SMD LED 19-22/R6 BHC-B01/2T Datasheet - Package 2.0x1.25x0.8mm - Voltage 1.7-3.25V - Power 40-60mW - Red/Blue - English Technical Document

1. Product Overview

The 19-22 series represents a compact, surface-mount LED solution designed for high-density PCB applications. This multi-color type device is offered in two primary chip material variants: the R6 code utilizing AlGaInP for brilliant red emission, and the BH code utilizing InGaN for blue emission. The resin package is water clear for both types. Its significantly reduced footprint compared to lead-frame components enables smaller board designs, higher packing density, and ultimately contributes to the miniaturization of end equipment. The lightweight construction further makes it ideal for portable and miniature applications.

Key advantages highlighted include compatibility with automatic placement equipment and standard infrared or vapor phase reflow soldering processes. The product is compliant with major industry standards, being Pb-free, RoHS compliant, EU REACH compliant, and halogen-free (with Bromine <900 ppm, Chlorine <900 ppm, Br+Cl < 1500 ppm).

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings

All ratings are specified at an ambient temperature (Ta) of 25°C. Exceeding these limits may cause permanent damage.

• Reverse Voltage (VR): 5 V (for all codes).
• Forward Current (IF): R6: 25 mA; BH: 10 mA.
• Peak Forward Current (IFP): Duty cycle 1/10 @ 1kHz. R6: 50 mA; BH: 40 mA.
• Power Dissipation (Pd): R6: 60 mW; BH: 40 mW. This parameter is critical for thermal management.
• Electrostatic Discharge (ESD) Human Body Model (HBM): R6: 2000 V; BH: 150 V. The BH (InGaN) variant is significantly more sensitive to ESD and requires stringent handling precautions.
• Operating Temperature (Topr): -40°C to +85°C.
• Storage Temperature (Tstg): -40°C to +90°C.
• Soldering Temperature (Tsol): Reflow: 260°C max for 10 seconds. Hand soldering: 350°C max for 3 seconds per terminal.

2.2 Electro-Optical Characteristics

Typical values are measured at Ta=25°C and IF=5mA, unless otherwise noted. Tolerances apply: Luminous Intensity ±11%, Dominant Wavelength ±1nm, Forward Voltage ±0.1V.

• Luminous Intensity (Iv): Minimum 14.5 mcd, Typical 20.0 mcd for both R6 and BH codes.
• Viewing Angle (2θ1/2): Typical 130 degrees, indicating a wide viewing pattern.
• Peak Wavelength (λp): R6: 632 nm (typical); BH: 468 nm (typical).
• Dominant Wavelength (λd): R6: 617.5 to 629.5 nm; BH: 467.5 to 472.5 nm. This is the parameter used for color binning.
• Spectral Bandwidth (Δλ): R6: 20 nm (typical); BH: 25 nm (typical).
• Forward Voltage (VF): R6: 1.70 to 2.25 V; BH: 2.65 to 3.25 V. The higher voltage for the blue LED is characteristic of InGaN technology.
• Reverse Current (IR): Measured at VR=5V. R6: Max 10 µA; BH: Max 50 µA.

3. Binning System Explanation

The LEDs are sorted into bins based on dominant wavelength to ensure color consistency within a production batch.

3.1 R6 (Red) Binning

• Bin E4: 617.5 nm ≤ λd < 621.5 nm
• Bin E5: 621.5 nm ≤ λd < 625.5 nm
• Bin E6: 625.5 nm ≤ λd < 629.5 nm

3.2 BH (Blue) Binning

• Bin A10: 467.5 nm ≤ λd < 470.0 nm
• Bin A11: 470.0 nm ≤ λd < 472.5 nm

Luminous intensity is also ranked (CAT code), and forward voltage is ranked (REF code), providing a multi-parameter selection system for precise design matching.

4. Performance Curve Analysis

The datasheet provides typical characteristic curves for the R6 variant, offering insights into performance under varying conditions.

4.1 Relative Luminous Intensity vs. Forward Current

The curve shows a sub-linear relationship. Intensity increases with current but begins to saturate at higher currents, emphasizing the importance of operating within the specified IF range to maintain efficiency and longevity.

4.2 Relative Luminous Intensity vs. Ambient Temperature

Luminous output decreases as ambient temperature increases. This thermal derating is a critical factor for designs operating in elevated temperature environments or with limited heat sinking.

4.3 Forward Voltage vs. Forward Current

This IV curve demonstrates the exponential relationship typical of diodes. The forward voltage has a negative temperature coefficient.

4.4 Spectral Distribution

The spectrum plot for the R6 LED shows a dominant peak around 632 nm (typical) with a defined bandwidth, confirming its monochromatic red color purity.

5. Mechanical and Package Information

5.1 Package Dimensions

The 19-22 SMD package has nominal dimensions of 2.0mm (length) x 1.25mm (width) x 0.8mm (height). The drawing specifies tolerances of ±0.1mm unless otherwise noted. It includes details for the lens, cathode indicator, and solder pad land pattern recommendations to ensure proper soldering and alignment.

5.2 Polarity Identification

The package features a visual marker (typically a notch or a green marking) on the cathode side. Correct polarity must be observed during placement to ensure proper circuit operation.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A lead-free reflow profile is specified:

• Pre-heating: 150-200°C for 60-120 seconds.
• Time above liquidus (217°C): 60-150 seconds.
• Peak temperature: 260°C maximum, held for 10 seconds maximum.
• Heating rate: Maximum 6°C/sec up to 255°C; maximum 3°C/sec above 255°C.

Reflow should not be performed more than two times.

6.2 Hand Soldering

If hand soldering is necessary, the iron tip temperature must be below 350°C, applied for no more than 3 seconds per terminal. Use a soldering iron with a capacity of 25W or less. Allow a minimum 2-second interval between soldering each terminal to prevent thermal shock.

6.3 Storage and Moisture Sensitivity

The components are packaged in moisture-resistant barrier bags with desiccant.

• Do not open the bag until ready for use.
• After opening, unused LEDs must be stored at ≤30°C and ≤60% RH.
• The "floor life" after bag opening is 168 hours (7 days).
• If the floor life is exceeded or the desiccant indicates moisture ingress, a bake-out at 60±5°C for 24 hours is required before reflow.

6.4 Critical Precautions

• Current Limiting: An external series resistor is mandatory. LEDs are current-driven devices; a small voltage change can cause a large current surge leading to immediate failure.
• Stress Avoidance: Avoid mechanical stress on the package during heating (soldering) and do not warp the PCB after assembly.
• Repair: Repair after soldering is not recommended. If unavoidable, a specialized double-head soldering iron must be used to simultaneously heat both terminals, and the effect on LED characteristics must be verified beforehand.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The LEDs are supplied in 8mm wide carrier tape on 7-inch diameter reels. Each reel contains 2000 pieces. Detailed dimensions for the carrier tape pockets and the reel are provided to ensure compatibility with automated pick-and-place machinery.

7.2 Label Explanation

The reel label contains several key codes:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., 19-22/R6 BHC-B01/2T).
• QTY: Packing Quantity.
• CAT: Luminous Intensity Rank.
• HUE: Chromaticity Coordinates & Dominant Wavelength Rank (Bin Code).
• REF: Forward Voltage Rank.
• LOT No: Traceable Lot Number.

8. Application Suggestions

8.1 Typical Application Scenarios

• Backlighting: Dashboard indicators, switch illumination, keypad backlights.
• Telecommunication Equipment: Status indicators and backlighting in phones, fax machines.
• LCD Displays: Edge-lit or direct backlighting for small monochrome or color LCDs.
• General Indication: Power status, mode indicators, decorative lighting in compact consumer electronics.

8.2 Design Considerations

• Circuit Design: Always include a current-limiting resistor in series with the LED. Calculate the resistor value based on the supply voltage (Vs), the LED's forward voltage (VF) at the desired current (IF), and the required current: R = (Vs - VF) / IF. Use the maximum VF from the datasheet for a conservative design.
• Thermal Management: Ensure the PCB layout allows for heat dissipation, especially when operating near maximum current or in high ambient temperatures. Avoid placing LEDs near other heat-generating components.
• ESD Protection: Implement ESD protection measures on assembly lines, particularly for the sensitive BH (blue) variant. Use grounded workstations and wrist straps.
• Optical Design: The wide 130-degree viewing angle provides good off-axis visibility. For focused light, external lenses or light guides may be necessary.

9. Technical Comparison and Differentiation

The 19-22 series offers distinct advantages in specific contexts. Compared to larger through-hole LEDs, its primary benefit is space savings and suitability for automated assembly. Within the SMD LED landscape, its 2.0x1.25mm footprint is a common size, offering a balance between light output and miniaturization. The key differentiator for this specific part is the availability of two distinct semiconductor technologies (AlGaInP for red, InGaN for blue) in the same mechanical package, simplifying procurement and design for multi-color applications. The detailed binning system for wavelength and intensity allows for high color consistency in production runs, which is crucial for applications like multi-segment displays or backlighting arrays where color matching is important.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Why is the maximum forward current different for the red (R6) and blue (BH) LEDs?

The difference stems from the underlying semiconductor materials (AlGaInP vs. InGaN) and their respective internal quantum efficiencies and thermal characteristics. The AlGaInP chip in the R6 LED can typically handle higher current densities within the same package thermal constraints, hence the higher rated current (25mA vs. 10mA).

10.2 Why is the ESD rating for the blue (BH) LED so much lower than for the red (R6)?

InGaN-based blue LEDs are inherently more susceptible to electrostatic discharge damage due to the material properties and the thinner active layers involved in the chip structure. The 150V HBM rating classifies it as very sensitive, requiring Class 0 ESD handling procedures.

10.3 Can I drive this LED without a current-limiting resistor if my power supply is precisely regulated at the LED's forward voltage?

No, this is strongly discouraged and will likely lead to failure. The forward voltage (VF) has a tolerance (±0.1V) and a negative temperature coefficient (it decreases as the junction heats up). Even a small excess voltage or a drop in VF due to heating can cause a runaway increase in current, exceeding the Absolute Maximum Rating and destroying the LED. A series resistor is non-negotiable for stable operation.

10.4 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak Wavelength (λp) is the wavelength at which the spectral power distribution is maximum. Dominant Wavelength (λd) is the single wavelength of monochromatic light that matches the perceived color of the LED. For LEDs with a symmetric spectrum, they are often close. For the purpose of color specification and binning, Dominant Wavelength is the standard metric used.

11. Practical Design and Usage Case

Scenario: Designing a compact status indicator panel with red and blue LEDs.

1. Selection: Choose the 19-22/R6 for red and 19-22/BH for blue to maintain identical footprint and soldering profile.
2. Circuit Calculation: For a 5V supply (Vs).
   • Red (R6, use max VF=2.25V, target IF=15mA): R = (5 - 2.25) / 0.015 ≈ 183 Ω. Use a standard 180 Ω or 200 Ω resistor.
   • Blue (BH, use max VF=3.25V, target IF=8mA): R = (5 - 3.25) / 0.008 ≈ 219 Ω. Use a standard 220 Ω resistor.
   Verify power dissipation in the resistors is within their ratings.
3. PCB Layout: Place the LEDs with correct polarity. Ensure adequate spacing for heat dissipation if multiple LEDs are clustered. Follow the recommended land pattern from the package drawing.
4. Assembly: Keep components in sealed bags until the production line is ready. Follow the specified reflow profile precisely. After assembly, avoid bending the PCB near the LEDs.
5. Binning: For a uniform appearance, specify tight bin codes (e.g., E5 for red, A10 for blue) when ordering, especially if multiple units will be viewed side-by-side.

12. Technology Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons and holes recombine in the active region, releasing energy in the form of photons. The color (wavelength) of the emitted light is determined by the bandgap energy of the semiconductor material used.

• R6 (AlGaInP): Aluminum Gallium Indium Phosphide is a material system with a direct bandgap suitable for producing high-efficiency light in the red, orange, and yellow spectrum. It is known for its high brightness and stability.
• BH (InGaN): Indium Gallium Nitride is the material system enabling high-brightness blue, green, and white LEDs. By varying the indium content, the bandgap can be tuned. Blue LEDs are a fundamental component for creating white light via phosphor conversion.

The SMD package encapsulates the tiny semiconductor chip, provides electrical connections via metal leads, and uses a clear epoxy resin lens to protect the chip and shape the light output.

13. Technology Development Trends

The general trajectory for SMD LEDs like the 19-22 series focuses on several key areas:

• Increased Efficiency (Lumens per Watt): Ongoing improvements in internal quantum efficiency and light extraction techniques lead to higher luminous intensity from the same or smaller chip sizes, reducing power consumption for a given light output.
• Improved Color Consistency and Rendering: Advances in epitaxial growth and binning processes allow for tighter tolerances on dominant wavelength and luminous intensity, which is critical for applications requiring precise color matching.
• Enhanced Reliability and Lifetime: Research into more robust package materials, better thermal interfaces, and more stable semiconductor structures continues to push mean time between failures (MTBF) higher, even under demanding operating conditions.
• Miniaturization: The drive for smaller end products pushes LED packages to ever-smaller footprints while maintaining or improving optical performance.
• Integration: Trends include integrating multiple LED chips (RGB) into a single package or combining the LED with control ICs (like constant current drivers) for smarter, simpler-to-use components.

These trends ensure that fundamental components like the 19-22 SMD LED will continue to evolve, offering designers better performance, reliability, and flexibility.