SMD Middle Power Deep Red LED 67-21S - PLCC-2 Package - 2.0x1.25x0.7mm - 2.0-2.9V - 60mA - 40-100mW - English Technical Document

1. Product Overview

This document details the specifications for a surface-mount device (SMD) Middle Power LED utilizing AlGaInP chip technology to emit deep red light. The component is housed in a compact PLCC-2 (Plastic Leaded Chip Carrier) package, designed for automated assembly processes. Its primary advantages include high luminous efficacy, moderate power consumption suitable for extended operation, and a very wide viewing angle that ensures uniform light distribution. These characteristics make it a versatile choice for a broad spectrum of illumination applications beyond simple indicator use.

1.1 Key Features and Compliance

• Package: Standard PLCC-2 form factor for reliable SMT placement.
• Emitted Color: Deep Red (650-680 nm peak wavelength).
• Viewing Angle: 120 degrees (typical), providing a broad radiation pattern.
• Environmental Compliance: The product is Pb-free (lead-free), compliant with the EU RoHS (Restriction of Hazardous Substances) directive, adheres to EU REACH regulations, and meets halogen-free standards (Br <900ppm, Cl <900ppm, Br+Cl <1500ppm).
• Binning: Follows ANSI (American National Standards Institute) standards for consistent color and flux output, ensuring uniformity in production batches.

1.2 Target Applications

This LED is engineered for lighting applications requiring efficient red emission. Typical use cases include:

• Decorative and Entertainment Lighting: Architectural accent lighting, stage lighting, and mood lighting where specific color points are critical.
• Agriculture Lighting: Supplemental lighting in horticulture and vertical farming, particularly in photomorphogenesis processes where red light influences plant growth and flowering.
• General Lighting: Integration into luminaires requiring a red component for tunable white light or specific color temperature effects.

2. Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

Important Note: This device is sensitive to electrostatic discharge (ESD). Proper ESD handling procedures must be followed during assembly and handling to prevent latent or catastrophic failure.

3. Electro-Optical Characteristics

These parameters are measured at a solder point temperature (T_soldering) of 25°C and represent the typical performance under specified conditions.

Notes:
1. Tolerance on Radiometric Power is ±11%.
2. Tolerance on Forward Voltage is ±0.1V.

4. Binning System Explanation

To ensure color and performance consistency in production, LEDs are sorted into bins. This device uses three independent binning criteria.

4.1 Radiometric Power Binning

LEDs are categorized based on their optical output power at 60mA. The bin code is part of the product ordering number.

4.2 Forward Voltage Binning

LEDs are also sorted by their forward voltage drop, which is crucial for designing constant-current drivers and managing thermal load.

4.3 Peak Wavelength Binning

This defines the spectral color of the emitted deep red light, critical for applications where specific wavelengths are required (e.g., plant photoreceptor response).

Note: Dominant/Peak wavelength measurement tolerance is ±1nm.

5. Performance Curve Analysis

The following graphs, derived from typical data, illustrate how key parameters change with operating conditions. These are essential for robust system design.

5.1 Spectral Distribution

The provided spectrum curve shows a narrow, well-defined peak in the deep red region (approximately 660-670nm for the typical part), characteristic of AlGaInP technology. There is minimal emission in other spectral bands, resulting in a saturated red color.

5.2 Forward Voltage vs. Junction Temperature (Fig.1)

The forward voltage (V_F) of a semiconductor LED has a negative temperature coefficient. As the junction temperature (T_j) increases from 25°C to 115°C, V_F decreases linearly by approximately 0.25V. This characteristic is vital for temperature compensation in driver circuits and can be used for indirect junction temperature monitoring.

5.3 Relative Radiometric Power vs. Forward Current (Fig.2)

The optical output power increases sub-linearly with forward current. While driving at higher currents yields more light, it also generates significantly more heat, reducing efficacy (lumens per watt) and potentially shortening lifespan. The curve helps designers balance output against efficiency and reliability.

5.4 Relative Luminous Flux vs. Junction Temperature (Fig.3)

Like most LEDs, the light output of this device decreases as junction temperature rises. The graph shows the relative luminous flux dropping to about 80% of its room-temperature value when T_j reaches 115°C. Effective thermal management (low R_th) is therefore critical to maintaining stable light output.

5.5 Forward Current vs. Forward Voltage (IV Curve) (Fig.4)

This is the fundamental IV characteristic. It shows the exponential relationship at low currents transitioning to a more resistive behavior at the rated operating current (~60mA). The slope in the operating region is related to the dynamic resistance of the LED.

5.6 Maximum Driving Current vs. Soldering Temperature (Fig.5)

This derating curve is crucial for reliability. It indicates the maximum permissible forward current to keep the junction temperature below its 115°C limit, based on the temperature of the solder point (which is influenced by the PCB's temperature). For example, if the solder point reaches 70°C, the maximum safe continuous current is derated to approximately 45mA.

5.7 Radiation Pattern (Fig.6)

The polar diagram confirms the wide, Lambertian-like emission pattern with a typical half-angle of 120°. The intensity is nearly uniform across a broad central region, making it suitable for applications requiring wide-area illumination rather than a focused beam.

6. Mechanical and Package Information

6.1 Package Dimensions

The LED is housed in a standard PLCC-2 package. Key dimensions (in mm) are:
- Overall Length: 2.0 mm
- Overall Width: 1.25 mm
- Overall Height: 0.7 mm
- Lead Pitch: 1.05 mm (distance between solder pads)
- Pad Dimensions: Approximately 0.6mm x 0.55mm
All unspecified tolerances are ±0.1mm. The cathode is typically indicated by a notch or a green marking on the package.

6.2 Polarity Identification

Correct polarity is essential. The package features a visual indicator (such as a chamfered corner or a colored dot) to denote the cathode (-) terminal. The PCB footprint design must mirror this orientation.

7. Soldering and Assembly Guidelines

7.1 Reflow Soldering Parameters

The device is rated for standard infrared or convection reflow soldering. The recommended profile has a peak temperature of 260°C (+0/-5°C) measured on the package body, with the time above 240°C not exceeding 10 seconds. A single reflow cycle is recommended.

7.2 Hand Soldering

If manual soldering is necessary, it should be performed with a temperature-controlled iron set to a maximum tip temperature of 350°C. Contact time per lead should be limited to 3 seconds or less to prevent thermal damage to the plastic package and the internal die bond.

7.3 Storage Conditions

As a moisture-sensitive device (MSD), the LEDs are packed in a moisture-resistant bag with desiccant. Once the sealed bag is opened, the components must be used within a specified time frame (typically 168 hours at <30°C/60%RH) or baked before reflow to prevent \"popcorning\" damage during soldering.

8. Packaging and Ordering Information

8.1 Reel and Tape Specifications

The components are supplied on embossed carrier tape for automated pick-and-place machines. Standard reel dimensions are provided (e.g., 13-inch reel). Available quantities per reel include 500, 1000, 1500, 2000, 2500, 3000, 3500, and 4000 pieces.

8.2 Label Explanation

The reel label contains critical information for traceability and verification:
- P/N: Full product number, encoding the specific bin codes for Flux, Wavelength, and Voltage.
- QTY: Quantity of pieces on the reel.
- LOT No.: Manufacturing lot number for quality control.

8.3 Moisture-Resistant Packing

The shipping unit consists of the reel placed inside an aluminum laminated moisture-proof bag along with desiccant and a humidity indicator card. The bag is then sealed.

9. Reliability Testing

The product undergoes a comprehensive suite of reliability tests conducted with a 90% confidence level and 10% LTPD (Lot Tolerance Percent Defective). Key test items include:
- Reflow Soldering Resistance: 260°C for 10 seconds.
- Thermal Shock: 200 cycles between -10°C and +100°C.
- Temperature Cycling: 200 cycles between -40°C and +100°C.
- High Temperature/Humidity Storage & Operation: 1000 hours at 85°C/85%RH.
- High/Low Temperature Storage: 1000 hours at 85°C and -40°C.
- High/Low Temperature Operation Life: 1000 hours at various temperatures (25°C, 55°C, 85°C, -40°C) under specified drive currents.
These tests validate the long-term stability and robustness of the LED under harsh environmental and operational stresses.

10. Application Design Considerations

10.1 Thermal Management

With a thermal resistance (R_{th J-S}) of 50°C/W, managing heat is paramount. For continuous operation at 60mA (V_F~2.5V, P_d~150mW), the junction will be 7.5°C hotter than the solder point. Use a PCB with adequate thermal vias and copper area under the pads to dissipate heat to the ambient environment. Refer to the derating curve (Fig.5) to adjust maximum current based on the expected PCB temperature.

10.2 Electrical Drive

Always drive LEDs with a constant current source, not a constant voltage. This ensures stable light output and prevents thermal runaway. The driver should be designed to accommodate the forward voltage bin range (2.0V to 2.9V). Consider implementing pulse-width modulation (PWM) for dimming to avoid color shift associated with analog (current reduction) dimming.

10.3 Optical Integration

The wide 120° viewing angle may require secondary optics (lenses, diffusers) if a more directed beam is needed. The water-clear resin lens minimizes light absorption. For multi-LED arrays, ensure adequate spacing to prevent thermal coupling between adjacent devices.

11. Technical Comparison and Differentiation

This Middle Power LED occupies a specific niche. Compared to low-power indicator LEDs, it offers significantly higher radiant flux and is designed for continuous illumination. Compared to high-power LEDs, it operates at lower current and has a simpler package without a metal-core PCB, making it more cost-effective for applications requiring many distributed points of light. Its key differentiators are the combination of AlGaInP deep red efficiency, the standardized PLCC-2 package for manufacturing ease, and comprehensive ANSI binning for color consistency.

12. Frequently Asked Questions (FAQ)

Q: Can I drive this LED at 120mA continuously?
A: No. The Absolute Maximum Rating for continuous forward current is 60mA. The 120mA rating is for pulsed operation only (10% duty cycle, 10ms pulse width). Exceeding the continuous current rating will overheat the junction, leading to rapid lumen depreciation and premature failure.

Q: What is the difference between Radiometric Power (mW) and Luminous Flux (lm)?
A: Radiometric power measures the total optical power emitted in watts. Luminous flux measures the perceived power of light adjusted for the sensitivity of the human eye (photopic curve). For deep red LEDs, the luminous flux value will be relatively low because the human eye is less sensitive to red light, but the radiometric power (important for plant growth or sensing) is high.

Q: How do I interpret the product code 67-21S/NDR2C-P5080B2C12029Z6/2T?
A: The code encodes the package type (67-21S), the color (NDR = Deep Red), and the specific bin codes for various parameters (e.g., B2 for flux, C1 for flux, 29 for voltage, Z6 for wavelength). The exact decoding should be confirmed with the manufacturer's bin code chart.

Q: Is a heatsink required?
A> For a single LED on a standard FR4 PCB with moderate copper, a dedicated heatsink may not be necessary at 60mA. However, for arrays of LEDs or operation in high ambient temperatures, thermal analysis is required. The derating curve (Fig.5) provides guidance. Improving the PCB thermal design is often more effective than adding a separate heatsink to such a small package.

13. Practical Design Case Study

Scenario: Designing a supplemental lighting bar for indoor lettuce cultivation. The bar is 1 meter long and requires an even coverage of deep red light (660nm) to stimulate photosynthesis.

Design Steps:
1. Target Illuminance: Determine the required Photosynthetic Photon Flux Density (PPFD) at the plant canopy.
2. LED Selection: This LED, in bin DA3 (660-670nm), is ideal due to its spectral match with chlorophyll absorption peaks.
3. Array Design: Calculate the number of LEDs needed based on the radiometric output per LED (e.g., 70mW from bin B4) and the efficiency of the optical system. Space them evenly along the bar.
4. Thermal Design: Mount the LEDs on an aluminum PCB (MCPCB) to manage the collective heat from the array, keeping the solder point temperature low to maximize light output and longevity (per Fig.3 & 5).
5. Driver Design: Use a constant current driver capable of supplying the total current (number of LEDs * 60mA) with a voltage compliance that covers the sum of the maximum V_F of the series string. Include PWM dimming for daily light integral control.

14. Operating Principle

This LED is based on Aluminum Gallium Indium Phosphide (AlGaInP) semiconductor material. When a forward voltage exceeding the diode's turn-on voltage (~2.0V) is applied, electrons and holes are injected into the active region from the n-type and p-type layers, respectively. They recombine radiatively, releasing energy in the form of photons. The specific bandgap energy of the AlGaInP alloy determines the wavelength of the emitted photons, which is in the deep red spectrum (650-680 nm). The epoxy resin lens encapsulates the chip, provides mechanical protection, and shapes the light output beam.

15. Technology Trends

The trend in Middle Power LEDs like this one is towards ever-increasing efficacy (more light output per electrical watt input) and improved reliability at higher operating temperatures. Advances in epitaxial growth and chip design continue to reduce efficiency droop (the decline in efficacy at higher currents). Packaging innovations focus on improving thermal pathways to lower R_th and using more robust, high-temperature resins. Furthermore, tighter binning tolerances are becoming standard to meet the demands of color-critical applications in horticulture and high-end architectural lighting, where consistency across thousands of LEDs is essential.