SMD LED Yellow AlInGaP 1206 Package Datasheet - Dimensions 1.6x0.8x0.6mm - Voltage 1.8-2.6V - Power 120mW - English Technical Document

1. Product Overview

This document details the specifications for a surface-mount device (SMD) Light Emitting Diode (LED) utilizing an Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material to produce yellow light. The device is housed in a compact, industry-standard 1206 package format, making it suitable for automated assembly processes and space-constrained applications. Its primary function is to provide a reliable and efficient indicator light source.

1.1 Features and Core Advantages

The LED offers several key advantages for modern electronics manufacturing. It is compliant with environmental regulations, packaged for high-volume automated pick-and-place equipment on 8mm tape within 7-inch reels, and designed to be compatible with standard infrared reflow soldering processes. Its small footprint and compatibility with automated assembly significantly reduce production time and cost.

1.2 Target Market and Applications

This component is designed for a broad range of electronic equipment. Typical applications include telecommunications devices such as cordless and cellular phones, portable computing devices like notebooks, network system equipment, various home appliances, and signage applications including indoor displays, semi-outdoor displays, and bus information systems.

2. Technical Parameters and Characteristics

This section provides the absolute limits and standard operating conditions for the device. Adherence to these parameters is critical for ensuring long-term reliability and performance.

2.1 Absolute Maximum Ratings

The device must not be operated beyond these limits, as permanent damage may occur. Key ratings include a maximum power dissipation of 120 mW, a continuous DC forward current of 50 mA, and a peak forward current of 80 mA under pulsed conditions (1/10 duty cycle, 0.1ms pulse width). The maximum reverse voltage is 5 V. The operational and storage temperature range is specified from -40°C to +100°C.

2.2 Electro-Optical Characteristics

These parameters are measured under standard test conditions at an ambient temperature (Ta) of 25°C and a forward current (IF) of 20 mA, unless otherwise noted.

• Luminous Intensity (Iv): Ranges from a minimum of 450 mcd to a maximum of 1120 mcd, with typical values depending on the specific bin.
• Viewing Angle (2θ1/2): A wide viewing angle of 120 degrees, defined as the off-axis angle where intensity is half the axial value.
• Forward Voltage (Vf): Between 1.8 V and 2.6 V at 20mA.
• Peak Wavelength (λp): Typically 591 nm.
• Dominant Wavelength (λd): Ranges from 584.5 nm to 594.5 nm, defining the perceived color.
• Spectral Half-Width (Δλ): Approximately 15 nm, indicating the spectral purity of the yellow emission.
• Reverse Current (Ir): Maximum of 10 μA at a reverse voltage of 5V.

3. Bin Ranking System

To ensure consistency in production runs, LEDs are sorted into bins based on key performance parameters. This allows designers to select components that meet specific circuit requirements for voltage drop, brightness, and color.

3.1 Forward Voltage (Vf) Rank

LEDs are categorized into bins (D2 to D5) based on their forward voltage at 20mA, with each bin having a range of 0.2V (e.g., D2: 1.8-2.0V, D3: 2.0-2.2V). A tolerance of ±0.1V applies to each bin.

3.2 Luminous Intensity (Iv) Rank

Brightness is sorted into bins U1, U2, V1, and V2. The intensity ranges from 450-560 mcd (U1) up to 900-1120 mcd (V2). A tolerance of ±11% applies to each intensity bin.

3.3 Dominant Wavelength (Wd) Rank

The color, defined by dominant wavelength, is binned from H to L. The range spans from 584.5-587.0 nm (Bin H) to 592.0-594.5 nm (Bin L). A tolerance of ±1 nm is maintained for each wavelength bin.

4. Mechanical and Package Information

4.1 Package Dimensions

The device conforms to the EIA standard 1206 package size. Key dimensions include a length of 1.6 mm, a width of 0.8 mm, and a height of 0.6 mm. All dimensional tolerances are ±0.2 mm unless otherwise specified. The lens is water clear, and the light source color is AlInGaP Yellow.

4.2 Recommended PCB Attachment Pad Layout

A land pattern design is recommended for reliable soldering using infrared or vapor phase reflow processes. This pattern ensures proper solder fillet formation and mechanical stability of the component on the printed circuit board (PCB).

5. Assembly, Handling, and Application Guidelines

5.1 Soldering Process

The LED is compatible with infrared reflow soldering processes, including lead-free profiles. A suggested reflow profile is provided, aligned with J-STD-020B standards. Key parameters include a pre-heat temperature of 150-200°C, a peak temperature not exceeding 260°C, and a time above liquidus tailored to the specific solder paste and board design. For manual soldering, a soldering iron temperature below 300°C for a maximum of 3 seconds is advised.

5.2 Cleaning

If cleaning is necessary after soldering, only specified solvents should be used. Immersing the LED in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute is acceptable. Unspecified chemicals may damage the package.

5.3 Storage Conditions

For unopened moisture-proof bags containing desiccant, storage should be at 30°C or less and 70% relative humidity (RH) or less, with a recommended use-within period of one year. Once the original packaging is opened, the storage environment should not exceed 30°C and 60% RH. Components exposed beyond 168 hours should be baked at approximately 60°C for at least 48 hours before soldering to prevent moisture-induced damage during reflow ("popcorning").

5.4 Drive Method and Design Considerations

LEDs are current-operated devices. To ensure consistent brightness across multiple units, they must be driven by a constant current source or with appropriate current-limiting resistors in a series configuration. Driving via a constant voltage source without current regulation is not recommended, as it can lead to excessive current, thermal runaway, and reduced lifespan. The forward voltage variation between bins must be accounted for in the circuit design to maintain the desired current.

5.5 Application Cautions

These LEDs are intended for standard commercial and industrial electronic equipment. For applications requiring exceptional reliability where failure could jeopardize safety (e.g., aviation, medical life-support, transportation safety systems), specific consultation and qualification are necessary prior to use.

6. Packaging and Ordering Information

6.1 Tape and Reel Specifications

The components are supplied on 8mm wide embossed carrier tape sealed with a cover tape, wound onto 7-inch (178 mm) diameter reels. Standard reel quantity is 2000 pieces. A minimum packing quantity of 500 pieces is available for remainder orders. Packaging conforms to ANSI/EIA-481 specifications.

7. Performance Analysis and Design Context

7.1 Understanding the Electro-Optical Curves

Typical performance curves, such as the relationship between forward current and luminous intensity or forward voltage, are essential for circuit design. The IV curve shows a non-linear relationship, emphasizing the need for current control. The intensity vs. current curve is generally linear within the operating range but will saturate at higher currents due to thermal effects.

7.2 Thermal Management Considerations

While the device has a specified operating temperature up to 100°C, its performance degrades with increasing junction temperature. Luminous intensity typically decreases as temperature rises. Adequate PCB layout for heat dissipation, possibly using thermal vias or copper pours, is recommended for applications operating at high ambient temperatures or high drive currents to maintain brightness and longevity.

7.3 Color Point and Wavelength Stability

The dominant wavelength can shift slightly with changes in drive current and junction temperature. The binning system helps manage this by providing a controlled range. For color-critical applications, understanding the relationship between drive conditions and chromaticity shift is important.

8. Comparison and Technology Context

8.1 AlInGaP Technology

Aluminum Indium Gallium Phosphide (AlInGaP) is a semiconductor material system particularly efficient at producing light in the yellow, orange, and red regions of the spectrum. Compared to older technologies, it offers higher luminous efficiency, better temperature stability, and longer operational life, making it the standard for high-performance yellow LEDs.

8.2 1206 Package Advantages

The 1206 (1.6mm x 0.8mm) package offers a good balance between size and ease of handling/manufacturing. It is larger than ultra-miniature packages like 0402, making it more robust for assembly and often easier to inspect, while still being compact enough for most modern portable devices.

9. Frequently Asked Questions (FAQ)

9.1 What is the difference between peak wavelength and dominant wavelength?

Peak wavelength (λp) is the wavelength at which the spectral power distribution is maximum. Dominant wavelength (λd) is derived from the CIE chromaticity diagram and represents the single wavelength of the spectrum that matches the perceived color of the LED. For a monochromatic source, they are similar; for LEDs with some spectral width, λd is the more relevant parameter for color specification.

9.2 Can I drive this LED directly from a 3.3V or 5V logic supply?

Not without a current-limiting resistor. The forward voltage ranges from 1.8V to 2.6V. Connecting it directly to a 3.3V supply would force a current determined by the dynamic resistance of the LED, which would likely exceed the maximum rating and destroy the device. A series resistor must be calculated based on the supply voltage, the LED's forward voltage (using the maximum bin value for a safe design), and the desired operating current.

9.3 Why is baking required if the package is opened for more than 168 hours?

SMD packages can absorb moisture from the atmosphere. During the high-temperature reflow soldering process, this trapped moisture can vaporize rapidly, creating internal pressure that may crack the package or delaminate internal interfaces—a phenomenon known as "popcorning." Baking removes this absorbed moisture, making the components safe for reflow.

10. Practical Application Example

Scenario: Designing a status indicator panel for a network router.

Multiple yellow LEDs are required to indicate different network activity states. To ensure uniform brightness, the designer selects LEDs from the same luminous intensity bin (e.g., V1). A constant current driver circuit is implemented to supply 20mA to each LED. The PCB layout includes the recommended pad geometry and incorporates small thermal relief connections to the ground plane for minor heat dissipation. The components are stored in a controlled environment after the reel is opened and are assembled using a lead-free reflow profile verified to stay within the specified temperature limits. This approach ensures reliable, consistent, and long-lasting indicator functionality.