SMD LED Orange AlInGaP 0603 Package Datasheet - Dimensions 1.6x0.8x0.6mm - Voltage 1.8-2.4V - Power 72mW - English Technical Document

1. Product Overview

This document details the specifications for a high-brightness, miniature Surface-Mount Device (SMD) Light Emitting Diode (LED). The device is designed in the industry-standard 0603 package footprint, making it suitable for automated printed circuit board (PCB) assembly processes. Its compact size is ideal for space-constrained applications where reliable status indication or backlighting is required.

1.1 Core Advantages and Target Market

The primary advantages of this LED include its compatibility with high-volume, automated pick-and-place equipment and infrared (IR) reflow soldering processes, which are standard in modern electronics manufacturing. It is constructed using Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor technology, which is known for producing efficient and bright orange light. The device is compliant with relevant environmental regulations.

Its target applications span a wide range of consumer and industrial electronics, including but not limited to telecommunications equipment (e.g., cellular phones), portable computing devices, networking hardware, home appliances, and indoor signage or display backlighting. Its primary function is as a status indicator or low-level luminary.

2. Technical Parameters: In-Depth Objective Interpretation

This section provides a detailed breakdown of the device's absolute limits and operational characteristics. Understanding these parameters is crucial for reliable circuit design and ensuring long-term performance.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

• Power Dissipation (Pd): 72 mW. This is the maximum amount of power the device can dissipate as heat without exceeding its thermal limits.
• Peak Forward Current (I_F(PEAK)): 80 mA. This current is permissible only under pulsed conditions (1/10 duty cycle, 0.1ms pulse width) for very short durations, such as during testing.
• Continuous Forward Current (I_F): 30 mA DC. This is the maximum recommended current for continuous operation.
• Reverse Voltage (V_R): 5 V. Applying a reverse voltage exceeding this limit can cause immediate breakdown. The device is not intended for reverse-bias operation.
• Operating Temperature Range (T_opr): -40°C to +85°C. The device is guaranteed to function within this ambient temperature range.
• Storage Temperature Range (T_stg): -40°C to +100°C. The device can be stored without degradation within these limits.

2.2 Electro-Optical Characteristics

These parameters are measured under standard test conditions (Ta=25°C, I_F=20mA) and define the device's performance.

• Luminous Intensity (I_V): 90.0 - 280.0 mcd (millicandela). This is a measure of the perceived brightness of the light output as seen by the human eye. The wide range is managed through a binning system.
• Viewing Angle (2θ_1/2): 110 degrees. This is the full angle at which the luminous intensity drops to half of its value measured on-axis (directly in front of the LED). A 110° angle indicates a wide viewing pattern.
• Peak Emission Wavelength (λ_P): 611 nm (typical). This is the wavelength at which the spectral power output is highest.
• Dominant Wavelength (λ_d): 600 - 612 nm. This is the single wavelength that best represents the perceived color of the light, derived from chromaticity coordinates. It is the key parameter for color sorting.
• Spectral Line Half-Width (Δλ): 17 nm (typical). This indicates the spectral purity, measuring the width of the emission spectrum at half its maximum power. A smaller value indicates a more monochromatic light source.
• Forward Voltage (V_F): 1.8 - 2.4 V. This is the voltage drop across the LED when driven at the test current of 20mA. It varies with current and temperature.
• Reverse Current (I_R): 10 μA (max) at V_R=5V. This is the small leakage current that flows when the device is reverse-biased within its maximum rating.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted (binned) based on key parameters. This allows designers to select parts that meet specific requirements for brightness, color, and voltage.

3.1 Forward Voltage Binning

Units are measured at I_F = 20mA. Tolerance for each bin is ±0.1V.

• Bin D2: 1.8V (Min) to 2.0V (Max)
• Bin D3: 2.0V (Min) to 2.2V (Max)
• Bin D4: 2.2V (Min) to 2.4V (Max)

3.2 Luminous Intensity Binning

Units are mcd (millicandela) at I_F = 20mA. Tolerance on each bin is ±11%.

• Bin Q2: 90 mcd (Min) to 112 mcd (Max)
• Bin R1: 112 mcd (Min) to 140 mcd (Max)
• Bin R2: 140 mcd (Min) to 180 mcd (Max)
• Bin S1: 180 mcd (Min) to 220 mcd (Max)
• Bin S2: 220 mcd (Min) to 280 mcd (Max)

3.3 Dominant Wavelength Binning

Units are nanometers (nm) at I_F = 20mA. Tolerance for each bin is ±1 nm.

• Bin P: 600 nm (Min) to 603 nm (Max)
• Bin Q: 603 nm (Min) to 606 nm (Max)
• Bin R: 606 nm (Min) to 609 nm (Max)
• Bin S: 609 nm (Min) to 612 nm (Max)

4. Performance Curve Analysis

While specific graphical data is referenced in the source document, typical performance curves for such devices illustrate key relationships essential for design.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve is non-linear. The forward voltage (V_F) increases with current but has a temperature coefficient—V_F typically decreases as junction temperature rises. This must be considered in constant-current drive designs.

4.2 Luminous Intensity vs. Forward Current

The light output (luminous intensity) is approximately proportional to the forward current over a significant range. However, efficiency may drop at very high currents due to increased heat generation. Operating at or below the recommended 20mA ensures optimal efficiency and longevity.

4.3 Temperature Characteristics

LED performance is temperature-dependent. Luminous intensity generally decreases as the junction temperature increases. The dominant wavelength may also shift slightly with temperature, affecting perceived color, especially in precision applications.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The device conforms to the EIA standard 0603 package size. Key dimensions (in millimeters) are approximately 1.6mm in length, 0.8mm in width, and 0.6mm in height. Tolerances are typically ±0.1mm. The lens is water clear, with the orange color generated by the AlInGaP semiconductor chip inside.

5.2 Recommended PCB Land Pattern

A land pattern is provided for infrared or vapor phase reflow soldering. This pattern is designed to ensure proper solder joint formation, self-alignment during reflow, and reliable mechanical attachment. Following the recommended pad geometry is critical to prevent tombstoning or poor solder joints.

5.3 Polarity Identification

The cathode is typically marked on the device, often by a green tint on the corresponding side of the package or a small notch. The PCB silkscreen and footprint should clearly indicate polarity to prevent incorrect placement.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Parameters

The device is compatible with lead-free (Pb-free) IR reflow soldering processes. A suggested profile compliant with J-STD-020B is referenced. Key parameters include:

• Pre-heat: 150-200°C
• Pre-heat Time: Maximum 120 seconds.
• Peak Temperature: Maximum 260°C.
• Time Above Liquidus: Recommended to follow solder paste manufacturer specifications.
• Maximum Soldering Cycles: Two times.

Profiles must be characterized for the specific PCB assembly, considering board thickness, component density, and solder paste type.

6.2 Hand Soldering (If Necessary)

If hand soldering is required, extreme care must be taken:

• Iron Temperature: Maximum 300°C.
• Soldering Time: Maximum 3 seconds per pad.
• Limit: One soldering cycle only. Excessive heat can damage the internal die or plastic package.

6.3 Storage Conditions

LEDs are moisture-sensitive devices (MSD).

• Sealed Bag: Store at ≤30°C and ≤70% Relative Humidity (RH). Use within one year of bag seal date.
• Opened Bag/Exposed: Store at ≤30°C and ≤60% RH. It is strongly recommended to complete IR reflow within 168 hours (7 days) of exposure to ambient air.
• Extended Exposure: If exposed for more than 168 hours, a bake-out at approximately 60°C for at least 48 hours is required before soldering to remove absorbed moisture and prevent "popcorning" during reflow.

6.4 Cleaning

If post-solder cleaning is necessary, use only approved alcohol-based solvents such as isopropyl alcohol (IPA) or ethyl alcohol. Immersion should be at normal temperature and for less than one minute. Harsh or unspecified chemicals can damage the package material or lens.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The device is supplied packaged in 8mm wide embossed carrier tape on 7-inch (178mm) diameter reels. This packaging is compatible with standard automated SMD assembly equipment.

• Quantity per Reel: 4000 pieces.
• Minimum Order Quantity (MOQ) for Remainders: 500 pieces.
• Cover Tape: Empty component pockets are sealed with a top cover tape.
• Missing Components: A maximum of two consecutive missing components is allowed per specification.

The packaging conforms to ANSI/EIA-481 specifications.

8. Application Recommendations

8.1 Typical Application Circuits

An LED is a current-driven device. For reliable operation and consistent brightness, especially when multiple LEDs are used, a current-limiting resistor must be used in series with each LED or each parallel string of LEDs. Driving LEDs directly from a voltage source without current control is not recommended and will lead to inconsistent performance and potential device failure. The series resistor value is calculated using Ohm's Law: R = (V_supply - V_F) / I_F, where V_F is the forward voltage of the LED at the desired current I_F.

8.2 Design Considerations

• Thermal Management: Although power dissipation is low, ensuring adequate PCB copper area or thermal relief can help maintain lower junction temperatures, preserving light output and lifespan.
• Current Derating: For operation at high ambient temperatures (approaching +85°C), consider derating the forward current to reduce internal heating.
• ESD Protection: While not explicitly stated as highly sensitive, standard ESD handling precautions should be observed during assembly and handling.

9. Technical Comparison and Differentiation

Compared to older technologies like Gallium Phosphide (GaP), AlInGaP LEDs offer significantly higher luminous efficiency and brightness for orange and red colors. The 0603 package represents a balance between miniaturization and ease of handling/manufacturing. Smaller packages (e.g., 0402) exist but may be more challenging for some assembly lines and have slightly different thermal characteristics. The wide 110-degree viewing angle is suitable for applications requiring broad visibility, as opposed to narrow-angle LEDs used for focused illumination.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Can I drive this LED at 30mA continuously?

Yes, 30mA is the maximum rated continuous DC forward current. However, for optimal longevity and to account for potential thermal rise in the application, designing for a lower current such as 20mA is common practice and provides a safety margin.

10.2 Why is there such a wide range in luminous intensity (90-280 mcd)?

This range represents the total spread across all production. Devices are sorted into specific intensity bins (Q2, R1, R2, S1, S2). Designers can specify a required bin code to ensure brightness consistency in their product. If a specific brightness is critical, the S1 or S2 bins should be specified.

10.3 What happens if I solder this LED more than two times?

Exceeding the maximum recommended soldering cycles (two for reflow, one for hand soldering) exposes the device to cumulative thermal stress. This can degrade the internal wire bonds, damage the semiconductor die, or cause delamination of the plastic package, leading to premature failure or reduced reliability.

10.4 Is baking always necessary if the bag has been open for a week?

Yes. The 168-hour (7-day) floor life is a critical guideline for moisture-sensitive devices. If the components have been exposed to ambient conditions beyond this period without proper dry storage (e.g., in a desiccator), the mandatory bake-out (60°C for 48 hours) is required to drive out absorbed moisture and prevent vapor pressure damage during the high-temperature reflow soldering process.

11. Practical Application Case Study

Scenario: Designing a status indicator panel for a network router with five identical orange LED indicators.

Design Steps:

1. Parameter Selection: Choose bin codes for consistency. For example, specify Dominant Wavelength Bin R (606-609nm) and Luminous Intensity Bin S1 (180-220 mcd) to ensure uniform color and brightness.
2. Circuit Design: The router's internal logic supply is 3.3V. Using the typical V_F of 2.1V (from Bin D3) and a target I_F of 20mA, calculate the series resistor: R = (3.3V - 2.1V) / 0.020A = 60 Ohms. A standard 62-ohm resistor would be used.
3. PCB Layout: Use the recommended land pattern. Place the five LEDs with consistent orientation. Include clear polarity markings on the silkscreen.
4. Assembly: Ensure the LEDs are used within 168 hours of opening the moisture barrier bag or are properly baked. Follow the recommended IR reflow profile.
5. Result: Five indicators with visually matched color and brightness, providing clear status information to the end-user.

12. Operating Principle Introduction

Light Emitting Diodes are semiconductor p-n junction devices. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the junction region (the active layer). When these charge carriers (electrons and holes) recombine, energy is released. In an LED, this energy is released in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material used in the active layer. For this orange LED, the material is Aluminum Indium Gallium Phosphide (AlInGaP), which has a bandgap corresponding to light in the orange/red part of the visible spectrum. The clear epoxy lens serves to protect the semiconductor chip and shape the light output beam.

13. Technology Trends

The general trend in indicator LEDs continues toward higher efficiency (more light output per unit of electrical power), which allows for the same brightness at lower drive currents, reducing system power consumption and heat generation. Package miniaturization is also ongoing, with 0402 and even 0201 packages becoming more common for extremely space-constrained designs. Furthermore, there is a focus on improving color consistency and broadening the range of available saturated colors through advances in semiconductor materials and phosphor technology. The drive for automation and reliability in manufacturing reinforces the importance of components that are fully compatible with standard pick-and-place and reflow soldering processes, as exemplified by this device.