SMD LED 19-223/R6G6C-A01/2T Datasheet - Multi-Color - 20mA - Brilliant Red & Yellow Green - English Technical Document

1. Product Overview

The 19-223 is a compact, multi-color Surface Mount Device (SMD) LED designed for high-density PCB applications. Its primary advantage lies in its significantly reduced footprint compared to traditional lead-frame LEDs, enabling miniaturization of end products, higher component packing density on boards, and reduced storage requirements. The device is lightweight, making it suitable for portable and miniature electronic applications. It is offered in two distinct color types: R6 (Brilliant Red) and G6 (Brilliant Yellow Green), both utilizing AlGaInP chip technology encapsulated in water-clear resin.

1.1 Core Features and Compliance

The LED is supplied on 8mm tape mounted on 7-inch diameter reels, ensuring compatibility with standard automated pick-and-place assembly equipment. It is designed for use with both infrared and vapor phase reflow soldering processes. The product adheres to several key environmental and safety standards: it is Pb-free (lead-free), compliant with the EU RoHS directive, meets EU REACH requirements, and is classified as Halogen-Free, with Bromine (Br) and Chlorine (Cl) content each below 900 ppm and their sum below 1500 ppm.

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operating conditions must remain within these boundaries.

• Forward Current (I_F): 25 mA for both R6 and G6 types.
• Peak Forward Current (I_FP): 50 mA, permissible under pulsed conditions (duty cycle 1/10 at 1 kHz).
• Power Dissipation (P_d): 60 mW.
• Electrostatic Discharge (ESD) Human Body Model (HBM): 2000 V, indicating a moderate level of ESD robustness for handling.
• Operating Temperature (T_opr): -40°C to +85°C.
• Storage Temperature (T_stg): -40°C to +90°C.
• Soldering Temperature: For reflow, a peak of 260°C for a maximum of 10 seconds is specified. For hand soldering, the iron tip temperature should not exceed 350°C for 3 seconds.

2.2 Electro-Optical Characteristics

Measured at a standard test condition of 25°C ambient temperature and a forward current of 20 mA.

• Luminous Intensity (I_v): R6: 72.0 - 180.0 mcd (Typical 112-180 mcd based on binning). G6: 22.5 - 57.0 mcd (Typical 36-57 mcd based on binning). A tolerance of ±11% applies.
• Viewing Angle (2θ_1/2): 130 degrees, providing a wide field of illumination.
• Peak Wavelength (λ_p): R6: 632 nm (typical). G6: 575 nm (typical).
• Dominant Wavelength (λ_d): R6: 624 nm (typical). G6: 573 nm (typical).
• Spectral Bandwidth (Δλ): 20 nm (typical) for both colors.
• Forward Voltage (V_F): 1.70 - 2.40 V (Typical 2.00 V) for both R6 and G6 at I_F=20mA.
• Reverse Current (I_R): Maximum 10 μA at a reverse voltage (V_R) of 5V. The device is not intended for reverse bias operation.

3. Binning System Explanation

The LEDs are sorted (binned) based on key performance parameters to ensure consistency within a production lot.

3.1 Luminous Intensity Binning (R6)

• Bin Code Q: Minimum 72.0 mcd, Maximum 112.0 mcd.
• Bin Code R: Minimum 112.0 mcd, Maximum 180.0 mcd.

3.2 Luminous Intensity Binning (G6)

• Bin Code 1: Minimum 22.5 mcd, Maximum 36.0 mcd.
• Bin Code 2: Minimum 36.0 mcd, Maximum 57.0 mcd.

Note: The datasheet shows "Bin Range Of Forward Voltage" for G6 but lists luminous intensity values. This is assumed to be a labeling inconsistency, and the bins refer to luminous intensity.

4. Performance Curve Analysis

The datasheet includes typical characteristic curves for both the R6 and G6 variants. While specific graph data points are not provided in the text, these curves typically illustrate the relationship between forward current and luminous intensity, forward voltage, and the effect of ambient temperature on light output. Analyzing these curves is crucial for understanding the LED's behavior under non-standard operating conditions, such as driving at currents other than 20mA or in environments with temperature variations. Designers should refer to the graphical data in the original document for detailed derating and performance prediction.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED features a standard SMD package. The dimensional drawing specifies key measurements including body length, width, height, pad size, and spacing. All unspecified tolerances are ±0.1 mm. Precise dimensions must be obtained from the package drawing in the original datasheet for accurate PCB footprint design.

5.2 Polarity Identification

The cathode is typically marked on the device, often by a notch, a green dot, or a cut corner on the lens or package body. The PCB footprint design must align with this polarity marking to ensure correct electrical connection.

6. Soldering and Assembly Guide

6.1 Reflow Soldering Profile

A lead-free reflow profile is recommended:

• Pre-heating: 150-200°C for 60-120 seconds.
• Time Above Liquidus (217°C): 60-150 seconds.
• Peak Temperature: Maximum 260°C.
• Time at Peak: Maximum 10 seconds.
• Heating Rate: Maximum 6°C/sec up to 255°C.
• Time above 255°C: Maximum 30 seconds.
• Cooling Rate: Maximum 3°C/sec.

Reflow soldering should not be performed more than two times on the same device.

6.2 Hand Soldering

If hand soldering is necessary, use a soldering iron with a tip temperature below 350°C. Contact time per terminal should not exceed 3 seconds. Use an iron with a power rating of 25W or less. Allow an interval of at least 2 seconds between soldering each terminal to prevent thermal damage.

6.3 Storage and Moisture Sensitivity

The product is packaged in a moisture-resistant bag with desiccant.

• Do not open the bag until ready for use.
• After opening, unused LEDs must be stored at ≤30°C and ≤60% Relative Humidity.
• The "floor life" after bag opening is 168 hours (7 days).
• If the exposure time is exceeded or the desiccant indicator has changed color, a bake-out at 60±5°C for 24 hours is required before reflow soldering.

7. Packaging and Ordering Information

7.1 Packaging Specifications

The LEDs are supplied in carrier tape on 7-inch reels. Each reel contains 2000 pieces. Detailed dimensions for the carrier tape pockets and the reel are provided in the datasheet drawings.

7.2 Label Explanation

The reel label contains several codes:

• CPN: Customer's Product Number.
• P/N: Manufacturer's Product Number (e.g., 19-223/R6G6C-A01/2T).
• QTY: Packing Quantity.
• CAT: Luminous Intensity Rank (Binning Code).
• HUE: Chromaticity Coordinates & Dominant Wavelength Rank.
• REF: Forward Voltage Rank.
• LOT No: Traceable Lot Number.

8. Application Suggestions

8.1 Typical Application Scenarios

• Backlighting: Dashboard indicators, switch illumination, keypad backlights.
• Telecommunication Equipment: Status indicators and backlighting in telephones and fax machines.
• LCD Displays: Flat backlighting for small LCD panels, switch and symbol illumination.
• General Indicator Use: Power status, mode indication, etc.

8.2 Design Considerations

• Current Limiting: An external current-limiting resistor is mandatory. The LED's forward voltage has a range, and a small change in supply voltage can cause a large, potentially destructive change in forward current due to the diode's exponential I-V characteristic.
• Thermal Management: Ensure the PCB design allows for adequate heat dissipation, especially if operating near maximum ratings or in high ambient temperatures, to maintain LED lifetime and performance.
• ESD Protection While the device has 2000V HBM ESD rating, standard ESD handling precautions should be observed during assembly.

9. Technical Comparison and Differentiation

The 19-223 LED's primary differentiators are its multi-color capability in a single package type (R6 and G6) and its use of AlGaInP semiconductor material. AlGaInP technology is known for producing high-efficiency red, orange, amber, and yellow-green light. Compared to older technologies, it offers superior luminous efficacy and color purity for these wavelengths. The wide 130-degree viewing angle makes it suitable for applications requiring broad visibility, as opposed to narrow-beam indicator LEDs.

10. Frequently Asked Questions (FAQ)

10.1 Can I drive this LED without a series resistor?

No. The datasheet explicitly warns that a protection resistor must be used. The LED is a current-driven device. Connecting it directly to a voltage source will result in uncontrolled current flow, leading to immediate failure.

10.2 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak Wavelength (λ_p) is the wavelength at which the spectral power distribution of the emitted light is maximum. Dominant Wavelength (λ_d) is the single wavelength of monochromatic light that matches the perceived color of the LED when compared to a standard white light source. Dominant wavelength is more closely related to human color perception.

10.3 Why is there a strict 7-day floor life after opening the moisture barrier bag?

SMD packages can absorb moisture from the atmosphere. During the high-temperature reflow soldering process, this trapped moisture can rapidly expand, causing internal delamination, cracking, or "popcorning," which damages the device. The 7-day limit and baking procedure are critical for ensuring assembly yield and long-term reliability.

11. Practical Design and Usage Case

Scenario: Designing a multi-status indicator panel. A designer needs red and green indicators for "Power On," "Standby," and "Fault" states on a compact control unit. Using the 19-223 series, they can source both Brilliant Red (R6) and Brilliant Yellow Green (G6) LEDs with identical footprints and soldering profiles. This simplifies PCB layout, bill of materials, and assembly process. By selecting LEDs from the higher luminous intensity bins (R for red, 2 for green), they ensure good visibility. They calculate the appropriate current-limiting resistors for a 5V system, targeting 15mA drive current to balance brightness and power consumption, using the typical V_F of 2.0V. They ensure the panel design allows for the 130-degree viewing angle so indicators are visible from a wide range of operator positions.

12. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through a process called electroluminescence. When a forward voltage is applied across the p-n junction of the semiconductor material (AlGaInP in this case), electrons from the n-type region recombine with holes from the p-type region within the active layer. This recombination releases energy in the form of photons (light particles). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material. The water-clear epoxy resin encapsulant protects the semiconductor chip, acts as a lens to shape the light output beam (resulting in the 130-degree viewing angle), and provides mechanical stability.

13. Technology Trends and Context

SMD LEDs like the 19-223 represent a mature and widely adopted packaging technology. The trend in indicator and backlight LEDs continues towards higher efficiency (more light output per mA of current), improved color consistency through tighter binning, and increased miniaturization for ever-smaller devices. There is also a growing emphasis on reliability data and lifetime predictions under various operating conditions. While this datasheet provides standard ratings, more advanced applications may require detailed lifetime and lumen maintenance curves. The move towards Pb-free and halogen-free manufacturing, as seen in this product, is now an industry standard driven by global environmental regulations.