_F of 20mA for a safety margin: R = (5V - 2.2V) / 0.020A = 140 Ohms. The nearest standard value of 150 Ohms would result in I_F ≈ 18.7mA, which is safe and provides good brightness. Always verify with the actual V_F from your specific bin.

10.2 Can I drive this LED without a resistor using a constant current source?

Yes, a constant current driver set to the desired current (e.g., 20mA) is an excellent alternative to a series resistor and provides more stable performance over temperature and voltage variations.

10.3 Why is the luminous intensity range so wide (18-45 mcd)?

This is the natural variation in the manufacturing process. The binning system (M1, M2, N1, N2) sorts the LEDs into much tighter groups. For consistent brightness in an application, specify and use LEDs from the same luminous intensity bin.

10.4 How do I interpret the part number 19-219/R6C-AM1N2VY/3T?

The part number is a manufacturer-specific code. The critical selection information is contained in the separate bin codes on the reel label (CAT, HUE, REF), which define the actual luminous intensity, dominant wavelength, and forward voltage of the devices.

11. Design and Usage Case Study

Scenario: Designing a compact status indicator panel with 20 uniformly bright red LEDs.

1. Specification: Select the N1 luminous intensity bin (28.5-36.0 mcd) for adequate brightness. Choose the E4 wavelength bin (621.5-625.5 nm) for a consistent red hue. The forward voltage bin is less critical for uniformity if using individual series resistors but selecting the same bin (e.g., 20) can simplify resistor value calculation.
2. Schematic: Each LED is connected in parallel from the common voltage rail (e.g., 3.3V), each with its own current-limiting resistor. The resistor value is calculated based on the nominal V_F of the selected voltage bin.
3. PCB Layout: Use the recommended or a modified solder pad layout. Ensure the cathode marking on the PCB silkscreen matches the LED's polarity. Group the LEDs closely for the panel effect.
4. Assembly: Follow the reflow soldering profile precisely. Do not exceed two reflow cycles. Store opened reels properly if not used immediately.
5. Result: A high-density indicator panel with consistent color and brightness, enabled by the small size and precise binning of the 19-219 LED.

12. Technology Principle Introduction

The 19-219 LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. When a forward voltage is applied across the p-n junction, electrons and holes are injected into the active region where they recombine. In AlGaInP LEDs, this recombination releases energy in the form of photons (light) in the red to amber part of the visible spectrum. The specific composition of the AlGaInP layers determines the peak wavelength, which in this case is tuned for brilliant red emission around 632 nm. The epoxy resin encapsulant is water-clear to maximize light extraction and also serves to protect the semiconductor chip.

13. Industry Trends and Developments

The market for miniature SMD LEDs like the 19-219 continues to be driven by the trend towards ever-smaller and thinner electronic devices. Key developments in the broader LED industry that influence such components include:

• Increased Efficiency: Ongoing material and process improvements lead to higher luminous efficacy (more light output per electrical watt), allowing for lower operating currents and reduced power consumption in end products.
• Enhanced Color Consistency: Advanced binning and wafer-level testing enable tighter control over chromaticity and intensity, which is critical for applications like display backlighting where uniformity is paramount.
• Improved Reliability and Lifetime: Refinements in packaging materials and chip design continue to extend operational lifespans and robustness against thermal and environmental stress.
• Integration: While discrete LEDs remain essential, there is a parallel trend towards integrated LED modules and light guides for more complex lighting solutions, though discrete components offer maximum design flexibility for custom layouts.

The 19-219 represents a mature, well-characterized component that benefits from these ongoing industry advancements in materials science and manufacturing precision.