SMD LED 23-21C/T1D-CP2Q2TY/2A Datasheet - Package Dimensions - Forward Voltage 2.6-3.0V - Luminous Intensity 57-112mcd - Pure White - English Technical Document

1. Product Overview

The 23-21C/T1D-CP2Q2TY/2A is a surface-mount device (SMD) LED designed for modern electronic applications requiring compact, efficient, and reliable lighting solutions. This component represents a significant advancement over traditional lead-frame type LEDs, enabling substantial reductions in board size and equipment footprint. Its lightweight construction and small form factor make it particularly suitable for applications where space and weight are critical constraints.

The core advantage of this LED lies in its miniaturization, which directly contributes to higher packing density on printed circuit boards (PCBs). This allows designers to create more compact electronic devices. Furthermore, the reduced storage space requirements for both the components and the final assembled products offer logistical and economic benefits. The device is a mono-color type, emitting a pure white light, and is constructed using Pb-free, RoHS-compliant, and halogen-free materials, aligning with contemporary environmental and regulatory standards including EU REACH.

2. Technical Parameter Deep-Dive

The performance and reliability of the LED are defined by a comprehensive set of electrical, optical, and thermal parameters. Understanding these specifications is crucial for proper circuit design and ensuring long-term operation.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

• Reverse Voltage (V_R): 5 V. Exceeding this voltage in the reverse direction can cause junction breakdown.
• Forward Current (I_F): 10 mA (continuous).
• Peak Forward Current (I_FP): 100 mA, permissible only under pulsed conditions (duty cycle 1/10 @ 1 kHz).
• Power Dissipation (P_d): 40 mW. This is the maximum power the package can dissipate without exceeding its thermal limits.
• Electrostatic Discharge (ESD): Human Body Model (HBM) rating of 150 V. Proper ESD handling procedures are mandatory.
• Operating Temperature (T_opr): -40°C to +85°C. The device is rated for industrial temperature ranges.
• Storage Temperature (T_stg): -40°C to +90°C.
• Soldering Temperature (T_sol): The device can withstand reflow soldering with a peak temperature of 260°C for up to 10 seconds, or hand soldering at 350°C for up to 3 seconds per terminal.

2.2 Electro-Optical Characteristics

Measured at a standard junction temperature of 25°C, these parameters define the light output and electrical behavior under normal operating conditions.

• Luminous Intensity (I_v): Ranges from 57.0 mcd (minimum) to 112 mcd (maximum), with a typical value under a forward current (I_F) of 5 mA. A tolerance of ±11% applies.
• Viewing Angle (2θ_1/2): A typical value of 140 degrees, indicating a wide viewing angle suitable for indicator and backlighting applications.
• Forward Voltage (V_F): Ranges from 2.60 V to 3.00 V at I_F = 5 mA, with a tolerance of ±0.05V. This parameter is critical for current-limiting resistor calculation.
• Reverse Current (I_R): Maximum of 50 µA when a reverse voltage (V_R) of 5 V is applied.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into "bins" based on key performance parameters. This system allows designers to select components that meet specific brightness and voltage requirements for their application.

3.1 Luminous Intensity Binning

The luminous output is categorized into three distinct bins (P2, Q1, Q2) when driven at 5 mA.

• Bin P2: 57.0 mcd (Min) to 72.0 mcd (Max)
• Bin Q1: 72.0 mcd (Min) to 90.0 mcd (Max)
• Bin Q2: 90.0 mcd (Min) to 112 mcd (Max)

Selecting a higher bin code (e.g., Q2) guarantees a brighter LED, which may be necessary for applications requiring higher visibility or lower drive current.

3.2 Forward Voltage Binning

The forward voltage drop is categorized into four bins (28, 29, 30, 31) at I_F = 5 mA.

• Bin 28: 2.60 V to 2.70 V
• Bin 29: 2.70 V to 2.80 V
• Bin 30: 2.80 V to 2.90 V
• Bin 31: 2.90 V to 3.00 V

Tighter voltage bins are essential for applications where consistent power consumption or precise current regulation across multiple LEDs is critical.

3.3 Chromaticity Coordinate Binning

The color quality of the pure white light is controlled by binning based on CIE 1931 chromaticity coordinates (x, y). The datasheet defines four bins (1, 2, 3, 4), each specifying a quadrilateral area on the CIE chart with a tolerance of ±0.01. This ensures minimal color variation between LEDs from the same bin, which is vital for applications like backlighting where color uniformity is important.

4. Performance Curve Analysis

While the datasheet references typical electro-optical characteristic curves, their general interpretation is key for design. These curves typically illustrate the relationship between forward current and luminous intensity (I_v vs. I_F), forward voltage (V_F vs. I_F), and the effect of ambient temperature on light output. Designers use these curves to optimize drive current for desired brightness and to understand how performance degrades at higher operating temperatures, informing thermal management decisions.

5. Mechanical and Package Information

5.1 Package Dimension

The LED comes in a compact SMD package. The dimensional drawing provides critical measurements including body length, width, height, and the placement and size of the solder pads. Adherence to the specified pad layout (Land Pattern) is essential for reliable soldering and proper alignment during the reflow process. The polarity is indicated by the package marking or shape, which must be correctly oriented on the PCB.

5.2 Moisture Sensitivity and Packaging

The device is packaged in a moisture-resistant format to prevent damage from ambient humidity, which can cause "popcorning" during reflow soldering. The package includes a carrier tape on a 7-inch diameter reel, with a standard loaded quantity of 2000 pieces per reel. The reel and tape dimensions are specified to ensure compatibility with automated pick-and-place equipment. Labels on the packaging provide vital information such as the product number, quantity, and the specific bin codes for luminous intensity (CAT), chromaticity (HUE), and forward voltage (REF).

6. Soldering and Assembly Guidelines

Proper handling and soldering are critical to maintaining device integrity and performance.

6.1 Reflow Soldering Profile

A Pb-free reflow temperature profile is specified:

• Pre-heating: 150–200°C for 60–120 seconds.
• Time Above Liquidus (217°C): 60–150 seconds.
• Peak Temperature: Maximum of 260°C, held for a maximum of 10 seconds.
• Heating/Cooling Rate: Maximum of 6°C/sec heating and 3°C/sec cooling.

Reflow soldering should not be performed more than two times on the same device.

6.2 Storage and Handling Precautions

• Storage: Unopened bags must be stored at ≤30°C and ≤90% RH. After opening, the "floor life" is 1 year under ≤30°C and ≤60% RH. Exceeding this or if the desiccant indicates moisture, a baking treatment (60±5°C for 24 hours) is required before use.
• Current Protection: An external current-limiting resistor is mandatory. LEDs are current-driven devices; a small increase in voltage can cause a large, destructive increase in current.
• Hand Soldering: If necessary, use a soldering iron with a tip temperature <350°C, capacity ≤25W, and limit contact to 3 seconds per terminal. A double-head soldering iron is recommended for any repair work to avoid thermal stress.
• ESD Protection: The 150V HBM rating indicates moderate sensitivity. Use standard ESD precautions during handling and assembly.

7. Application Suggestions

7.1 Typical Application Scenarios

• Backlighting: Ideal for dashboard indicators, switch illumination, and flat backlighting for LCD panels and symbols.
• Telecommunication Equipment: Status indicators and keypad backlighting in phones and fax machines.
• General Indicator Use: Status lights, power indicators, and decorative lighting in consumer electronics.

7.2 Design Considerations

• Current Drive Circuit: Always use a series resistor to set the forward current. Calculate the resistor value using R = (V_supply - V_F) / I_F, considering the worst-case V_F from the binning range.
• Thermal Management: Although power dissipation is low, ensure adequate PCB copper area or thermal vias if operating at high ambient temperatures or maximum current to maintain junction temperature within limits.
• Optical Design: The 140-degree viewing angle provides wide emission. For focused light, external lenses or light guides may be necessary.

8. Technical Comparison and Differentiation

Compared to older through-hole LEDs, this SMD type offers significant advantages: a drastically reduced footprint, suitability for high-speed automated assembly, and better thermal performance due to direct mounting on the PCB. Within the SMD LED category, its specific combination of a wide viewing angle, pure white color point defined by precise chromaticity bins, and robust construction for standard reflow processes makes it a versatile choice for general-purpose indicator and backlight applications where consistent color and brightness are required.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 How do I choose the right current-limiting resistor?

Use the maximum forward voltage (V_F(max)) from the voltage bin you are using (e.g., 3.00V for Bin 31) in the calculation to ensure the current never exceeds the maximum rating, even with component tolerances. For a 5V supply and a target I_F of 5mA: R = (5V - 3.00V) / 0.005A = 400 Ω. Use the next higher standard value (e.g., 430 Ω) for a margin of safety.

9.2 Can I use this LED for automotive interior lighting?

While the operating temperature range (-40°C to +85°C) covers typical automotive interior environments, the datasheet includes an application restriction notice. It states that for high-reliability applications like automotive safety/security systems, a different product may be required. For non-critical interior lighting (e.g., dashboard backlighting), it may be suitable, but consultation with the manufacturer is advised for critical applications.

9.3 What does the bin code on the label mean for my design?

The bin codes (CAT for intensity, HUE for color, REF for voltage) allow you to trace the exact performance characteristics of the LEDs on your reel. For designs requiring uniform appearance, specify and use LEDs from the same HUE and CAT bins. For designs sensitive to power supply loading, use LEDs from the same REF (voltage) bin to ensure consistent current draw.

10. Practical Design and Usage Case

Scenario: Designing a multi-LED status indicator panel. To ensure uniform brightness and color across all 10 LEDs on the panel, the designer specifies components from Bin Q1 (luminous intensity) and Bin 2 (chromaticity). By calculating the current-limiting resistor using V_F(max) from Bin 29 (2.80V), they guarantee no LED is over-driven. The wide 140-degree viewing angle ensures the indicators are visible from various angles without requiring individual lenses. The SMD package allows for a very compact PCB layout, and the tape-and-reel packaging enables efficient automated assembly of the entire batch.

11. Operating Principle Introduction

This LED is a solid-state light source based on a semiconductor chip. The chip material is Indium Gallium Nitride (InGaN), which is engineered to emit light in the blue/ultraviolet spectrum. This light then passes through a yellow-diffused phosphor layer within the resin encapsulation. The phosphor absorbs a portion of the primary blue light and re-emits it as yellow light. The combination of the remaining blue light and the converted yellow light results in the perception of "pure white" light by the human eye. This technology is known as phosphor-converted white LED.

12. Technology Trends

The component reflects ongoing trends in LED technology: continued miniaturization of packages, enhancement of efficiency (lumens per watt), and stricter control over color consistency through advanced binning. The emphasis on Pb-free, halogen-free, and RoHS/REACH compliance highlights the industry-wide shift towards environmentally sustainable manufacturing. Furthermore, the detailed moisture sensitivity and soldering guidelines indicate the increasing integration of LEDs into standard, high-volume PCB assembly processes, moving them from discrete components to mainstream surface-mount devices.