SMD LED RGB White Diffused 5630 Package - Dimensions 5.6x3.0x1.9mm - Voltage 1.8-3.8V - Power 0.13W - English Technical Document

1. Product Overview

This document details the specifications for a surface-mount device (SMD) LED in a 5630 package format, featuring a white diffused lens. The device integrates three individual light-emitting chips within a single package: one Red (AlInGaP), one Green (InGaN), and one Blue (InGaN). This configuration allows for the creation of various colors through individual or combined control of the chips. The primary design goal is to provide a compact, reliable, and efficient lighting solution suitable for automated assembly processes.

1.1 Core Advantages

• Miniaturized Design: The small form factor is ideal for space-constrained applications on printed circuit boards (PCBs).
• Automation Compatibility: The package is designed for compatibility with automatic pick-and-place equipment and infrared (IR) reflow soldering processes, facilitating high-volume manufacturing.
• Versatile Color Output: The integrated RGB chips enable a broad spectrum of colors, making it suitable for status indication, backlighting, and decorative lighting.
• Environmental Compliance: The product meets RoHS (Restriction of Hazardous Substances) directives.
• Standardized Packaging: Supplied on 12mm tape wound on 7-inch diameter reels, conforming to EIA standards for efficient handling and storage.

1.2 Target Applications

This LED is designed for a wide range of electronic equipment where reliable, compact indicator lighting is required. Typical application areas include:

• Consumer Electronics: Status indicators in cordless phones, cellular phones, notebook computers, and home appliances.
• Professional & Industrial Equipment: Front panel indicators in network systems, office automation devices, and industrial control panels.
• Display & Signage: Signal and symbol luminary applications, as well as front panel backlighting where a diffused, uniform light output is desired.

2. Technical Parameters: In-Depth Objective Interpretation

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Power Dissipation (Pd): Red: 130 mW; Green/Blue: 114 mW. This parameter indicates the maximum power the LED can dissipate as heat. Exceeding this limit risks thermal damage.
• Peak Forward Current (I_FP): 100 mA for all colors under pulsed conditions (1/10 duty cycle, 0.1ms pulse width). This is useful for brief, high-intensity flashes but not for continuous operation.
• DC Forward Current (I_F): Red: 50 mA; Green/Blue: 30 mA. This is the recommended maximum continuous forward current for reliable long-term operation.
• Temperature Ranges: Operating: -40°C to +85°C; Storage: -40°C to +100°C. These define the environmental limits for device functionality and non-operational storage.

2.2 Electrical & Optical Characteristics

Measured at a standard test condition of Ta=25°C and I_F=20mA, unless otherwise noted.

• Luminous Intensity (I_v): A key measure of perceived light output. Minimum/Typical/Maximum values: Red: 560/-/1120 mcd; Green: 1400/-/2800 mcd; Blue: 280/-/560 mcd. The green chip exhibits the highest typical output.
• Viewing Angle (2θ_1/2): Typically 120 degrees. This wide angle, facilitated by the diffused lens, provides a broad, even illumination rather than a narrow beam, ideal for indicator applications.
• Forward Voltage (V_F): The voltage drop across the LED when conducting. Ranges: Red: 1.8V to 2.6V; Green/Blue: 2.8V to 3.8V. The lower V_F of the red chip is characteristic of AlInGaP technology compared to InGaN (green/blue). Designers must account for these differences in driver circuit design.
• Peak Wavelength (λ_P) & Dominant Wavelength (λ_d): λ_P is the spectral peak: Red ~630nm, Green ~518nm, Blue ~468nm. λ_d is the single wavelength perceived by the human eye, with specified bins for green (520-530nm) and blue (465-475nm).
• Reverse Current (I_R): Maximum 10 μA at V_R=5V. The device is not designed for reverse bias operation; this parameter is for test purposes only. Circuit protection (e.g., a series resistor or diode) is recommended if reverse voltage is possible.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into performance bins. This device uses a two-dimensional binning system based on luminous intensity and dominant wavelength.

3.1 Luminous Intensity Binning

Each color chip is binned separately based on its light output at 20mA.

• Red: Bins U2 (560-710 mcd), V1 (710-900 mcd), V2 (900-1120 mcd).
• Green: Bins W2 (1400-1800 mcd), X1 (1800-2240 mcd), X2 (2240-2800 mcd).
• Blue: Bins T1 (280-355 mcd), T2 (355-450 mcd), U1 (450-560 mcd).
• Tolerance within each intensity bin is +/-11%.

3.2 Dominant Wavelength Binning

Applied to the Green and Blue chips to control hue.

• Green: Bins AP (520-525 nm), AQ (525-530 nm).
• Blue: Bins AC (465-470 nm), AD (470-475 nm).
• Tolerance within each wavelength bin is +/-1 nm.

3.3 Combined Bin Code (On-Tag Code)

A single alphanumeric code (e.g., A1, B4, D2) printed on the product reel tag combines the intensity bins for all three colors and the wavelength bins for green/blue. This cross-reference table allows designers to specify and procure LEDs with tightly controlled optical characteristics, ensuring visual consistency in their end products. For example, code 'A1' specifies Red in bin U2, Green in bin W2, and Blue in bin T1.

4. Mechanical & Packaging Information

4.1 Package Dimensions

The device conforms to a standard 5630 footprint. Key dimensions (in millimeters, tolerance ±0.2mm unless noted) include a body length of approximately 5.6mm, width of 3.0mm, and height of 1.9mm. A detailed dimensional drawing specifies pad locations, lens shape, and polarity markings.

4.2 Pin Assignment & Polarity

The 6-pad configuration allows independent access to each chip: Pins 1 & 6: Blue; Pins 2 & 5: Green; Pins 3 & 4: Red. The cathode for each chip is typically indicated in the footprint diagram. Correct polarity must be observed during PCB layout and assembly.

4.3 Recommended PCB Attachment Pad

A suggested land pattern (footprint) is provided to ensure proper solder joint formation, mechanical stability, and heat dissipation during reflow soldering. Adhering to this pattern is critical for assembly yield and long-term reliability.

4.4 Tape and Reel Packaging

The LEDs are supplied in embossed carrier tape (12mm width) sealed with a cover tape. The tape is wound on a standard 7-inch (178mm) diameter reel. Each reel contains 1000 pieces. Packaging conforms to EIA-481-1-B specifications, ensuring compatibility with automated assembly equipment.

5. Soldering & Assembly Guidelines

5.1 IR Reflow Soldering Profile

A recommended reflow profile for lead-free (Pb-free) solder processes is provided, conforming to J-STD-020B. This profile details the critical parameters: preheat, soak, reflow peak temperature (which must not exceed the LED's maximum temperature rating), and cooling rates. Following this profile is essential to prevent thermal shock and damage to the LED package or epoxy lens.

5.2 Cleaning

If post-assembly cleaning is necessary, only specified solvents should be used. The datasheet recommends immersion in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute. The use of unspecified or aggressive chemicals can damage the lens material or package markings.

5.3 Storage Conditions

Sealed Package: LEDs in their original moisture-proof bag with desiccant should be stored at ≤30°C and ≤70% Relative Humidity (RH). The recommended shelf life under these conditions is one year.
Opened Package: Once the moisture barrier bag is opened, components should be used promptly. If storage is needed, conditions should not exceed 30°C and 60% RH. Exposure to higher humidity can lead to moisture absorption, which may cause \"popcorning\" (package cracking) during reflow soldering.

6. Application Suggestions & Design Considerations

6.1 Driver Circuit Design

Due to the differing forward voltages (V_F) of the red, green, and blue chips, a simple parallel connection to a common voltage source is not recommended, as it would lead to uneven current distribution and brightness. The preferred method is to drive each color channel independently with a current-limiting resistor or, for better consistency and dimming control, a constant-current driver or PWM (Pulse Width Modulation) circuit.

6.2 Thermal Management

While the power dissipation is relatively low, proper thermal design on the PCB is still important for longevity. Ensuring adequate copper area connected to the thermal pads (if any) or the device's mounting pads helps dissipate heat, maintaining lower junction temperatures and preserving luminous output and lifespan.

6.3 Optical Integration

The white diffused lens provides a Lambertian emission pattern (wide viewing angle). For applications requiring more directed light, secondary optics (such as light guides or external lenses) may be necessary. The diffused nature helps minimize hotspots and provides a uniform appearance when viewed directly.

7. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive all three colors (RGB) in parallel from a single 3.3V supply?
A: Not effectively. The forward voltage of the blue and green chips (min 2.8V) is close to 3.3V, leaving very little voltage drop for a current-limiting resistor, making current control imprecise and sensitive to supply variations. The red chip (V_F ~2.2V) would receive disproportionately high current. Independent current control per channel is strongly advised.

Q: What is the difference between Peak Wavelength and Dominant Wavelength?
A: Peak Wavelength (λ_P) is the literal highest point in the LED's spectral power distribution. Dominant Wavelength (λ_d) is a calculated value that represents the single wavelength of a pure monochromatic light that would appear to have the same color (hue) as the LED to a standard human observer. λ_d is more relevant for color specification.

Q: The maximum DC current is 30mA for green/blue, but the peak pulsed current is 100mA. Can I use PWM at 100mA?
A: Yes, but with strict limitations. The 100mA rating applies only under very specific conditions: a 0.1ms pulse width and a 10% duty cycle (i.e., the LED is on for 0.1ms, then off for 0.9ms). The average current must not exceed the DC rating. For example, a 100mA pulse at a 10% duty cycle results in an average current of 10mA, which is safe. Exceeding the pulse width or duty cycle specifications can cause overheating.

Q: How do I interpret the Bin Code on the reel label?
A> The alphanumeric code (e.g., C5, D1) is a cross-reference to the tables in sections 4.1 and 4.2 of the datasheet. You look up this code to find the specific luminous intensity range for Red, Green, and Blue, as well as the dominant wavelength range for Green and Blue. This ensures you know the exact performance characteristics of the LEDs on that reel.

8. Practical Design and Usage Case

Scenario: Designing a Multi-Color Status Indicator for a Network Router.
The device requires LEDs to indicate power (steady green), network activity (flashing green), and error states (red or blue). A single RGB LED like the LTST-G563EGBW can fulfill all these roles, saving PCB space compared to using three discrete LEDs.

Implementation:
1. The microcontroller's GPIO pins are connected to three separate driver transistors (or a dedicated LED driver IC), each controlling one color channel of the RGB LED.
2. For \"Power On,\" the green channel is driven at 10-15mA (well below its 30mA max) for a clear, bright indication.
3. For \"Network Activity,\" the same green channel is toggled via PWM at a high frequency to create a blinking effect, with the average current still within limits.
4. For an \"Error\" state, the red channel can be illuminated. A more specific \"Critical Error\" could use the blue channel or a combination (e.g., red+blue = magenta).
5. The wide 120-degree viewing angle of the diffused lens ensures the status is visible from various angles around the router.
6. By specifying a tight binning code (e.g., requiring Green in bin X1 and a specific wavelength bin), the designer ensures consistent color and brightness across all manufactured router units.

9. Technology Introduction

This LED utilizes two primary semiconductor material technologies:
Aluminum Indium Gallium Phosphide (AlInGaP): Used for the red-emitting chip. This material system is efficient for producing light in the red to amber part of the spectrum and typically exhibits a lower forward voltage than InGaN-based LEDs.
Indium Gallium Nitride (InGaN): Used for the green and blue-emitting chips. By varying the indium/gallium ratio in the crystal structure, the bandgap—and thus the emitted wavelength—can be tuned. Achieving high-efficiency green light with InGaN has historically been more challenging than blue, which is reflected in the different performance parameters (e.g., forward voltage, efficiency) between the green and blue chips, despite using the same base material.

The white diffused lens is typically made of epoxy or silicone resin doped with scattering particles. This diffusion material randomizes the direction of light emitted from the small chip, transforming it from a narrow, directional beam into a wide, Lambertian emission pattern, making the entire lens surface appear uniformly bright.

10. Development Trends

The field of SMD LEDs continues to evolve along several key trajectories relevant to components like this one:
Increased Efficiency (Lumens per Watt): Ongoing improvements in epitaxial growth, chip design, and light extraction techniques steadily increase the luminous output for a given input current, allowing for brighter indicators or lower power consumption.
Color Consistency & Binning: Advances in manufacturing process control are reducing the natural variation in LED characteristics. This allows for tighter binning specifications or even \"bin-free\" offerings, simplifying inventory management for manufacturers and ensuring superior color uniformity in end products.
Miniaturization & Integration: The drive for smaller electronic devices pushes for LEDs in even more compact packages. Furthermore, integration is increasing, with more complex multi-chip packages (e.g., RGBW, addressable LEDs with integrated drivers) becoming common to simplify circuit design.
High-Reliability Materials: Development of more robust lens materials (like high-temperature silicones) and package structures improves resistance to thermal cycling, humidity, and harsh environments, expanding the possible application spaces.