SMD RGB LED with Integrated Driver - 3.2x2.8x1.9mm - 5V - 88mW - Red/Green/Blue - English Datasheet

1. Product Overview

This document details the specifications for a miniature, surface-mount LED component designed for automated printed circuit board assembly. The device integrates three individual LED chips (Red, Green, Blue) along with an 8-bit driver integrated circuit within a single package. This integration enables precise, independent control of each color channel, making it suitable for applications requiring dynamic color mixing and high-resolution brightness adjustment. The component is supplied on industry-standard 8mm tape wound onto 7-inch reels, facilitating high-volume, automated placement.

1.1 Features

• Compliant with RoHS environmental directives.
• Utilizes high-efficiency AlInGaP (Red) and InGaN (Green, Blue) semiconductor materials for superior brightness.
• Integrated 8-bit driver IC provides 256 distinct brightness levels for each of the three color channels (Red, Green, Blue).
• High data scan frequency of no less than 800 kHz ensures smooth color transitions and refresh rates.
• Packaged on 8mm carrier tape for compatibility with standard automated pick-and-place equipment.
• Compatible with infrared (IR) reflow soldering processes, suitable for lead-free assembly.
• Logic-level input compatible for easy interfacing with microcontrollers and digital logic circuits.

1.2 Applications

The device is engineered for a broad spectrum of electronic equipment where space, automated assembly, and precise color control are critical. Primary application areas include:

• Backlighting: Keypad, keyboard, and decorative panel illumination in consumer electronics, office automation, and home appliances.
• Status Indicators: Multi-color status and signal indicators in telecommunications, networking, and industrial control equipment.
• Micro-Displays & Signage: Low-resolution pixel elements for informational displays, symbolic luminaries, and decorative lighting.

2. Technical Parameters: In-Depth Objective Interpretation

2.1 Absolute Maximum Ratings

These values define the stress limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Power Dissipation (P_D): 88 mW. This is the maximum total power the package can dissipate as heat. Exceeding this limit risks overheating the internal IC and LED dice.
• IC Supply Voltage (V_DD): +4.2V to +5.5V. The integrated driver circuit requires a regulated supply within this range for reliable operation. Voltages outside this range may cause malfunction or damage.
• Total Forward Current (I_F): 16 mA DC. This is the maximum sum of currents that can be supplied to all three LED channels simultaneously.
• Operating Temperature (T_op): -20°C to +85°C. The device is guaranteed to function within this ambient temperature range.
• Storage Temperature (T_stg): -30°C to +85°C.
• Soldering Temperature: Withstands 260°C for 10 seconds, aligning with typical lead-free reflow profiles.

Critical Design Note: The embedded IC generates heat during operation. A well-designed PCB thermal management system (e.g., adequate copper pours, thermal vias) is essential to maintain the temperature at the LED's solder pads below 85°C for long-term reliability.

2.2 Electro-Optical Characteristics

Measured at an ambient temperature (T_a) of 25°C with V_DD=5V and all color channels set to maximum brightness (data = 8'b11111111).

• Luminous Intensity (I_V):
  • Red (AlInGaP): 71.0 - 180.0 mcd (millicandela)
  • Green (InGaN): 180.0 - 355.0 mcd
  • Blue (InGaN): 35.5 - 71.0 mcd
  The specific intensity for a given unit is determined by its bin code (see Section 4).
• Viewing Angle (2θ_1/2): 120 degrees. This is the full angle at which the luminous intensity drops to half of its peak axial value, indicating a wide, diffuse emission pattern suitable for area illumination.
• Dominant Wavelength (λ_d):
  • Red: 620.0 - 628.0 nm
  • Green: 522.0 - 530.0 nm
  • Blue: 464.0 - 472.0 nm
  This parameter defines the perceived color of the light and is also subject to binning.
• IC Output Current (I_F per channel): Typically 5 mA per color channel when driven at V_DD=5V. This is the constant current set by the internal driver for each LED.
• IC Quiescent Current (I_DD): Typically 0.8 mA when all LED data is set to '0' (off state). This is the power consumed by the driver IC itself when not actively lighting the LEDs.

2.3 Digital Interface & Timing

The device uses a single-wire, serial data protocol to receive 24-bit data (8 bits for each Red, Green, and Blue channel).

• Logic Levels:
  • High-level input voltage (V_IH): ≥ 3.0V
  • Low-level input voltage (V_IL): ≤ 0.3 * V_DD
• Data Timing (T_H + T_L = 1.2 µs ± 300ns):
  • Bit '0': High time (T_0H) = 300ns ±150ns, Low time (T_0L) = 900ns ±150ns.
  • Bit '1': High time (T_1H) = 900ns ±150ns, Low time (T_1L) = 300ns ±150ns.
• Latch Time (LAT): A low pulse on the data line lasting more than 250 µs signals the end of a data frame. The IC latches (stores) the received 24-bit data and updates the LED outputs accordingly. No data transmission should occur during this latch period.

Data Flow: Data is shifted in serially through the DIN pin. After receiving 24 bits, a latch command updates the internal registers. The data is then passed out through the DOUT pin, allowing multiple devices to be daisy-chained from a single microcontroller pin.

3. Binning System Explanation

To ensure color and brightness consistency in production, devices are sorted into performance bins. Two key parameters are binned: Luminous Intensity and Dominant Wavelength.

3.1 Luminous Intensity Binning

Each color channel is binned separately with a tolerance of ±15% within each bin.

• Red: Bins Q1 (71.0-90.0 mcd), Q2 (90.0-112.0 mcd), R1 (112.0-140.0 mcd), R2 (140.0-180.0 mcd).
• Green: Bins S1 (180.0-224.0 mcd), S2 (224.0-280.0 mcd), T1 (280.0-355.0 mcd).
• Blue: Bins N2 (35.5-45.0 mcd), P1 (45.0-56.0 mcd), P2 (56.0-71.0 mcd).

3.2 Dominant Wavelength (Hue) Binning

This binning ensures precise color points. Tolerance is ±1 nm within each bin.

• Red: Bin U (620.0-624.0 nm), Bin V (624.0-628.0 nm).
• Green: Bin P (522.0-526.0 nm), Bin Q (526.0-530.0 nm).
• Blue: Bin C (464.0-468.0 nm), Bin D (468.0-472.0 nm).

Design Implication: For applications requiring uniform color across multiple units, specifying tight bin codes or purchasing from the same production lot is recommended.

4. Mechanical & Package Information

4.1 Device Dimensions and Pinout

The component has a compact footprint. Key dimensions include a body size of approximately 3.2mm x 2.8mm with a height of 1.9mm. Tolerances are typically ±0.15mm unless otherwise specified.

Pin Configuration:

1. V_DD: Power supply input for the integrated driver IC (+4.2V to +5.5V).
2. DIN: Serial data input. Control data for the RGB channels is shifted in through this pin.
3. V_SS: Ground connection.
4. DOUT: Serial data output. Used for daisy-chaining multiple devices; outputs the data received from DIN after an internal delay.

The lens is water clear, allowing the native color of each LED chip to be visible.

4.2 Recommended PCB Land Pattern

A suggested solder pad layout is provided to ensure reliable soldering and mechanical stability. The design typically includes thermal relief connections and adequate pad size to facilitate good solder joint formation during reflow.

5. Assembly & Handling Guidelines

5.1 Soldering Process

The device is compatible with infrared (IR) reflow soldering processes using lead-free (Pb-free) solder. The maximum recommended peak body temperature is 260°C, which should not be exceeded for more than 10 seconds. Standard reflow profiles for moisture-sensitive components (MSL) should be followed.

5.2 Cleaning

If post-assembly cleaning is necessary, immerse the assembled board in ethyl alcohol or isopropyl alcohol at room temperature for no more than one minute. The use of unspecified or aggressive chemical cleaners may damage the LED package material.

5.3 Electrostatic Discharge (ESD) Precautions

The integrated circuit and LED chips are sensitive to electrostatic discharge. Proper ESD controls must be in place during handling and assembly:

• Personnel should wear grounded wrist straps or anti-static gloves.
• All workstations, tools, and equipment must be properly grounded.
• Store and transport components in ESD-protective packaging.

5.4 Storage Conditions

• Sealed Moisture Barrier Bag (MBB): Store at ≤30°C and ≤90% Relative Humidity (RH). The shelf life is one year from the date of bag sealing when stored with desiccant inside.
• After Bag Opening: If not used immediately, components should be stored in an environment not exceeding 30°C and 60% RH. For long-term storage after opening, baking may be required per standard IPC/JEDEC moisture sensitivity level procedures before reflow.

6. Packaging and Ordering

6.1 Tape and Reel Specifications

The device is supplied for automated assembly:

• Tape Width: 8mm.
• Reel Diameter: 7 inches (178mm).
• Quantity per Reel: 4000 pieces.
• Minimum Order Quantity (MOQ): 500 pieces for remainder quantities.
• Pocket Sealing: Component pockets are sealed with a top cover tape.
• Missing Components: A maximum of two consecutive empty pockets is allowed per specification.
• Standard: Packaging conforms to ANSI/EIA-481 specifications.

7. Application Notes & Design Considerations

7.1 Typical Application Circuit

A typical implementation involves connecting a microcontroller's general-purpose I/O (GPIO) pin to the DIN of the first LED in a chain. The DOUT of the first LED connects to the DIN of the next, and so on. A single GPIO can thus control a long string of LEDs. A stable, decoupled 5V power supply must be provided to the V_DD pins, with a local bypass capacitor (e.g., 100nF) placed close to each device or small group of devices.

7.2 Thermal Management

As highlighted in the ratings, thermal design is critical. The PCB should use copper planes connected to the ground (V_SS) pads to act as a heat sink. Thermal vias under the device can help transfer heat to inner or bottom layers. For high-brightness or high-duty-cycle operation, monitor the pad temperature to ensure it remains below 85°C.

7.3 Data Signal Integrity

For long daisy chains or in electrically noisy environments, consider the following:

• Keep data lines as short as possible.
• Avoid running data lines parallel to high-current or switching traces.
• A small series resistor (e.g., 33-100 Ω) placed close to the microcontroller's output pin can help reduce ringing on the data line.
• Ensure the microcontroller can generate the precise 1.2µs bit timing required by the protocol.

7.4 Power Supply Sequencing and Inrush Current

When powering up a long chain of LEDs, the simultaneous turn-on of the internal driver ICs may cause a momentary inrush current spike on the V_DD line. The power supply and PCB traces must be sized to handle this without significant voltage droop. A slow-start circuit or staggered enabling of different chains may be necessary in large arrays.

8. Frequently Asked Questions (Based on Technical Parameters)

8.1 Can I drive this LED with a 3.3V microcontroller?

Yes, but with caution. The high-level input voltage (V_IH) requirement is 3.0V minimum. A 3.3V logic high meets this specification. However, you must ensure the power supply (V_DD) is still within its specified range of 4.2V to 5.5V. The LED driver IC itself requires 5V, so you cannot power it from 3.3V.

8.2 What is the purpose of the DOUT pin?

The DOUT pin allows daisy-chaining. The IC internally buffers the incoming serial data and outputs it after a fixed delay. This allows a single data line from a microcontroller to feed an unlimited number of LEDs in series, as each device passes the data stream to the next.

8.3 How do I calculate the total power consumption?

Total power is the sum of the LED power and the IC quiescent power.
LED Power (max): (V_DD * I_{F_Red}) + (V_DD * I_{F_Green}) + (V_DD * I_{F_Blue}) ≈ 5V * (5mA+5mA+5mA) = 75mW.
IC Quiescent Power: V_DD * I_DD ≈ 5V * 0.8mA = 4mW.
Approx. Total (all on): 79mW, which is below the 88mW maximum dissipation. Remember, this is at full brightness. Lower brightness settings will consume less power.

8.4 Why is there a minimum latch time of 250µs?

The latch time (LAT) is a reset period. A low signal longer than 250µs tells the IC that the current 24-bit data frame is complete and it should update its output registers. This mechanism ensures reliable synchronization between the controller and the LED chain, preventing corrupted data from being displayed.