SMD LED 17-21/GVC-AMPB/3T Datasheet - 2.0x1.25x0.8mm - Green (568nm) - 20mA - English Technical Document

1. Product Overview

The 17-21 SMD LED is a compact, surface-mount device designed for modern electronic applications requiring reliable indicator lighting and backlighting. This component utilizes AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor technology to produce a green light output with a typical peak wavelength of 568nm. Its primary advantage lies in its miniature footprint, which enables higher packing density on printed circuit boards (PCBs), reduces required storage space, and contributes to the overall miniaturization of end equipment. The lightweight construction further makes it ideal for portable and space-constrained applications.

This LED is packaged on 8mm tape wound onto a 7-inch diameter reel, making it fully compatible with high-speed automatic pick-and-place assembly equipment. It is designed for use with standard infrared (IR) and vapor phase reflow soldering processes, ensuring seamless integration into modern manufacturing lines. The product is compliant with key environmental and safety regulations, being Pb-free, RoHS compliant, EU REACH compliant, and halogen-free (with Bromine <900 ppm, Chlorine <900 ppm, and Br+Cl < 1500 ppm).

2. Technical Parameters Deep Analysis

2.1 Absolute Maximum Ratings

The device's operational limits are defined under specific ambient conditions (Ta=25°C). Exceeding these ratings may cause permanent damage.

• Reverse Voltage (VR): 5V. This is a critical parameter; applying a reverse voltage exceeding 5V can break down the LED's PN junction.
• Continuous Forward Current (IF): 25 mA. This is the maximum DC current recommended for continuous operation to ensure long-term reliability and prevent thermal runaway.
• Peak Forward Current (IFP): 60 mA. This rating applies under pulsed conditions with a duty cycle of 1/10 at 1 kHz. It allows for brief periods of higher brightness but should not be used for DC operation.
• Power Dissipation (Pd): 60 mW. This represents the maximum power the package can dissipate as heat. Exceeding this limit raises the junction temperature, degrading performance and lifespan.
• Electrostatic Discharge (ESD) Human Body Model (HBM): 2000V. This rating indicates a moderate level of ESD protection. Standard ESD handling precautions are still necessary during assembly and handling.
• Operating Temperature (Topr): -40°C to +85°C. The LED is rated to function across this broad industrial temperature range.
• Storage Temperature (Tstg): -40°C to +90°C.
• Soldering Temperature (Tsol): The device can withstand reflow soldering with a peak temperature of 260°C for up to 10 seconds. For hand soldering, the iron tip temperature should not exceed 350°C for a maximum of 3 seconds per terminal.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test current of IF=20mA and Ta=25°C. They define the core light output and electrical performance.

• Luminous Intensity (Iv): Ranges from a minimum of 18.00 mcd to a maximum of 72.00 mcd. The typical value depends on the specific bin code (M, N, P). This is a measure of perceived brightness.
• Viewing Angle (2θ1/2): Typically 140 degrees. This wide viewing angle makes the LED suitable for applications where light needs to be visible from a broad range of positions.
• Peak Wavelength (λp): Typically 568 nm. This is the wavelength at which the spectral power distribution is maximum.
• Dominant Wavelength (λd): Ranges from 563.50 nm to 571.50 nm, binned into specific codes (C13 to C16). This is the single wavelength perceived by the human eye and is crucial for color consistency.
• Spectral Bandwidth (Δλ): Typically 20 nm. This defines the spread of the emitted spectrum around the peak wavelength.
• Forward Voltage (VF): Ranges from 1.75V to 2.35V at 20mA, binned into codes (0, 1, 2). This parameter is vital for designing the current-limiting resistor in the driving circuit.
• Reverse Current (IR): Maximum of 10 μA when a reverse voltage of 5V is applied. The datasheet explicitly notes the device is not designed for reverse operation.

Important Notes: The datasheet specifies tolerances for key parameters: Luminous Intensity (±11%), Dominant Wavelength (±1nm), and Forward Voltage (±0.1V). These tolerances apply within each bin and are critical for design margin calculations.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into bins based on measured performance. This allows designers to select parts that meet specific application requirements for brightness, color, and voltage.

3.1 Luminous Intensity Binning

Bins are defined by minimum and maximum luminous intensity values at IF=20mA.

• Bin M: 18.00 mcd (Min) to 28.50 mcd (Max)
• Bin N: 28.50 mcd (Min) to 45.00 mcd (Max)
• Bin P: 45.00 mcd (Min) to 72.00 mcd (Max)

Selecting a higher bin (e.g., P) guarantees higher minimum brightness but may come at a premium cost.

3.2 Dominant Wavelength Binning

This binning ensures color consistency. The dominant wavelength is sorted into 2nm steps.

• Bin C13: 563.50 nm to 565.50 nm
• Bin C14: 565.50 nm to 567.50 nm
• Bin C15: 567.50 nm to 569.50 nm
• Bin C16: 569.50 nm to 571.50 nm

For applications where a specific shade of green is critical, specifying a tight wavelength bin is essential.

3.3 Forward Voltage Binning

Voltage binning helps in designing more predictable and efficient driver circuits, especially when multiple LEDs are connected in series.

• Bin 0: 1.75V to 1.95V
• Bin 1: 1.95V to 2.15V
• Bin 2: 2.15V to 2.35V

Using LEDs from the same voltage bin minimizes current imbalance in parallel configurations.

4. Performance Curve Analysis

The datasheet references typical electro-optical characteristic curves. While the specific graphs are not detailed in the provided text, standard curves for such LEDs would typically include:

• Relative Luminous Intensity vs. Forward Current (I-V Curve): Shows how light output increases with current, typically in a sub-linear fashion at higher currents due to heating effects.
• Forward Voltage vs. Forward Current: Demonstrates the exponential relationship, crucial for thermal management and driver design.
• Relative Luminous Intensity vs. Ambient Temperature: Shows the derating of light output as junction temperature increases. AlGaInP LEDs generally experience a significant drop in output with rising temperature.
• Spectral Distribution: A plot of relative intensity versus wavelength, showing the peak at ~568nm and the ~20nm bandwidth.
• Viewing Angle Pattern: A polar plot illustrating the angular distribution of light intensity, confirming the 140-degree viewing angle.

These curves are essential for predicting real-world performance under non-standard conditions (different currents, temperatures).

5. Mechanical and Package Information

5.1 Package Dimensions

The 17-21 SMD LED has a compact rectangular package. Key dimensions (in mm, tolerance ±0.1mm unless specified) include:

• Overall Length: 2.0 mm
• Overall Width: 1.25 mm
• Overall Height: 0.8 mm
• Lead (Terminal) dimensions and spacing are specified for PCB pad layout design.

A cathode mark is clearly indicated on the package for correct polarity orientation during assembly. The recommended PCB land pattern (pad design) should follow these dimensions to ensure proper soldering and mechanical stability.

5.2 Reel, Tape, and Packaging

The device is supplied in a moisture-sensitive device (MSD) package, Level 3 according to IPC/JEDEC standards.

• Carrier Tape: 8mm wide, with pockets holding the LEDs. Dimensions for the tape, pocket, and cover tape are provided to ensure compatibility with feeders.
• Reel: 7-inch diameter reel. Reel dimensions (hub diameter, flange diameter, width) are specified for automated handling equipment.
• Packing Quantity: 3000 pieces per reel.
• Moisture Barrier Bag: The reel is sealed inside an aluminum laminated moisture-proof bag along with a humidity indicator card and desiccant to protect the LEDs from ambient moisture during storage and transport.

Label Explanation: The reel label contains critical information for traceability and correct application: Customer's Product Number (CPN), Manufacturer's Part Number (P/N), Quantity (QTY), and the specific Binning Codes for Luminous Intensity (CAT), Dominant Wavelength/Hue (HUE), and Forward Voltage (REF), along with the Lot Number (LOT No).

6. Soldering and Assembly Guidelines

Proper handling and soldering are critical to reliability.

6.1 Storage and Handling

• Do not open the moisture barrier bag until ready for use.
• After opening, unused LEDs must be stored at ≤30°C and ≤60% Relative Humidity (RH).
• The "floor life" after bag opening is 168 hours (7 days). If exceeded, or if the desiccant indicator shows activation, the LEDs must be baked at 60°C ±5°C for 24 hours before use to remove absorbed moisture and prevent "popcorning" during reflow.

6.2 Reflow Soldering Profile

A lead-free (Pb-free) reflow profile is specified:

• Pre-heating: Ramp from ambient to 150-200°C over 60-120 seconds.
• Soak/Preheat: Maintain between 150-200°C.
• Liquidous Time: Time above 217°C should be 60-150 seconds.
• Peak Temperature: Maximum of 260°C.
• Time at Peak: Should not exceed 10 seconds at 260°C.
• Ramp-up Rate: Maximum 6°C/second.
• Ramp-down Rate: Maximum 3°C/second.
• Critical Rule: Reflow soldering should not be performed more than two times on the same LED.

6.3 Hand Soldering and Rework

• Use a soldering iron with a tip temperature <350°C and power <25W.
• Limit soldering time per terminal to ≤3 seconds.
• Allow a cooling interval of ≥2 seconds between soldering terminals.
• Avoid mechanical stress on the LED body during heating.
• Repair after soldering is strongly discouraged. If unavoidable, a specialized double-head soldering iron must be used to simultaneously heat both terminals, and the effect on LED characteristics must be verified.
• Do not warp the PCB after soldering.

7. Application Suggestions and Design Considerations

7.1 Typical Application Scenarios

• Backlighting: Ideal for backlighting symbols, switches, and small areas on dashboards, control panels, and consumer electronics.
• Status Indicators: Perfect for power, connectivity, and function status indicators in telecommunication equipment (phones, faxes), computer peripherals, and industrial controls.
• General Purpose Indication: Any application requiring a small, bright, reliable green light source.

7.2 Design Considerations

• Current Limiting: An external current-limiting resistor is mandatory. The forward voltage has a negative temperature coefficient, meaning it decreases as temperature rises. Without a resistor, a small increase in voltage can cause a large, potentially destructive increase in current (thermal runaway). The resistor value is calculated using R = (Vsupply - VF) / IF.
• Thermal Management: While the package is small, power dissipation (up to 60mW) must be considered, especially in high ambient temperatures or enclosed spaces. Adequate PCB copper area around the pads can act as a heat sink.
• ESD Protection: Implement standard ESD controls in the assembly area. While rated for 2000V HBM, additional protection diodes on the PCB may be necessary in high-risk environments.
• Optical Design: The wide 140-degree viewing angle provides good off-axis visibility. For focused light, external lenses or light guides may be required.

8. Application Restrictions and Reliability Note

The datasheet includes a critical disclaimer. This standard commercial-grade LED is not qualified or recommended for use in high-reliability or safety-critical applications without prior consultation and specific qualification. This explicitly includes:

• Military and Aerospace systems
• Automotive Safety and Security systems (e.g., airbag indicators, brake lights)
• Medical Life-Support or Diagnostic equipment

The specification guarantees performance only within the stated limits and as an individual component. The designer is responsible for ensuring the product is not used beyond these specifications and is suitable for the intended application's lifetime and environmental conditions.

9. Technical Comparison and Differentiation

The 17-21 package offers a balance between size and performance. Compared to larger leaded LEDs (e.g., 3mm or 5mm), it provides significant space savings and better suitability for automated assembly. Compared to even smaller chip-scale packages (CSP), the 17-21 offers easier handling, standard soldering processes, and typically better heat dissipation due to its molded package with metal leads. The use of AlGaInP technology for green offers higher efficiency and better color saturation compared to older technologies like GaP, especially in the green spectrum.

10. Frequently Asked Questions (FAQ)

Q: What resistor value should I use for a 5V supply?
A: Using the maximum VF (2.35V) for a safety margin at IF=20mA: R = (5V - 2.35V) / 0.020A = 132.5 Ohms. A standard 130 or 150 Ohm resistor would be appropriate. Always verify current with the actual VF of your LED bin.

Q: Can I drive this LED at 30mA for more brightness?
A: No. The Absolute Maximum Rating for continuous forward current (IF) is 25mA. Operating at 30mA exceeds this rating, which will reduce reliability and lifespan, and may cause immediate failure.

Q: My bag was opened 10 days ago. Can I still use the LEDs?
A: First, check the humidity indicator card. If it indicates exposure (e.g., color change), you must bake the LEDs at 60°C for 24 hours before use to drive out moisture and prevent solder joint damage during reflow.

Q: How do I interpret the bin codes on the label?
A: The label shows CAT (Luminous Intensity bin, e.g., N), HUE (Wavelength bin, e.g., C14), and REF (Voltage bin, e.g., 1). This tells you the specific performance range of the LEDs on that reel.

Q: Why is the reverse voltage rating only 5V?
A> LEDs are not designed to be operated in reverse bias. The 5V rating is a withstand voltage for protection against accidental reverse connection during testing or assembly. For circuit protection against transient reverse voltages, an external diode in parallel (cathode to anode) is recommended.