SMD LED 19-217/R6C-P1Q2/3T Datasheet - Brilliant Red - 20mA - 2.0V - English Technical Document

1. Product Overview

The 19-217 is a surface-mount device (SMD) LED designed for general-purpose indicator and backlighting applications. It utilizes an AlGaInP chip to produce a brilliant red light output. Its compact SMD package enables significant advantages in modern electronic design, including reduced board space, higher component packing density, and overall miniaturization of end equipment. The device is compliant with key environmental and safety standards, including RoHS, REACH, and halogen-free requirements.

1.1 Core Advantages and Target Market

The primary advantages of this LED stem from its miniature SMD form factor. Compared to traditional lead-frame LEDs, it allows for smaller printed circuit board (PCB) designs, reduced storage space requirements, and lighter final products. This makes it particularly suitable for applications where space and weight are critical constraints. The device is targeted at a broad range of markets including consumer electronics, telecommunications equipment (e.g., phones, fax machines), automotive dashboard and switch backlighting, and general indicator applications where a reliable, compact red light source is needed.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters defined in the datasheet. Understanding these limits and typical values is crucial for reliable circuit design.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not operating conditions.

• Reverse Voltage (VR): 5V - Applying a reverse bias voltage exceeding 5V can cause junction breakdown.
• Forward Current (IF): 25mA - The maximum continuous DC current that can be passed through the LED.
• Peak Forward Current (IFP): 60mA - A pulsed current limit (1/10 duty cycle, 1kHz) for brief, high-intensity flashes. Exceeding the continuous current rating without proper pulsing will lead to overheating.
• Power Dissipation (Pd): 60mW - The maximum power the package can dissipate as heat, calculated as Forward Voltage (VF) * Forward Current (IF).
• ESD (HBM): 2000V - The LED has a Human Body Model electrostatic discharge rating of 2kV. Proper ESD handling precautions are necessary during assembly.
• Operating & Storage Temperature: -40°C to +85°C / -40°C to +90°C - Specifies the full environmental range for use and non-operating storage.
• Soldering Temperature: The device can withstand reflow soldering with a peak temperature of 260°C for up to 10 seconds, or hand soldering at 350°C for up to 3 seconds per terminal.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of Ta=25°C and IF=20mA, unless otherwise specified. They define the typical performance of the LED.

• Luminous Intensity (Iv): 45.0 - 112 mcd (Typ. not specified) - The amount of visible light emitted. The wide range indicates a binning system is used (see Section 3). The test current is 20mA.
• Viewing Angle (2θ1/2): 120° (Typical) - The angle at which the luminous intensity is half of the intensity at 0° (on-axis). This is a very wide viewing angle, suitable for applications requiring broad visibility.
• Peak Wavelength (λp): 632 nm (Typical) - The wavelength at which the optical output power is maximum. For AlGaInP red LEDs, this typically falls in the orange-red to red region.
• Dominant Wavelength (λd): 624 nm (Typical) - The single wavelength perceived by the human eye that matches the color of the LED light. It is often slightly shorter than the peak wavelength for red LEDs.
• Spectral Bandwidth (Δλ): 20 nm (Typical) - The width of the emitted spectrum at half the maximum power (FWHM). A value of 20nm indicates a relatively pure color.
• Forward Voltage (VF): 1.7V - 2.4V (Typ. 2.0V) - The voltage drop across the LED when driven at 20mA. Designers must use this to calculate the required current-limiting resistor value. The typical value of 2.0V is a key design parameter.
• Reverse Current (IR): 10 μA Max. - The small leakage current that flows when the specified reverse voltage (5V) is applied.

3. Binning System Explanation

The datasheet outlines a luminous intensity binning system to ensure consistency in brightness for production applications. The specific device code "P1Q2" in the part number refers to its bin.

• Bin Code P1: Luminous Intensity from 45.0 mcd to 57.0 mcd.
• Bin Code P2: Luminous Intensity from 57.0 mcd to 72.0 mcd.
• Bin Code Q1: Luminous Intensity from 72.0 mcd to 90.0 mcd.
• Bin Code Q2: Luminous Intensity from 90.0 mcd to 112 mcd.

The part number suffix "P1Q2/3T" indicates this specific device falls into the Q2 bin for luminous intensity. Designers can select the appropriate bin based on the required brightness level for their application. The datasheet also notes a general tolerance of ±11% on luminous intensity within a bin.

4. Performance Curve Analysis

While the PDF references "Typical Electro-Optical Characteristics Curves," the specific graphs are not provided in the text. Based on standard LED behavior, these curves would typically include:

• IV Curve (Current vs. Voltage): Shows the exponential relationship between forward voltage and forward current. The "knee" voltage is around the typical VF of 2.0V. This curve is essential for designing the driver circuit.
• Luminous Intensity vs. Forward Current: Demonstrates how light output increases with current, typically in a near-linear relationship within the operating range, before efficiency drops at very high currents due to heating.
• Luminous Intensity vs. Ambient Temperature: Shows the derating of light output as the junction temperature increases. For most LEDs, output decreases as temperature rises.
• Spectral Distribution: A plot of relative intensity versus wavelength, showing the peak at ~632nm and the ~20nm bandwidth.

Designers should consult the full graphical datasheet from the manufacturer for these detailed curves to optimize performance over temperature and drive conditions.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED is housed in a standard SMD package. The drawing in the datasheet provides critical dimensions including body length, width, height, and the placement of the cathode/anode terminals. The cathode is typically identified by a visual marker such as a notch, green dot, or truncated corner on the package. The dimensional tolerance is generally ±0.1mm unless otherwise noted. Precise footprint layout is necessary for successful automated pick-and-place and soldering.

5.2 Polarity Identification

Correct polarity is essential for LED operation. The datasheet's package diagram will clearly indicate the cathode (negative) terminal. Mounting the LED in reverse bias will prevent it from lighting and, if the reverse voltage rating is exceeded, may damage the device.

6. Soldering and Assembly Guidelines

Proper handling is critical to maintain reliability. The datasheet provides detailed instructions.

6.1 Storage and Moisture Sensitivity

The LEDs are packaged in a moisture-resistant bag with desiccant. The bag should not be opened until the components are ready for use. If the bag is opened and components are not used immediately, they have a "floor life" of 1 year under controlled conditions (≤30°C, ≤60% RH). Exceeding this or if the desiccant indicator changes color, a baking treatment (60±5°C for 24 hours) is required before reflow soldering to prevent "popcorning" damage from moisture vaporization.

6.2 Reflow Soldering Profile

A lead-free reflow profile is specified:

• Pre-heating: 150-200°C for 60-120 seconds.
• Time Above Liquidus (217°C): 60-150 seconds.
• Peak Temperature: 260°C maximum, held for no more than 10 seconds.
• Ramp-up Rate: Maximum 6°C/second.
• Ramp-down Rate: Maximum 3°C/second.

Reflow soldering should not be performed more than two times. The PCB should not be warped or stressed during or after soldering.

6.3 Hand Soldering and Rework

If hand soldering is necessary, the iron tip temperature must be below 350°C, applied for no more than 3 seconds per terminal. A low-power iron (≤25W) is recommended. A cooling interval of at least 2 seconds should be allowed between soldering each terminal. Rework is strongly discouraged, but if unavoidable, a specialized double-head soldering iron should be used to simultaneously heat both terminals and avoid mechanical stress on the solder joints.

7. Packaging and Ordering Information

7.1 Packaging Specification

The LEDs are supplied in industry-standard 8mm wide embossed carrier tape, wound onto a 7-inch diameter reel. Each reel contains 3000 pieces. The reel, tape, and cover tape dimensions are provided in the datasheet to ensure compatibility with automated assembly equipment.

7.2 Label Explanation

The reel label contains several key fields:

• P/N: Product Number (e.g., 19-217/R6C-P1Q2/3T).
• QTY: Packing Quantity (3000 pcs).
• CAT: Luminous Intensity Rank (e.g., Q2).
• HUE: Chromaticity Coordinates & Dominant Wavelength Rank.
• REF: Forward Voltage Rank.
• LOT No: Manufacturing Lot Number for traceability.

8. Application Design Suggestions

8.1 Typical Application Circuits

The most common drive method is a simple series resistor. The resistor value (R) is calculated using Ohm's Law: R = (Vsupply - VF) / IF. For example, with a 5V supply, a typical VF of 2.0V, and a desired IF of 20mA: R = (5V - 2.0V) / 0.020A = 150 Ω. The resistor power rating should be at least (Vsupply - VF) * IF = 0.06W; a 1/8W or 1/10W resistor is sufficient. This resistor is mandatory to prevent over-current, as the LED's exponential IV characteristic means a small voltage increase causes a large current surge that can instantly destroy the device.

8.2 Design Considerations

• Current Drive: Always drive with a constant current or a voltage source with a series resistor. Never connect directly to a voltage source.
• Thermal Management: While the package is small, ensuring adequate PCB copper area around the thermal pads (if any) or general board ventilation helps maintain lower junction temperature, preserving light output and longevity.
• ESD Protection: Implement ESD protection on input lines if the LED is in a user-accessible location, and follow ESD-safe handling procedures during assembly.

9. Technical Comparison and Differentiation

The 19-217's primary differentiation lies in its combination of a very wide 120-degree viewing angle and its specific brilliant red color point (λd ~624nm) from the AlGaInP material system. Compared to older technologies or narrower-angle LEDs, it provides more uniform off-axis visibility, which is advantageous for panel indicators and backlighting where the viewer may not be directly in front of the device. Its compliance with modern environmental standards (RoHS, Halogen-Free) is also a key requirement for most contemporary electronics manufacturing.

10. Frequently Asked Questions (FAQ)

Q: Can I drive this LED at 30mA for more brightness?
A: No. The Absolute Maximum Rating for continuous forward current is 25mA. Exceeding this rating risks overheating and premature failure. For higher brightness, select an LED from a higher luminous intensity bin (e.g., Q2) or a different product rated for higher current.

Q: The datasheet shows a typical VF of 2.0V, but my circuit measures 2.2V. Is this normal?
A: Yes. The Forward Voltage has a specified range from 1.7V to 2.4V. A value of 2.2V is well within the maximum limit and is normal due to manufacturing variations. Your current-limiting resistor calculation should use the maximum VF (2.4V) to guarantee the current never exceeds 25mA under worst-case conditions.

Q: Do I need to bake the LEDs if the bag has been opened for a week?
A: It depends on the storage environment. If they were stored in a controlled environment meeting the floor life conditions (≤30°C, ≤60% RH), baking may not be necessary. However, if the storage conditions are unknown or humid, performing the recommended bake (60°C for 24 hours) is a safe practice to prevent soldering defects.

11. Practical Design and Usage Case

Scenario: Designing a status indicator panel with multiple red LEDs.
A designer is creating a control panel that requires 10 uniform red status indicators. They select the 19-217/Q2 bin LED for consistent brightness. The panel is powered by a 3.3V rail. Using the maximum VF of 2.4V to ensure safe operation under all conditions, they calculate the series resistor: R = (3.3V - 2.4V) / 0.020A = 45 Ω. The nearest standard value is 47 Ω. The actual current with a typical VF of 2.0V would be ~27.7mA, which is slightly above the absolute maximum. Therefore, to stay within the 25mA limit under all conditions, they should use a larger resistor. Recalculating with a target of 20mA at max VF: R = (3.3V - 2.4V) / 0.020A = 45 Ω. At typical VF (2.0V), the current would be (3.3V-2.0V)/47Ω = 27.7mA, which is too high. A better approach is to design for the typical case but verify the max current: Choose R = (3.3V - 2.0V) / 0.020A = 65 Ω (use 68 Ω). Max current at VF_min (1.7V) = (3.3V-1.7V)/68Ω = 23.5mA (safe). This case highlights the importance of considering the full VF range in resistor calculation.

12. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers (electrons and holes) recombine, they release energy. In an AlGaInP (Aluminum Gallium Indium Phosphide) LED like the 19-217, this energy is released primarily as photons (light) in the red portion of the visible spectrum. The specific wavelengths (peak at 632nm, dominant at 624nm) are determined by the precise bandgap energy of the semiconductor material, which is engineered during the crystal growth process. The wide 120-degree viewing angle is achieved through the shape and material of the epoxy lens that encapsulates the semiconductor chip.

13. Technology Trends and Developments

The trend in SMD indicator LEDs continues towards higher efficiency, smaller package sizes, and improved reliability. While the 19-217 uses a proven AlGaInP technology for red, newer materials and chip designs can offer higher luminous efficacy (more light output per electrical watt). There is also a growing emphasis on tighter binning tolerances for both color and intensity to meet the demands of applications requiring high uniformity, such as full-color displays and automotive lighting clusters. Furthermore, the drive for miniaturization persists, pushing packages smaller than the traditional 2.0mm x 1.25mm footprint. The environmental compliance standards (Halogen-Free, REACH) highlighted in this datasheet are now baseline requirements for virtually all electronic components sold globally.