SMD LED Yellow Diffused AlInGaP Datasheet - 120° Viewing Angle - 1.90-2.65V - 70mA - 185.5mW - English Technical Document

1. Product Overview

This document details the specifications for a surface-mount device (SMD) Light Emitting Diode (LED) utilizing an AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor material to produce yellow light. The LED features a diffused lens, which scatters the emitted light to create a wider, more uniform viewing pattern compared to clear-lens LEDs. This characteristic makes it suitable for applications requiring even illumination and wide-angle visibility.

The core advantages of this component include its compact SMD package designed for automated PCB assembly, compatibility with infrared reflow soldering processes, and qualification to automotive-grade reliability standards. It is engineered for space-sensitive applications across various electronic equipment segments.

1.1 Target Market & Applications

The primary target market for this LED is the automotive electronics sector, specifically for accessory applications. Its design and qualification make it suitable for integration into vehicle interior lighting, dashboard indicators, switch backlighting, and other non-critical illumination functions within the cabin. The robust packaging and specified thermal performance are aligned with the environmental demands of automotive environments.

Beyond automotive use, its general features like I.C. compatibility, automatic placement compatibility, and RoHS compliance make it a viable component for a wide variety of consumer and industrial electronics, including portable devices, network equipment indicators, and general-purpose status lighting where reliable, solid-state illumination is required.

2. In-Depth Technical Parameter Analysis

A comprehensive understanding of the electrical, optical, and thermal parameters is crucial for successful circuit design and reliable long-term operation.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

• Power Dissipation (Pd): 185.5 mW. This is the maximum amount of power the LED can dissipate as heat at an ambient temperature (Ta) of 25°C. Exceeding this limit risks overheating the semiconductor junction.
• DC Forward Current (IF): 70 mA. The maximum continuous forward current that can be applied.
• Peak Forward Current: 100 mA. This is permissible only under pulsed conditions (1/10 duty cycle, 0.1ms pulse width) to allow for brief over-current scenarios, such as during power-on transients, without causing damage.
• Operating & Storage Temperature Range: -40°C to +100°C. This wide range ensures functionality and storability in harsh environments, supporting its automotive application claim.
• Infrared Soldering Condition: Withstands 260°C for 10 seconds. This defines the reflow soldering profile tolerance, critical for lead-free (Pb-free) assembly processes.

2.2 Thermal Characteristics

Thermal management is paramount for LED performance and lifespan. Excessive junction temperature (Tj) leads to accelerated lumen depreciation and color shift.

• Junction Temperature (Tj max): 125°C. The absolute maximum temperature allowed at the semiconductor junction.
• Thermal Resistance, Junction-to-Ambient (RθJA): 280 °C/W (typical). Measured on a standard FR4 PCB with a 16mm² copper pad, this value indicates how effectively heat travels from the junction to the surrounding air. A lower value is better. This parameter is highly dependent on PCB layout and external cooling.
• Thermal Resistance, Junction-to-Solder Point (RθJS): 130 °C/W (typical). This is often a more useful metric as it defines the thermal path from the junction to the PCB pads, which is more controllable by the designer through pad size and copper pour. Efficient heat sinking via the PCB is essential to keep Tj within safe limits, especially when operating near maximum current.

2.3 Electrical & Optical Characteristics

These are the typical performance parameters measured at Ta=25°C and a forward current (IF) of 50mA, which appears to be the standard test condition.

• Luminous Intensity (Iv): 1800 - 3550 mcd (millicandela). This is a measure of the perceived brightness of the LED in a specific direction (on-axis). The wide range indicates a binning system is used (see Section 3).
• Viewing Angle (2θ½): 120 degrees (typical). This is the full angle at which the luminous intensity drops to half of its on-axis value. The diffused lens creates this wide viewing angle.
• Peak Emission Wavelength (λP): 592 nm (typical). The wavelength at which the spectral power output is highest.
• Dominant Wavelength (λd): 583 - 595 nm. This is the single wavelength perceived by the human eye that defines the color (yellow). Tolerance is ±1 nm.
• Spectral Line Half-Width (Δλ): 20 nm (typical). This indicates the spectral purity or bandwidth of the emitted light.
• Forward Voltage (VF): 1.90 - 2.65 V @ 50mA. The voltage drop across the LED when operating. This range is also subject to binning.
• Reverse Current (IR): 10 μA (max) @ VR=10V. LEDs are not designed for reverse operation; this parameter is for test purposes only. Circuit design must prevent reverse voltage application.

3. Binning System Explanation

Due to inherent variations in semiconductor manufacturing, LEDs are sorted (binned) based on key parameters. This system allows designers to select components with consistent performance for their application.

3.1 Forward Voltage (Vf) Binning

LEDs are grouped into bins (C, D, E, F, G) based on their forward voltage drop at 50mA. For example, bin C covers 1.90V to 2.05V, while bin G covers 2.50V to 2.65V. Selecting a tighter Vf bin can help ensure uniform brightness when multiple LEDs are driven in parallel from a constant voltage source, as they will share current more evenly.

3.2 Luminous Intensity (Iv) Binning

This binning categorizes LEDs by their brightness output. Bins X1 (1800-2240 mcd), X2 (2240-2800 mcd), and Y1 (2800-3550 mcd) are defined. Applications requiring specific brightness levels or consistency across multiple units should specify the required Iv bin.

3.3 Dominant Wavelength (Wd) Binning

Color consistency is critical in many applications. Wavelength bins 3 (583-586 nm), 4 (586-589 nm), 5 (589-592 nm), and 6 (592-595 nm) ensure the yellow hue is controlled within a narrow range. A typical batch label might read something like \"E/X2/5\\