SMD LED 0201 Green Datasheet - Size 0.6x0.3x0.25mm - Voltage 2.8-3.8V - Power 80mW - English Technical Document

1. Product Overview

This document details the specifications for a miniature Surface-Mount Device (SMD) Light Emitting Diode (LED) in the 0201 package size. These LEDs are designed for automated printed circuit board (PCB) assembly and are ideal for space-constrained applications. The device utilizes InGaN (Indium Gallium Nitride) technology to produce green light.

1.1 Features

• Compliant with RoHS (Restriction of Hazardous Substances) directives.
• Packaged on 12mm tape wound onto 7-inch diameter reels for automated handling.
• Standard EIA (Electronic Industries Alliance) package outline.
• Input compatible with integrated circuit (IC) logic levels.
• Designed for compatibility with automated pick-and-place assembly equipment.
• Suitable for use in infrared (IR) reflow soldering processes.
• Preconditioned to accelerate to JEDEC (Joint Electron Device Engineering Council) Moisture Sensitivity Level 3.

1.2 Applications

This LED is suitable for a broad range of indicator and backlighting functions in various electronic equipment, including:

• Telecommunication devices (e.g., cordless phones, cellular phones).
• Office automation equipment (e.g., notebook computers).
• Home appliances.
• Industrial control systems.
• Network equipment.
• Indoor signage and symbol illumination.
• Front panel status indicators and backlighting.

2. Package Dimensions and Mechanical Information

The LED is housed in a miniature 0201 package. The lens is water clear. All dimensional drawings and tolerances are provided in the original datasheet figures. Key notes include:

• All dimensions are specified in millimeters, with inches in parentheses.
• The standard tolerance is ±0.2 mm (±0.008\") unless otherwise noted on the drawing.

3. Technical Parameters and Characteristics

3.1 Absolute Maximum Ratings

Ratings are specified at an ambient temperature (Ta) of 25°C. Exceeding these values may cause permanent damage.

• Power Dissipation (Pd): 80 mW
• Peak Forward Current (IFP): 100 mA (at 1/10 duty cycle, 0.1ms pulse width)
• Continuous Forward Current (IF): 20 mA
• Operating Temperature Range: -40°C to +85°C
• Storage Temperature Range: -40°C to +100°C

3.2 Electrical and Optical Characteristics

Typical performance is measured at Ta=25°C under the specified test conditions.

• Luminous Intensity (Iv): 280 - 710 mcd (typical, at IF=20mA). Measured with a sensor/filter approximating the CIE photopic eye response.
• Viewing Angle (2θ1/2): 110 degrees (typical). Defined as the full angle where intensity drops to half the axial value.
• Peak Emission Wavelength (λp): 518 nm (typical). Tolerance is ±1 nm.
• Dominant Wavelength (λd): 520 - 535 nm (at IF=20mA). Derived from CIE chromaticity coordinates.
• Spectral Line Half-Width (Δλ): 35 nm (typical).
• Forward Voltage (VF): 2.8 - 3.8 V (at IF=20mA). Tolerance is ±0.1 V.
• Reverse Current (IR): 10 μA maximum (at VR=5V). The device is not designed for reverse bias operation.

3.3 Suggested IR Reflow Profile

A reflow soldering profile compliant with J-STD-020B for lead-free processes is recommended. Key parameters include a peak temperature not exceeding 260°C. A detailed temperature vs. time graph is provided in the original document.

4. Bin Rank System

Devices are classified into bins based on key parameters to ensure consistency in application.

4.1 Forward Voltage (VF) Rank

Binned at IF=20mA. Tolerance per bin is ±0.10V.
Example bins: D7 (2.8-3.0V), D8 (3.0-3.2V), D9 (3.2-3.4V), D10 (3.4-3.6V), D11 (3.6-3.8V).

4.2 Luminous Intensity (Iv) Rank

Binned at IF=20mA. Tolerance per bin is ±11%.
Example bins: T1 (280-355 mcd), T2 (355-450 mcd), U1 (450-560 mcd), U2 (560-710 mcd).

4.3 Dominant Wavelength (WD) Rank

Binned at IF=20mA. Tolerance per bin is ±1 nm.
Example bins: AP (520.0-525.0 nm), AQ (525.0-530.0 nm), AR (530.0-535.0 nm).

5. Performance Curve Analysis

The datasheet includes typical characteristic curves (at 25°C unless noted) such as:
- Relative Luminous Intensity vs. Forward Current.
- Forward Voltage vs. Forward Current.
- Relative Luminous Intensity vs. Ambient Temperature.
- Spectral Distribution (relative intensity vs. wavelength).
These curves are essential for understanding device behavior under different operating conditions, such as derating intensity with increased current or temperature.

6. User Guide and Handling

6.1 Cleaning

Only use specified cleaning agents. Immersion in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute is acceptable if necessary. Unspecified chemicals may damage the package.

6.2 Recommended PCB Attachment Pad Layout

A land pattern diagram is provided for infrared or vapor phase reflow soldering to ensure proper solder joint formation and alignment.

6.3 Packaging: Tape and Reel

The LEDs are supplied on embossed carrier tape with a protective cover tape. Key specifications:
- Tape width: 12 mm.
- Reel diameter: 7 inches.
- Quantity per reel: 4000 pieces.
- Minimum order quantity for remnants: 500 pieces.
- Conforms to ANSI/EIA-481 specifications.
Detailed dimensional drawings for the tape pocket and the reel are included.

7. Important Cautions and Application Notes

7.1 Intended Application

These LEDs are designed for ordinary electronic equipment. They are not recommended for safety-critical applications where failure could jeopardize life or health (e.g., aviation, medical life-support) without prior consultation and specific qualification.

7.2 Storage Conditions

Sealed Package: Store at ≤30°C and ≤70% RH. Use within one year of opening the moisture barrier bag.
Opened Package: Store at ≤30°C and ≤60% RH. For components exposed beyond 168 hours, baking at approximately 60°C for at least 48 hours before soldering is recommended. For extended storage, use a sealed container with desiccant or a nitrogen atmosphere.

7.3 Soldering Guidelines

Reflow Soldering:
- Preheat: 150-200°C.
- Preheat time: Max 120 seconds.
- Peak temperature: Max 260°C.
- Time above liquidus: Max 10 seconds (max two reflow cycles).
Hand Soldering (Iron):
- Iron temperature: Max 300°C.
- Soldering time per lead: Max 3 seconds (one time only).
Adherence to JEDEC profile limits and solder paste manufacturer recommendations is crucial for reliability.

8. Design Considerations and Technical Insights

8.1 Current Limiting

The absolute maximum continuous forward current is 20 mA. A series current-limiting resistor must always be used in circuit design to prevent exceeding this value, which is calculated based on the supply voltage and the LED's forward voltage (VF). Using the typical VF for calculation provides a starting point, but designing for the maximum VF ensures the current limit is never exceeded.

8.2 Thermal Management

With a power dissipation limit of 80 mW, thermal considerations are important, especially in high-density layouts or high ambient temperatures. The derating curve showing luminous intensity vs. ambient temperature indicates a significant drop in output as temperature rises. Ensuring adequate PCB copper area for heat sinking and avoiding placement near other heat-generating components can help maintain performance and longevity.

8.3 Optical Design

The wide 110-degree viewing angle makes this LED suitable for applications requiring broad visibility. For more focused illumination, external lenses or light guides may be necessary. The water-clear lens with a green InGaN chip provides a saturated color point defined by its dominant wavelength bin.

8.4 Binning for Consistency

For applications requiring uniform color or brightness across multiple LEDs (e.g., backlighting arrays), specifying tight bins for Dominant Wavelength (WD) and Luminous Intensity (Iv) is critical. Mixing bins from different ends of the range can lead to visible color or brightness mismatches.

9. Comparison and Selection Context

The 0201 package represents one of the smallest standardized SMD LED footprints, enabling ultra-miniaturized designs. Compared to larger packages like 0402 or 0603, the 0201 LED typically has lower maximum current ratings and light output due to its size but offers the smallest possible footprint and height. The InGaN technology used for green provides higher efficiency and better color saturation than older technologies like GaP (Gallium Phosphide).

10. Frequently Asked Questions (Based on Parameters)

Q: Can I drive this LED at 30 mA for higher brightness?
A: No. The absolute maximum continuous forward current is 20 mA. Exceeding this rating risks catastrophic failure and voids reliability specifications.

Q: The forward voltage range is 2.8-3.8V. How do I choose a resistor value?
A: Design your current-limiting circuit using the maximum VF (3.8V) from the datasheet to ensure the current never exceeds 20 mA under worst-case conditions, even if you receive LEDs from the lower voltage bins.

Q: How long can I store these LEDs after opening the reel?
A: For best soldering results, complete IR reflow within 168 hours (7 days) of exposure to ambient factory conditions (<30°C/60% RH). If exposure exceeds this, a 48-hour bake at 60°C is recommended to remove absorbed moisture and prevent \"popcorning\" during reflow.

Q: Is this LED suitable for automotive dashboard lighting?
A: The operating temperature range (-40°C to +85°C) covers many automotive interior applications. However, automotive use typically requires specific AEC-Q102 qualification which is not stated in this generic datasheet. Consultation with the manufacturer for automotive-grade products is necessary.

11. Technology Principles and Trends

Principle: This LED is based on InGaN semiconductor material. When a forward voltage is applied, electrons and holes recombine in the active region, releasing energy in the form of photons. The specific composition of the InGaN alloy determines the bandgap energy and thus the wavelength (color) of the emitted light, in this case, green.

Trends: The optoelectronics industry continues to drive towards smaller package sizes (like 0201 and 01005), higher luminous efficacy (more light output per watt), and improved reliability. There is also a trend towards tighter binning for color and intensity to meet the demands of high-resolution displays and consistent aesthetic lighting. Furthermore, integration with drive electronics and intelligent control within the package is an ongoing area of development.