Table of Contents
- 1. Product Overview
- 1.1 Core Advantages
- 1.2 Target Market & Applications
- 2. In-Depth Technical Parameter Analysis
- 2.1 Electro-Optical Characteristics
- 2.2 Absolute Maximum Ratings & Electrical Parameters
- 2.3 Thermal Characteristics
- 3. Binning System Explanation
- 3.1 Luminous Flux Binning
- 3.2 Forward Voltage Binning
- 3.3 Chromaticity & CCT Binning
- 3.4 Color Rendering Index (CRI) Binning
- 4. Performance Curve Analysis & Design Considerations
- 4.1 Current vs. Luminous Flux/Voltage
- 4.2 Temperature Dependence
- 4.3 Spectral Distribution
- 5. Mechanical, Packaging & Assembly Information
- 5.1 Package & Dimensions
- 5.2 Soldering Guidelines
- 5.3 Polarity Identification
- 6. Ordering Information & Model Number Decoding
- 7. Application Suggestions & Design Notes
- 7.1 Driver Circuit Design
- 7.2 Thermal Management Design
- 7.3 Optical Design
- 8. Technical Comparison & Market Context
- 9. Frequently Asked Questions (FAQ)
- 10. Practical Use Case Example
- 11. Operating Principle
- 12. Technology Trends & Context
1. Product Overview
The 67-21ST is a surface-mount device (SMD) mid-power LED housed in a PLCC-2 (Plastic Leaded Chip Carrier) package. It is designed as a white LED offering a balance of performance, efficiency, and reliability for general lighting applications. Its compact form factor and standardized package make it suitable for automated assembly processes.
1.1 Core Advantages
The key advantages of this LED package include:
- High Efficacy: Delivers good luminous output relative to its power consumption.
- High Color Rendering Index (CRI): Available with minimum CRI ratings from 60 to 90, ensuring good color reproduction. The standard mass production list features CRI 80 (Min.) variants.
- Wide Viewing Angle: A typical viewing angle (2θ1/2) of 120 degrees provides broad and even illumination.
- Low Power Consumption: Operates at a standard forward current of 60mA, making it energy-efficient.
- Environmental Compliance: The product is Pb-free, compliant with EU RoHS and REACH regulations, and meets halogen-free standards (Br<900ppm, Cl<900ppm, Br+Cl<1500ppm).
- ANSI Binning: Follows standardized binning for chromaticity, ensuring color consistency across production batches.
1.2 Target Market & Applications
This LED is an ideal solution for a wide range of lighting applications that require a reliable, efficient, and compact light source. Primary application areas include:
- General Lighting: Integration into residential, commercial, and industrial luminaires.
- Decorative and Entertainment Lighting: Used in accent lighting, signage, and stage lighting.
- Indicators and Switch Lights: Suitable for backlighting buttons, panels, and status indicators.
- General Illumination: For any application requiring a diffuse, wide-angle white light source.
2. In-Depth Technical Parameter Analysis
This section provides a detailed, objective interpretation of the LED's key performance parameters as defined in the datasheet under standard test conditions (soldering point temperature = 25°C).
2.1 Electro-Optical Characteristics
The primary performance metrics are summarized below. All values are specified at a forward current (IF) of 60mA.
- Luminous Flux (Φ): The minimum luminous flux varies by correlated color temperature (CCT), ranging from 23 lm for 2400K to 28 lm for CCTs from 4000K to 6500K. The typical maximum can reach up to 34 lm depending on the bin. A tolerance of ±11% applies.
- Forward Voltage (VF): The maximum forward voltage is 3.3V, with a typical range from 2.8V to 3.3V. The tolerance is ±0.1V. Lower VF bins contribute to higher system efficiency.
- Color Rendering Index (CRI - Ra): Standard products have a minimum CRI of 80, with a tolerance of ±2. The R9 value (saturated red) is specified as 0 (min), which is typical for standard white LEDs and indicates limited deep red rendering.
- Viewing Angle (2θ1/2): The typical value is 120 degrees, which is considered a wide viewing angle, suitable for applications requiring broad light distribution.
- Reverse Current (IR): Maximum of 50 µA at a reverse voltage of 5V, indicating the diode's leakage characteristics.
2.2 Absolute Maximum Ratings & Electrical Parameters
These ratings define the limits beyond which permanent damage may occur. Operation should always be within these limits.
- Forward Current (IF): 75 mA (continuous).
- Peak Forward Current (IFP): 150 mA (pulsed, duty cycle 1/10, pulse width 10ms).
- Power Dissipation (Pd): 250 mW.
- Forward Voltage Index: Coded as "33" in the part number, corresponding to VF max of 3.3V.
- Forward Current Index: Coded as "Z6" in the part number, corresponding to IF of 60mA.
2.3 Thermal Characteristics
Thermal management is crucial for LED longevity and performance stability.
- Thermal Resistance (Rth J-S): Junction-to-soldering point thermal resistance is 21 °C/W. This value is critical for calculating the junction temperature based on the power dissipated and the board temperature.
- Junction Temperature (Tj): Maximum allowable is 125 °C. Exceeding this limit accelerates lumen depreciation and can cause catastrophic failure.
- Operating Temperature (Topr): -40 to +105 °C. This defines the ambient temperature range for reliable operation.
- Storage Temperature (Tstg): -40 to +100 °C.
3. Binning System Explanation
The product uses a comprehensive binning system to ensure consistency in luminous flux, forward voltage, and chromaticity (color).
3.1 Luminous Flux Binning
Luminous flux is binned with specific codes. For example:
- 2400K: Bins include 23L2 (23-25 lm), 25L2 (25-27 lm), 27L2 (27-29 lm).
- 2700K to 6500K: Bins include 24L2 (24-26 lm), 26L2 (26-28 lm), 28L2 (28-30 lm), 30L2 (30-32 lm), 32L2 (32-34 lm).
3.2 Forward Voltage Binning
Forward voltage is grouped under code "2833" and further binned in 0.1V steps:
- 28A: 2.8 - 2.9V
- 29A: 2.9 - 3.0V
- 30A: 3.0 - 3.1V
- 31A: 3.1 - 3.2V
- 32A: 3.2 - 3.3V
3.3 Chromaticity & CCT Binning
The LED uses ANSI-standard chromaticity bins defined on the CIE 1931 diagram. The datasheet provides detailed coordinate boxes for each CCT and sub-bin (e.g., 30K-A, 30K-B, 30K-C, 30K-D, 30K-F, 30K-G for 3000K). This ensures the emitted white light falls within a defined color space. The CCT range for mass production spans from 2400K (warm white) to 6500K (cool white).
3.4 Color Rendering Index (CRI) Binning
CRI is indicated by a single-letter code in the part number:
- M: CRI(Min.) 60
- N: CRI(Min.) 65
- L: CRI(Min.) 70
- Q: CRI(Min.) 75
- K: CRI(Min.) 80
- P: CRI(Min.) 85
- H: CRI(Min.) 90
4. Performance Curve Analysis & Design Considerations
While specific performance curves (IV, spectrum, temperature vs. flux) are not provided in the excerpt, key relationships can be inferred from the parameters.
4.1 Current vs. Luminous Flux/Voltage
All primary characteristics are specified at 60mA. Operating at a lower current will reduce luminous output and forward voltage, while increasing current up to the maximum 75mA will increase both. The relationship is generally linear within this range, but efficacy (lm/W) may decrease at higher currents due to increased thermal load.
4.2 Temperature Dependence
LED performance is temperature-sensitive. As junction temperature rises:
- Luminous Flux Decreases: Light output typically drops. The thermal resistance of 21°C/W is key to estimating Tj.
- Forward Voltage Decreases: VF has a negative temperature coefficient.
- Chromaticity May Shift: The white point can shift slightly with temperature.
4.3 Spectral Distribution
As a white LED, it uses a blue InGaN chip combined with a phosphor layer (water-clear resin) to produce white light. The CCT defines the "warmth" or "coolness" of the white light. The CRI of 80 indicates good, but not exceptional, color rendering across the visible spectrum, with a noted limitation in the R9 (red) value.
5. Mechanical, Packaging & Assembly Information
5.1 Package & Dimensions
The LED uses a standard PLCC-2 surface-mount package. While exact dimensions are not detailed in the provided text, this package type typically has a low profile and is designed for pick-and-place assembly. The top view is the emitting surface.
5.2 Soldering Guidelines
The device is sensitive to electrostatic discharge (ESD) and must be handled with appropriate precautions. Soldering specifications are:
- Reflow Soldering: Maximum peak temperature of 260°C for 10 seconds.
- Hand Soldering: Iron tip temperature not to exceed 350°C for 3 seconds.
5.3 Polarity Identification
PLCC-2 packages have two leads. The cathode is typically identified by a marking on the package, such as a notch, green dot, or cut corner. Correct polarity must be observed during assembly.
6. Ordering Information & Model Number Decoding
The part number follows a specific structure: 67-21ST/KKE-HXXXX33Z6/2T
- 67-21ST/: Base package code.
- KKE: Likely internal code.
- H: Prefix for the performance code.
- XX: First two digits indicate CCT (e.g., 30 for 3000K).
- XX: Next two digits indicate minimum luminous flux bin (e.g., 26 for 26 lm min).
- 33: Forward Voltage index (3.3V max).
- Z6: Forward Current index (60mA).
- /2T: Packaging code (e.g., tape and reel).
7. Application Suggestions & Design Notes
7.1 Driver Circuit Design
For stable operation, use a constant current driver set to 60mA (±10%). The driver must be capable of providing a voltage compliance above the maximum forward voltage of the selected bin (up to 3.3V + headroom). Consider inrush current protection.
7.2 Thermal Management Design
Calculate the expected junction temperature: Tj = Ts + (Rth J-S * Pd), where Ts is the soldering point temperature and Pd = VF * IF. Ensure Tj remains well below 125°C, ideally below 85°C for optimal lifetime. Use adequate copper area on the PCB for heat spreading.
7.3 Optical Design
The 120-degree viewing angle is inherently diffuse. For directional lighting, secondary optics (lenses, reflectors) will be required. The water-clear resin allows for good light extraction.
8. Technical Comparison & Market Context
The 67-21ST fits into the popular mid-power LED category, competing with other PLCC-2 and similar package types (e.g., 2835, 3014). Its differentiation lies in its specific combination of flux, CRI, and voltage bins, as well as its compliance certifications. Compared to high-power LEDs, it offers lower thermal density and is often driven in arrays for higher total lumen output. Compared to low-power LEDs, it provides significantly higher efficacy and flux.
9. Frequently Asked Questions (FAQ)
Q: What is the typical lifetime of this LED?
A: While not explicitly stated in the excerpt, LED lifetime (L70/B50) is heavily dependent on operating conditions, primarily junction temperature. When operated within specifications with good thermal management, typical lifetimes of 25,000 to 50,000 hours can be expected.
Q: Can I drive this LED at 75mA continuously?
A: Yes, 75mA is the absolute maximum continuous rating. However, driving at the maximum current will generate more heat, reduce efficacy, and potentially shorten lifespan. Operating at the recommended 60mA is advised for optimal performance and reliability.
Q: How do I select the right CCT and CRI for my application?
A: For ambient lighting (homes, offices), 2700K-4000K with CRI 80+ is common. For retail or task lighting where color accuracy is critical, consider CRI 90+ variants. For decorative lighting, the choice depends on the desired ambiance.
Q: Is a series resistor sufficient to drive this LED?
A> A simple series resistor can be used for basic, non-critical applications with a stable voltage supply. However, a constant current driver is strongly recommended for stable light output, better efficiency, and protection against voltage variations and thermal runaway.
10. Practical Use Case Example
Scenario: Designing a linear LED tube light.
- Requirements: 1200 lm output, 4000K neutral white, CRI >80, input voltage 24V DC.
- Selection: Choose part number 67-21ST/KKE-H402833Z6/2T (4000K, 28 lm min, VF ~3.1V typ).
- Array Design: To achieve 1200 lm, approximately 1200 lm / 28 lm/LED ≈ 43 LEDs are needed. Arrange them in a series-parallel configuration compatible with a 24V driver. For example, 14 series strings of 3 LEDs each (14 * 3.1V ≈ 43.4V) would require a boost driver. A more practical design might use 2 parallel strings of 22 LEDs in series (22 * 3.1V ≈ 68.2V), requiring a different driver. Detailed driver selection is needed.
- Thermal Design: Total power ≈ 43 LEDs * 3.1V * 0.06A ≈ 8W. Ensure the metal core PCB or heatsink can dissipate this heat to keep the LED junctions cool.
- Optical Design: Use a diffuser cover to blend the individual LED points into a uniform line of light.
11. Operating Principle
The 67-21ST LED operates on the principle of electroluminescence in a semiconductor. An InGaN (Indium Gallium Nitride) chip emits blue light when a forward current is applied across its p-n junction. This blue light then excites a layer of yellow (and often red) phosphors coated on or around the chip. The combination of the blue light from the chip and the yellow/red light from the phosphors mixes to produce the perception of white light. The exact proportions of blue and phosphor-converted light determine the correlated color temperature (CCT) of the emitted white light.
12. Technology Trends & Context
Mid-power LEDs like the 67-21ST represent a mature and highly optimized segment of LED technology. Current trends in this space focus on:
- Increased Efficacy (lm/W): Ongoing improvements in chip design and phosphor efficiency.
- Higher CRI with Better R9: Development of phosphor systems that improve red rendering without significant efficacy loss.
- Color Tuning: Growth of tunable white products, often using multiple LED chips in a single package.
- Miniaturization & Higher Density: Packing more lumens into the same or smaller footprint for sleeker luminaire designs.
- Improved Reliability & Lifetime: Enhanced materials and packaging techniques to withstand higher temperatures and harsher environments.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |