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LTS-5825SW-P LED Display Datasheet - 0.56-inch Digit Height - White Segments - 3.2V Forward Voltage - English Technical Document

Technical datasheet for the LTS-5825SW-P, a 0.56-inch single-digit SMD LED display with white segments, InGaN chip, common anode configuration, and detailed electrical/optical specifications.
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PDF Document Cover - LTS-5825SW-P LED Display Datasheet - 0.56-inch Digit Height - White Segments - 3.2V Forward Voltage - English Technical Document

1. Product Overview

The LTS-5825SW-P is a surface-mount device (SMD) designed as a single-digit numeric display. Its primary function is to provide clear, high-visibility numeric readouts in electronic equipment. The core component is an Indium Gallium Nitride (InGaN) white LED chip mounted on a sapphire substrate. This construction is known for its efficiency and stability. The display features a gray faceplate which enhances contrast, combined with white-light emitting segments for the characters.

1.1 Key Features and Advantages

The device offers several distinct advantages for integration into modern electronic designs:

2. Technical Specifications Deep Dive

This section provides a detailed, objective analysis of the device's operational limits and performance characteristics under defined conditions.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation at or beyond these limits is not guaranteed.

2.2 Electrical and Optical Characteristics

These are the typical performance parameters measured at Ta=25°C and a forward current (I_F) of 5 mA, which is a common test and operating condition.

2.3 Electrostatic Discharge (ESD) Sensitivity

Like most semiconductor devices, the LED chip is susceptible to damage from electrostatic discharge. The datasheet strongly recommends standard ESD prevention practices: using grounded wrist straps or anti-static gloves, ensuring all workstations and equipment are properly grounded, and employing ionizers to neutralize static charges that may accumulate on the plastic package during handling.

3. Binning System Explanation

To ensure consistency in production, devices are sorted into bins based on key parameters. This allows manufacturers to select parts with nearly identical characteristics for a uniform end product.

3.1 Forward Voltage (V_F) Binning

Devices are categorized into bins (3 through 7) based on their forward voltage at 5 mA. Each bin has a 0.1V range (e.g., Bin 3: 2.70V-2.80V, Bin 4: 2.80V-2.90V). The tolerance within each bin is ±0.1V. Matching V_F bins helps in designing simpler, more uniform driver circuits.

3.2 Luminous Intensity (I_V) Binning

This is a critical binning parameter for display uniformity. Bins are labeled (e.g., Q11, Q12, R11, R21) with defined minimum and maximum luminous intensity values in millicandelas (mcd). For instance, bin R21 covers 146.0 to 165.0 mcd. The tolerance for each intensity bin is ±15%. Using parts from the same or adjacent I_V bins is essential for a display where all digits have equal brightness.

3.3 Hue (Color) Binning

The white color point is also binned. The datasheet defines several hue bins (S1-2, S2-2, S3-1, etc.), each specifying a quadrilateral area on the CIE 1931 chromaticity diagram defined by four (x, y) coordinate pairs. The typical point (x=0.294, y=0.286) falls within the S3-1 and S4-1 bins. The tolerance for each hue coordinate is ±0.01. Consistent color bins prevent noticeable color differences between segments or digits in a multi-digit display.

4. Mechanical and Package Information

4.1 Package Dimensions

The device conforms to a standard SMD footprint. All critical dimensions are provided in millimeters with a general tolerance of ±0.25 mm unless otherwise specified. Key dimensional notes include limits on foreign material within the segment area (≤10 mils), surface ink contamination (≤20 mils), allowable bubbles in the segment (≤10 mils), maximum bending of the reflector (≤1% of its length), and a maximum burr size of 0.14 mm on the plastic pins. These ensure mechanical compatibility and visual quality.

4.2 Pin Configuration and Circuit Diagram

The LTS-5825SW-P is a common anode device. The internal circuit diagram shows ten pins controlling the seven main segments (A through G), the decimal point (DP), and two common anode connections. The pinout is as follows: Pin 1: Cathode E, Pin 2: Cathode D, Pin 3: Common Anode, Pin 4: Cathode C, Pin 5: Cathode DP, Pin 6: Cathode B, Pin 7: Cathode A, Pin 8: Common Anode, Pin 9: Cathode F, Pin 10: Cathode G. Pin 3 and Pin 8 are internally connected as the common anode. To illuminate a segment, its corresponding cathode pin must be driven low (connected to ground or a current sink) while the common anode is held high (connected to the positive supply through a current-limiting resistor).

5. Assembly and Application Guidelines

5.1 SMT Soldering Instructions

The device is designed for surface-mount assembly using reflow soldering processes. A critical instruction is that the number of reflow process cycles should be limited to less than two times. Repeated thermal cycling can stress the package and solder joints. The cooling process after reflow should return the assembly to normal ambient temperature in a controlled manner to prevent thermal shock.

5.2 Application Suggestions

The LTS-5825SW-P is ideal for applications requiring a single, highly readable numeric display. Common use cases include:

5.2.1 Design Considerations

6. Technical Comparison and Trends

6.1 Principle of Operation

The device operates on the principle of electroluminescence in a semiconductor p-n junction. When a forward voltage exceeding the diode's threshold (V_F) is applied, electrons and holes recombine in the active region of the InGaN chip, releasing energy in the form of photons (light). The sapphire substrate provides a stable, lattice-matched base for growing the high-quality InGaN layers necessary for efficient white light emission, often achieved using a blue LED chip with a phosphor coating.

6.2 Differentiation and Trends

Compared to older technologies like red GaAsP LEDs or vacuum fluorescent displays (VFDs), InGaN-based white LEDs offer superior efficiency, longer lifetime, lower operating voltage, and a more modern appearance. The trend in SMD displays is towards higher pixel density (more segments or dot-matrix), full-color capability (RGB), and integration with touch sensors or microcontrollers. However, for simple, low-cost, high-reliability numeric readouts, single-digit segment displays like the LTS-5825SW-P remain highly relevant due to their simplicity, excellent readability, and proven performance.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.