SMD LED 19-22/G6R6C-A31/2T Datasheet - Package 2.0x1.25x0.8mm - Voltage 2.0V - Multi-Color - English Technical Document

1. Product Overview

The 19-22 SMD LED is a compact, surface-mount device designed for high-density PCB applications. It utilizes AlGaInP chip technology to deliver brilliant yellow (G6) and red (R6) colors. The primary advantage of this component is its significantly reduced footprint compared to traditional lead-frame LEDs, enabling miniaturization of end equipment, higher packing density on circuit boards, and reduced storage requirements. Its lightweight construction makes it particularly suitable for portable and miniature electronic devices.

1.1 Core Features and Compliance

The device is supplied on 8mm tape mounted on 7-inch diameter reels, ensuring compatibility with standard automated pick-and-place assembly equipment. It is designed for use with both infrared and vapor phase reflow soldering processes. The product is compliant with key environmental and safety regulations: it is lead-free (Pb-free), adheres to the EU RoHS directive, complies with EU REACH regulations, and meets halogen-free standards (Bromine <900 ppm, Chlorine <900 ppm, Br+Cl < 1500 ppm). The multi-color variant type offers design flexibility within a single package footprint.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

Operating the device beyond these limits may cause permanent damage. The maximum reverse voltage (VR) is 5V for both color types. The continuous forward current (IF) rating is 25 mA. For pulsed operation, the peak forward current (IFP) is 60 mA at a duty cycle of 1/10 and 1 kHz frequency. The maximum power dissipation (Pd) is 60 mW. The device is rated for an operating temperature range (Topr) of -40°C to +85°C and a storage temperature range (Tstg) of -40°C to +90°C. The electrostatic discharge (ESD) withstand voltage, per the Human Body Model (HBM), is 2000V.

2.2 Electro-Optical Characteristics

All parameters are specified at an ambient temperature (Ta) of 25°C and a standard test current (IF) of 20 mA. The luminous intensity (Iv) has a typical value of 22.5 mcd for the G6 (Yellow) and 45.0 mcd for the R6 (Red), with specific bin ranges provided. The viewing angle (2θ1/2) is 130 degrees, providing a wide emission pattern. The G6 chip has a typical peak wavelength (λp) of 575 nm and a dominant wavelength (λd) of 573 nm. The R6 chip has a typical peak wavelength of 632 nm and a dominant wavelength of 624 nm. The spectral bandwidth (Δλ) is approximately 20 nm for both. The forward voltage (VF) typically measures 2.0V, with a range from 1.7V to 2.4V. The maximum reverse current (IR) at VR=5V is 10 µA.

3. Binning System Explanation

To ensure color and brightness consistency, the LEDs are sorted into bins based on luminous intensity. The tolerance for luminous intensity is ±11%. For the G6 (Yellow) LED, bins range from M2 (22.5-28.5 mcd) to P1 (45.0-57.0 mcd). For the R6 (Red) LED, bins range from P1 (45.0-57.0 mcd) to Q2 (90.0-112.0 mcd). This binning allows designers to select components that meet specific brightness requirements for their application, ensuring visual uniformity in multi-LED arrays or indicators.

4. Performance Curve Analysis

The datasheet includes typical electro-optical characteristic curves for both the G6 and R6 variants. These graphs visually represent the relationship between key parameters, such as forward current vs. forward voltage, forward current vs. luminous intensity, and the effect of ambient temperature on luminous intensity. Analyzing these curves is crucial for understanding the device's behavior under non-standard operating conditions, enabling more robust circuit design, especially concerning current limiting and thermal management.

5. Mechanical and Package Information

5.1 Package Outline Dimensions

The 19-22 SMD LED has a compact package with dimensions of 2.0mm in length, 1.25mm in width, and a height of 0.8mm (tolerance ±0.1mm unless otherwise noted). The detailed mechanical drawing specifies the lead spacing, chip placement, and lens geometry. Correct interpretation of this drawing is essential for PCB land pattern design, ensuring proper solder joint formation and mechanical stability.

5.2 Polarity Identification and Mounting

The package features a marked cathode (typically indicated by a green dot or a notch on the tape). The datasheet provides a clear diagram showing the anode and cathode pad locations. Adhering to the recommended PCB footprint is critical to prevent soldering issues and ensure correct electrical orientation.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

For Pb-free soldering, a specific temperature profile must be followed: pre-heating between 150-200°C for 60-120 seconds; time above liquidus (217°C) for 60-150 seconds; peak temperature not exceeding 260°C for a maximum of 10 seconds; maximum heating rate of 6°C/sec up to 255°C, held for a max of 30 seconds; and a maximum cooling rate of 3°C/sec. Reflow soldering should not be performed more than twice. Stress should not be applied to the LED body during heating, and the PCB should not be warped after soldering.

6.2 Hand Soldering and Storage

If hand soldering is necessary, the iron tip temperature must be below 350°C, applied for no more than 3 seconds per terminal. The soldering iron power should be 25W or less, with an interval of at least 2 seconds between soldering each terminal. For storage, unopened moisture-resistant bags can be used as received. Once opened, LEDs must be used within 168 hours (7 days) if kept in an environment of 30°C/60%RH or less. Unused LEDs should be resealed with desiccant. If the storage time is exceeded or the desiccant indicator has changed color, a baking treatment at 60±5°C for 24 hours is required before use.

7. Packaging and Ordering Information

The LEDs are packaged in moisture-resistant materials. They are supplied on carrier tape, loaded into reels containing 2000 pieces each. The reel has standard dimensions for compatibility with automated feeders. The packaging includes a label with critical information: Customer Product Number (CPN), Product Number (P/N), Packing Quantity (QTY), Luminous Intensity Rank (CAT), Chromaticity Coordinates & Dominant Wavelength Rank (HUE), Forward Voltage Rank (REF), and Lot Number (LOT No).

8. Application Suggestions

8.1 Typical Application Scenarios

This LED is well-suited for backlighting applications in automotive dashboards and switch panels. In telecommunications, it serves as status indicators and keypad backlights in phones and fax machines. It is also used for flat backlighting of LCDs, switches, and symbols, along with general-purpose indicator applications where small size and reliability are key.

8.2 Critical Design Considerations

A current-limiting resistor is absolutely mandatory. The LED's exponential I-V characteristic means a small change in forward voltage causes a large change in current, which can lead to immediate burnout. The resistor value must be calculated based on the supply voltage, the LED's typical forward voltage (Vf), and the desired operating current (e.g., 20mA). Designers must also consider the power dissipation of the LED itself and ensure the PCB layout provides adequate thermal relief if operating near maximum ratings.

9. Technical Comparison and Differentiation

The 19-22 package offers a significant size reduction over older 3mm and 5mm through-hole LEDs, enabling modern, slim product designs. Compared to other SMD LEDs, its use of AlGaInP technology provides high luminous efficiency for yellow and red colors. The wide 130-degree viewing angle is a key differentiator for applications requiring broad visibility. Its compliance with halogen-free and other environmental standards makes it suitable for products with strict regulatory requirements.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Why is a series resistor necessary?
A: The LED is a diode with a non-linear I-V curve. Without a current-limiting resistor, the current is only limited by the power supply's internal resistance and the diode's dynamic resistance, which is very low. This almost always results in current exceeding the Absolute Maximum Rating, causing instant failure.

Q: Can I drive this LED with a 3.3V or 5V logic supply?
A: Yes, but a series resistor is required. For example, with a 5V supply and a typical Vf of 2.0V at 20mA, the resistor value would be R = (5V - 2.0V) / 0.020A = 150 Ohms. The resistor power rating should be at least P = I^2 * R = (0.02^2)*150 = 0.06W, so a standard 1/8W (0.125W) resistor is sufficient.

Q: What does the bin code (e.g., P1, Q2) mean for my design?
A: The bin code specifies the guaranteed minimum and maximum luminous intensity. If your design requires uniform brightness across multiple LEDs, you should specify LEDs from the same bin code or a narrow range of bins. Using LEDs from widely different bins (e.g., a P1 and a Q2 together) will result in visibly different brightness levels.

11. Practical Design and Usage Case

Consider designing a multi-status indicator panel for a consumer device. Using the 19-22 LED, a designer can create a dense array of red and yellow indicators in a very small area. By selecting LEDs from the same intensity bin (e.g., all R6 from bin Q1), visual consistency is achieved. The wide viewing angle ensures the indicators are visible from various angles. The SMD package allows for automated assembly, reducing manufacturing cost and increasing reliability compared to hand-soldered through-hole components. The design must include a driver circuit with appropriate current-limiting resistors for each LED or group of LEDs.

12. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type material recombine with holes from the p-type material in the active region (the AlGaInP layer in this case). This recombination releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material. The epoxy resin lens surrounding the chip serves to protect the semiconductor die, shape the light output beam (achieving the 130-degree viewing angle), and enhance light extraction efficiency.

13. Technology Trends and Developments

The trend in indicator and backlight LEDs continues toward higher efficiency (more light output per unit of electrical power), smaller package sizes, and improved reliability. There is also a strong drive for broader adoption of environmentally friendly materials and manufacturing processes, as evidenced by this product's halogen-free and Pb-free compliance. Integration is another trend, with multi-chip packages (RGB, multi-color) and LEDs with built-in control ICs becoming more common for complex lighting applications. However, discrete single-color LEDs like the 19-22 remain fundamental components due to their simplicity, reliability, and cost-effectiveness for basic indicator functions.