SMD LED 19-217/T1D-CQ2R2TY/3T Datasheet - Size 3.2x1.6x1.1mm - Voltage 2.6-3.0V - Color Pure White - English Technical Document

1. Product Overview

The 19-217/T1D-CQ2R2TY/3T is a surface-mount device (SMD) LED utilizing InGaN technology to emit pure white light. Housed in a compact 1206 package (approximately 3.2mm x 1.6mm x 1.1mm), this component is designed for high-density PCB applications where space and weight are critical constraints. Its yellow diffused resin lens provides a wide, uniform viewing angle. The product is fully compliant with modern environmental regulations, being Pb-free, RoHS compliant, REACH compliant, and halogen-free (Br <900 ppm, Cl <900 ppm, Br+Cl <1500 ppm). It is supplied on 8mm tape mounted on 7-inch reels, making it compatible with automated pick-and-place assembly lines and standard infrared or vapor phase reflow soldering processes.

2. Technical Specifications Deep Dive

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Continuous Forward Current (I_F): 10 mA. The maximum DC current for reliable operation.
• Peak Forward Current (I_FP): 40 mA. This is permissible only under pulsed conditions with a duty cycle of 1/10 at 1 kHz.
• Power Dissipation (P_d): 40 mW. The maximum power the package can dissipate at Ta=25°C.
• Electrostatic Discharge (ESD) Human Body Model (HBM): 150 V. Indicates moderate sensitivity to static electricity; proper ESD handling precautions are necessary.
• Operating Temperature (T_opr): -40°C to +85°C. The ambient temperature range for normal device function.
• Storage Temperature (T_stg): -40°C to +90°C.
• Soldering Temperature (T_sol): Reflow soldering peak temperature should not exceed 260°C for 10 seconds. Hand soldering iron tip temperature should not exceed 350°C for 3 seconds.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of Ta=25°C and I_F=5mA, unless otherwise specified.

• Luminous Intensity (I_v): Ranges from a minimum of 90.0 mcd to a maximum of 180.0 mcd. The typical value falls within this range, which is further divided into specific bins (Q2, R1, R2).
• Viewing Angle (2θ_1/2): 130 degrees (typical). This wide angle ensures good visibility from various perspectives.
• Forward Voltage (V_F): Ranges from 2.60 V to 3.00 V at I_F=5mA. This parameter is also binned (codes 28-31). A lower V_F generally leads to higher efficiency.
• Reverse Current (I_R): Maximum of 50 μA when a reverse voltage of 5V is applied. This test is for characterization only; the LED is not designed for reverse operation.

3. Binning System Explanation

To ensure consistency in production runs, LEDs are sorted into bins based on key performance parameters.

3.1 Luminous Intensity Binning

Devices are categorized into three bins (Q2, R1, R2) based on their measured luminous intensity at I_F=5mA. This allows designers to select the appropriate brightness grade for their application, ensuring visual consistency in panels with multiple LEDs.

• Bin Q2: 90.0 mcd (Min) to 112.0 mcd (Max)
• Bin R1: 112.0 mcd (Min) to 140.0 mcd (Max)
• Bin R2: 140.0 mcd (Min) to 180.0 mcd (Max)

3.2 Forward Voltage Binning

LEDs are also binned by forward voltage drop into four groups (28, 29, 30, 31). Matching V_F bins in a series string helps achieve uniform current distribution and brightness.

• Bin 28: 2.60 V (Min) to 2.70 V (Max)
• Bin 29: 2.70 V (Min) to 2.80 V (Max)
• Bin 30: 2.80 V (Min) to 2.90 V (Max)
• Bin 31: 2.90 V (Min) to 3.00 V (Max)

3.3 Chromaticity Coordinate Binning

The pure white color is defined within specific regions on the CIE 1931 chromaticity diagram, with a tolerance of ±0.01. The datasheet defines four chromaticity bins (C1, C2, C3, C4), each specifying a quadrilateral area of acceptable x, y coordinates. This tight control ensures minimal color variation between individual LEDs.

4. Performance Curve Analysis

The provided graphs offer insights into the LED's behavior under varying conditions.

• Forward Current vs. Relative Luminous Intensity: Shows that light output increases with current but may saturate or degrade at very high currents beyond the rated maximum.
• Forward Current vs. Forward Voltage (I-V Curve): Demonstrates the exponential relationship, crucial for designing current-limiting circuits.
• Relative Luminous Intensity vs. Ambient Temperature: Illustrates how light output decreases as the junction temperature rises. Effective thermal management is key to maintaining brightness.
• Forward Current Derating Curve: Specifies the maximum allowable forward current as a function of ambient temperature to prevent overheating.
• Radiation Diagram: A polar plot visualizing the spatial distribution of light intensity, confirming the 130-degree viewing angle.
• Spectrum Distribution: A graph plotting relative intensity against wavelength, showing the peak wavelength and spectral width of the emitted white light.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED follows a standard 1206 SMD footprint. Key dimensions (in mm, tolerance ±0.1mm unless noted) include a body length of 3.2, width of 1.6, and height of 1.1. The anode and cathode terminals are clearly marked on the package. The recommended PCB land pattern (pad design) is provided to ensure proper soldering and mechanical stability.

5.2 Polarity Identification

The cathode side of the LED is typically marked, often with a green tint or a notch in the package. Correct polarity must be observed during assembly to ensure proper function.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A lead-free reflow profile is recommended: Preheat between 150-200°C for 60-120 seconds, followed by a ramp-up. The time above liquidus (217°C) should be 60-150 seconds, with a peak temperature not exceeding 260°C for a maximum of 10 seconds. The maximum ramp-up rate is 3°C/sec, and the maximum cooling rate is 6°C/sec. Reflow should not be performed more than twice.

6.2 Storage and Handling

The LEDs are packaged in a moisture-sensitive barrier bag with desiccant. The bag must not be opened until the components are ready for use. After opening, unused parts should be stored at ≤30°C and ≤60% RH and used within 168 hours (7 days). If this time is exceeded or the desiccant indicator changes color, a baking treatment at 60±5°C for 24 hours is required before use.

6.3 Circuit Design Note

Critical: An external current-limiting resistor must always be used in series with the LED. The forward voltage has a negative temperature coefficient, meaning a small increase in voltage can cause a large, potentially destructive increase in current if not properly limited by a resistor.

7. Packaging and Ordering Information

The product is supplied in moisture-resistant packaging. Components are placed in embossed carrier tape with dimensions specified for a standard 8mm width. The tape is wound onto a 7-inch diameter reel, with 3000 pieces per reel. The reel and bag labels contain key information: Customer Part Number (CPN), Product Number (P/N), Quantity (QTY), Luminous Intensity Rank (CAT), Chromaticity Rank (HUE), Forward Voltage Rank (REF), and Lot Number (LOT No).

8. Application Suggestions

8.1 Typical Application Scenarios

• Backlighting: Ideal for dashboard indicators, switch illumination, and symbol backlighting due to its wide viewing angle and uniform light.
• Telecommunication Equipment: Status indicators and keypad backlighting in devices like telephones and fax machines.
• LCD Flat Backlighting: Can be used in arrays to provide edge-lit backlighting for small LCD panels.
• General Purpose Indication: Any application requiring a compact, reliable, and bright white status indicator.

8.2 Design Considerations

• Current Drive: Always operate at or below the recommended 10mA continuous current. Use a series resistor calculated based on the supply voltage and the LED's forward voltage (using the maximum V_F from the bin for a conservative design).
• Thermal Management: While the package is small, ensure adequate PCB copper area or thermal vias if operating at high ambient temperatures or high duty cycles to manage junction temperature and maintain luminous output and longevity.
• ESD Protection Implement basic ESD protection on input lines if the LED is in a user-accessible area, given its 150V HBM rating.

9. Technical Comparison and Differentiation

Compared to larger lead-frame type LEDs, the 19-217 SMD LED offers significant advantages: a much smaller footprint enabling higher packing density and miniaturization, reduced weight, and compatibility with fully automated assembly processes which lowers manufacturing cost. Its specific combination of pure white color (via InGaN), well-defined binning structure, and compliance with the latest environmental standards (Halogen-Free, REACH) makes it a suitable choice for modern, eco-conscious electronic designs requiring consistent visual performance.

10. Frequently Asked Questions (FAQ)

10.1 Why is a current-limiting resistor mandatory?

LEDs are current-driven devices. Their I-V characteristic is very steep; a small change in forward voltage causes a large change in current. Without a series resistor to set the current, thermal runaway can occur, leading to immediate failure or reduced lifespan.

10.2 Can I use this LED for continuous illumination?

Yes, it is designed for continuous operation at up to 10mA. Ensure the ambient temperature and PCB layout allow for proper heat dissipation to maintain brightness over time.

10.3 What do the bin codes (e.g., /CQ2R2TY) in the part number mean?

These codes specify the guaranteed performance bins for that specific order. They define the luminous intensity range (e.g., R2), forward voltage range, and chromaticity coordinates, ensuring you receive LEDs with tightly grouped characteristics.

10.4 How do I interpret the CIE chromaticity diagram in the datasheet?

The diagram shows the gamut of human color perception. The small quadrilateral boxes drawn on it represent the acceptable color variation (bins C1-C4) for this "pure white" LED. All produced units will fall within one of these defined regions.

11. Practical Design Case Study

Scenario: Designing a control panel with 10 white LED status indicators powered from a 5V rail.
Step 1 - Current Selection: Choose a drive current of 5mA (the test condition) for good brightness and longevity.
Step 2 - Resistor Calculation: Using the maximum V_F from Bin 31 (3.00V) for a conservative design: R = (V_supply - V_F) / I_F = (5V - 3.0V) / 0.005A = 400 Ω. A standard 390 Ω or 430 Ω resistor would be suitable.
Step 3 - Power Rating: Resistor power dissipation: P = I² * R = (0.005)² * 400 = 0.01W. A standard 1/10W (0.1W) resistor is more than adequate.
Step 4 - Layout: Place LEDs with consistent orientation. If space allows, add small thermal relief pads connected to a ground plane to help with heat dissipation.

12. Operating Principle

This LED is based on InGaN (Indium Gallium Nitride) semiconductor technology. When a forward voltage exceeding the diode's threshold is applied, electrons and holes recombine in the active region of the semiconductor chip, releasing energy in the form of photons (light). The specific composition of the InGaN layers is engineered to produce photons that, when combined with the light conversion from the yellow phosphor inside the package (excited by the blue LED chip), result in the perception of "pure white" light. The wide viewing angle is achieved through the diffused yellow resin lens which scatters the light.

13. Technology Trends

The market for SMD LEDs like the 1206 package continues to evolve towards higher efficiency (more lumens per watt), improved color rendering index (CRI) for white LEDs, and even smaller package sizes (e.g., 0805, 0603) to enable further miniaturization. There is also a strong industry drive towards higher reliability and longer operational lifetimes under a wider range of environmental conditions. The integration of onboard current regulation or protection features within the LED package itself is an emerging trend for simplified driver design.