SMD LED 16-213/GHC-YR1S1/3T Datasheet - Brilliant Green - 2.7-3.7V - 25mA - English Technical Document

1. Product Overview

The 16-213/GHC-YR1S1/3T is a surface-mount device (SMD) LED designed for modern electronic applications requiring compact size, high reliability, and excellent optical performance. This component utilizes an InGaN (Indium Gallium Nitride) semiconductor chip to produce a brilliant green light output. Its primary advantages include a significantly reduced footprint compared to traditional lead-frame LEDs, enabling higher packing density on printed circuit boards (PCBs), reduced storage requirements, and ultimately contributing to the miniaturization of end equipment. The device is lightweight, making it particularly suitable for space-constrained and portable applications.

Key product positioning includes its use as a high-efficiency indicator and backlighting source. It is packaged on 8mm tape wound onto 7-inch diameter reels, ensuring compatibility with standard automated pick-and-place assembly equipment. The LED is constructed with a water-clear resin encapsulation, which maximizes light output and provides a clean, bright appearance.

2. Technical Specifications Deep Dive

2.1 Absolute Maximum Ratings

The device's operational limits are defined under conditions of Ta=25°C. Exceeding these ratings may cause permanent damage.

• Reverse Voltage (V_R): 5V. Applying a reverse voltage higher than this can break down the LED's PN junction.
• Continuous Forward Current (I_F): 25mA. This is the maximum DC current recommended for continuous operation.
• Peak Forward Current (I_FP): 100mA. This rating applies under pulsed conditions with a duty cycle of 1/10 at 1kHz, allowing for brief periods of higher brightness.
• Power Dissipation (P_d): 110mW. This is the maximum power the package can dissipate as heat without exceeding its thermal limits.
• Electrostatic Discharge (ESD): Withstands 150V (Human Body Model). Proper ESD handling procedures are essential during assembly.
• Operating Temperature (T_opr): -40°C to +85°C. The LED is rated for operation in a wide range of environmental conditions.
• Storage Temperature (T_stg): -40°C to +90°C.
• Soldering Temperature (T_sol): The device can withstand reflow soldering with a peak temperature of 260°C for up to 10 seconds, or hand soldering at 350°C for up to 3 seconds per terminal.

2.2 Electro-Optical Characteristics

Typical performance is measured at Ta=25°C with I_F=20mA, unless otherwise specified.

• Luminous Intensity (I_v): Ranges from a minimum of 112 mcd to a maximum of 225 mcd, with a typical value within this bin range. A tolerance of ±11% applies.
• Viewing Angle (2θ_1/2): 120 degrees. This wide angle ensures good visibility from various perspectives.
• Peak Wavelength (λ_p): Typically 518 nm, indicating the wavelength at which the emitted light intensity is highest.
• Dominant Wavelength (λ_d): Ranges from 520 nm to 535 nm, defining the perceived color (green). A tolerance of ±1 nm applies.
• Spectral Bandwidth (Δλ): Typically 35 nm, measured at half the maximum intensity (FWHM).
• Forward Voltage (V_F): Ranges from 2.7V (min) to 3.7V (max), with a typical value of 3.3V at 20mA. A tolerance of ±0.05V applies.
• Reverse Current (I_R): Maximum of 50 μA when a reverse voltage of 5V is applied.

3. Binning System Explanation

The product is classified into bins based on key optical and electrical parameters to ensure consistency in application design.

3.1 Luminous Intensity Binning

Bins are defined for I_v at I_F=20mA:

• R1: 112 mcd to 140 mcd
• R2: 140 mcd to 180 mcd
• S1: 180 mcd to 225 mcd

The specific bin code (e.g., part of GHC-YR1S1) indicates the guaranteed intensity range for that particular unit.

3.2 Dominant Wavelength Binning

Bins are defined for λ_d at I_F=20mA:

• X: 520 nm to 525 nm
• Y: 525 nm to 530 nm
• Z: 530 nm to 535 nm

This allows designers to select LEDs with a very specific shade of green for color-matching applications.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that are critical for design.

4.1 Relative Luminous Intensity vs. Ambient Temperature

The curve shows that luminous intensity is relatively stable from -40°C to approximately 25°C. Beyond 25°C, the intensity gradually decreases as temperature increases, a common characteristic of LEDs due to increased non-radiative recombination and other thermal effects. At the maximum operating temperature of 85°C, the output may be significantly reduced compared to room temperature. This must be factored into designs where high ambient temperatures are expected.

4.2 Forward Current Derating Curve

This graph defines the maximum allowable forward current as a function of ambient temperature. At 25°C, the full 25mA is permitted. As ambient temperature rises, the maximum permissible current must be reduced linearly to prevent exceeding the device's 110mW power dissipation limit and to ensure long-term reliability. This is crucial for preventing thermal runaway and premature failure.

3.3 Luminous Intensity vs. Forward Current

The relationship is generally linear at lower currents but may show signs of saturation or efficiency droop at higher currents (approaching the maximum rating). The curve allows designers to predict brightness for a given drive current.

4.4 Spectrum Distribution

The spectral plot shows a single, dominant peak centered around 518 nm (green), with the characteristic 35 nm FWHM. There is minimal emission in other parts of the visible spectrum, confirming a pure green color.

4.5 Forward Current vs. Forward Voltage

This IV curve demonstrates the exponential relationship typical of a diode. The forward voltage increases with current. The specified V_F range (2.7V-3.7V at 20mA) is visible on this curve. Designers use this to calculate the necessary current-limiting resistor value for a given supply voltage.

4.6 Radiation Pattern

The polar diagram illustrates the 120° viewing angle. The intensity is nearly uniform within the central cone and falls off towards the edges. This pattern is important for applications requiring specific illumination angles.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a compact SMD footprint. Critical dimensions include the body size, lead spacing, and overall height. A detailed dimensioned drawing is provided in the datasheet with a standard tolerance of ±0.1mm unless otherwise noted. The suggested pad layout on the PCB is also shown, which is designed for reliable soldering and mechanical stability. Designers are advised to modify the pad dimensions based on their specific PCB manufacturing process and thermal requirements.

5.2 Polarity Identification

The component has an anode and a cathode. The datasheet drawing indicates the polarity, typically marked by a notch, a dot, or a different lead shape. Correct polarity must be observed during PCB layout and assembly to ensure proper function.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A detailed temperature profile for lead-free reflow soldering is provided:

• Pre-heating: 150-200°C for 60-120 seconds.
• Time Above Liquidus (217°C): 60-150 seconds.
• Peak Temperature: 260°C maximum, held for no more than 10 seconds.
• Heating Rate: Maximum 6°C/second.
• Cooling Rate: Maximum 3°C/second.

It is recommended not to subject the LED to more than two reflow cycles. Stress on the LED body during heating and warping of the PCB after soldering should be avoided.

6.2 Hand Soldering

If hand soldering is necessary, the iron tip temperature should be less than 350°C, and contact time per terminal should not exceed 3 seconds. A low-power iron (≤25W) is recommended. A cooling interval of at least 2 seconds should be allowed between soldering the two terminals to prevent thermal shock.

6.3 Rework and Repair

Repair after soldering is discouraged. If unavoidable, a dual-head soldering iron should be used to simultaneously heat both terminals, minimizing stress on the LED. The potential impact on LED characteristics from rework must be evaluated beforehand.

7. Packaging and Ordering Information

7.1 Reel and Tape Specifications

The LEDs are supplied in embossed carrier tape with dimensions specified in the datasheet. Each reel contains 3000 pieces. Reel dimensions (7-inch diameter) are provided for automated handling equipment setup.

7.2 Moisture Sensitivity and Storage

The product is packaged in a moisture-proof aluminum bag with desiccant and a humidity indicator card. To prevent moisture-induced damage ("popcorning") during reflow:

• Before opening: Store at ≤30°C and ≤90% RH.
• After opening: The "floor life" is 1 year under ≤30°C and ≤60% RH. Unused parts should be resealed.
• Baking: If the desiccant indicates saturation or storage time is exceeded, bake at 60±5°C for 24 hours before use.

7.3 Label Explanation

The reel label contains codes for:

• Customer Part Number (CPN)
• Product Number (P/N)
• Packing Quantity (QTY)
• Luminous Intensity Rank (CAT)
• Chromaticity/Dominant Wavelength Rank (HUE)
• Forward Voltage Rank (REF)
• Lot Number (LOT No.)

8. Application Suggestions

8.1 Typical Application Scenarios

• Backlighting: Ideal for dashboard indicators, switch illumination, and flat backlighting for LCD panels and symbols.
• Telecommunications: Status indicators and keypad backlighting in telephones and fax machines.
• General Indication: Power status, mode selection, and other user interface indicators in a wide variety of consumer, industrial, and automotive electronics.

8.2 Critical Design Considerations

• Current Limiting: An external series resistor is absolutely mandatory to limit forward current. The LED's exponential V-I characteristic means a small voltage increase can cause a large, destructive current surge.
• Thermal Management: Adhere to the forward current derating curve. Ensure adequate PCB copper area or other heatsinking if operating at high ambient temperatures or near maximum current.
• ESD Protection: Implement ESD protection circuits on sensitive lines and follow proper handling procedures during assembly.
• Optical Design: Consider the 120° viewing angle and radiation pattern when designing light guides, lenses, or diffusers to achieve the desired illumination effect.

9. Technical Comparison and Differentiation

Compared to older through-hole LED technologies, this SMD LED offers significant advantages:

• Size & Density: Drastically smaller footprint enables miniaturization.
• Automation: Fully compatible with high-speed SMT assembly, reducing manufacturing cost.
• Performance: InGaN technology provides higher efficiency and brighter green output compared to older materials.
• Reliability: SMD construction often leads to better thermal performance and mechanical robustness when properly soldered.
• Compliance: The device is Pb-free, complies with RoHS and EU REACH regulations, and meets halogen-free standards (Br <900ppm, Cl <900ppm, Br+Cl <1500ppm), making it suitable for environmentally conscious designs and global markets.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What resistor value should I use with a 5V supply?

Using Ohm's Law (R = (V_supply - V_F) / I_F) and assuming a typical V_F of 3.3V at 20mA: R = (5V - 3.3V) / 0.02A = 85 ohms. A standard 82 or 100 ohm resistor would be appropriate. Always calculate for the minimum V_F (2.7V) to ensure current does not exceed the maximum rating.

10.2 Can I drive this LED at 30mA for more brightness?

No. The Absolute Maximum Rating for continuous forward current is 25mA. Exceeding this rating compromises reliability and may cause immediate or gradual failure. For higher brightness, select an LED from a higher luminous intensity bin (e.g., S1 bin) or a product rated for higher current.

10.3 How does temperature affect the light output?

As shown in the performance curves, luminous intensity decreases as ambient temperature increases. At 85°C, the output may be only 60-70% of its 25°C value. This must be accounted for in the optical design of the system.

10.4 Is a heatsink required?

For continuous operation at 20mA and moderate ambient temperatures (<50°C), the heat is typically dissipated adequately through the LED's leads into the PCB copper. Following the suggested pad layout improves this. For high ambient temperatures or if driving near the maximum current, increasing the PCB copper area connected to the LED pads acts as an effective heatsink.

11. Design and Usage Case Study

Scenario: Designing a status indicator panel for an industrial controller.

1. Requirement: Multiple brilliant green LEDs to indicate "System Ready" status. The panel operates in an environment up to 60°C.
2. Selection: The 16-213/GHC-YR1S1/3T in the S1 bin (180-225 mcd) is chosen for high visibility.
3. Circuit Design: Using a 3.3V system rail. Assuming V_F = 3.3V, a series resistor is calculated: R = (3.3V - 3.3V) / 0.02A = 0 ohms. This is invalid. Therefore, the LED is driven at a lower current, e.g., 15mA. R = (3.3V - 3.0V*) / 0.015A = 20 ohms. (*V_F estimated lower for 15mA from IV curve).
4. Thermal Check: At 60°C ambient, the derating curve requires reducing the maximum current. Operating at 15mA provides a good safety margin below the derated limit, ensuring long-term reliability.
5. Layout: The PCB pad design follows the datasheet recommendation, with additional copper pours connected to the cathode pad for heat spreading.
6. Result: A reliable, consistently bright indicator system suitable for the operating environment.

12. Operating Principle Introduction

This LED operates on the principle of electroluminescence in a semiconductor PN junction. The active region is composed of InGaN. When a forward voltage exceeding the diode's threshold is applied, electrons and holes are injected into the active region from the N-type and P-type layers, respectively. These charge carriers recombine, releasing energy in the form of photons. The specific composition of the InGaN alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, green (~518 nm). The water-clear epoxy resin encapsulant protects the semiconductor chip, provides mechanical stability, and acts as a lens to shape the light output beam.

13. Technology Trends

The development of SMD LEDs like this one is part of broader trends in optoelectronics:

• Miniaturization: Continuous reduction in package size (e.g., from 0603 to 0402 to 0201 metric sizes) to enable ever-smaller devices.
• Increased Efficiency: Ongoing improvements in epitaxial growth and chip design lead to higher luminous efficacy (more light output per electrical watt input).
• Color Consistency: Tighter binning specifications and advanced manufacturing processes ensure very uniform color and brightness across production batches, critical for multi-LED arrays and displays.
• Enhanced Reliability: Improved packaging materials and thermal management designs are extending operational lifetimes and allowing use in harsher environments (higher temperature, humidity).
• Integration: Trends include integrating control ICs, current-limiting resistors, or even multiple color chips (RGB) into a single package, simplifying circuit design for the end user.

These trends drive the component's evolution towards more capable, reliable, and application-friendly solutions.