SMD5050 RGB Full Color LED Datasheet - Size 5.0x5.0mm - Voltage 2.2-3.4V - Power 0.2W - English Technical Document

1. Product Overview

The SMD5050 RGB full-color LED is a surface-mount device designed for applications requiring vibrant, multi-color illumination. It integrates red, green, and blue (RGB) semiconductor chips within a single 5.0mm x 5.0mm package, enabling the creation of a wide spectrum of colors through additive color mixing. This component is engineered for high-brightness output and reliable performance in a compact form factor, making it suitable for modern lighting designs.

1.1 Core Advantages

The primary advantages of this LED include its high luminous intensity, wide viewing angle of 120 degrees, and the ability to generate millions of colors by independently controlling the intensity of the red, green, and blue diodes. Its SMD design facilitates automated assembly processes, improving manufacturing efficiency and consistency.

1.2 Target Market and Applications

This LED is targeted at the consumer electronics, architectural lighting, signage, automotive accent lighting, and entertainment industries. Typical applications include LED video walls, decorative lighting strips, status indicators, backlighting for displays, and dynamic ambient lighting systems where color-changing capabilities are essential.

2. Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics (Ta=25°C)

The following table details the key operational parameters for each color channel under typical conditions. It is crucial to adhere to the maximum ratings to ensure device longevity and performance.

Parameter	Symbol	Typical Value	Maximum Value	Unit
Power Dissipation	PD	200	306	mW
Forward Current	IF	60	90	mA
Forward Voltage (Red)	VF	2.2	2.6	V
Forward Voltage (Green)	VF	3.2	3.4	V
Forward Voltage (Blue)	VF	3.2	3.4	V
Reverse Voltage	VR	-	5	V
Reverse Current	IR	-	≤5	μA
Peak Wavelength (λd) Red	λd	625	-	nm
Peak Wavelength (λd) Green	λd	525	-	nm
Peak Wavelength (λd) Blue	λd	460	-	nm
Viewing Angle (2θ½)	2θ½	120	-	°
Operating Temperature	Topr	-40 to +80	-	°C
Storage Temperature	Tstg	-40 to +80	-	°C
Junction Temperature	Tj	-	125	°C

2.2 Thermal Characteristics

The maximum junction temperature (Tj) is specified at 125°C. Proper thermal management, including adequate PCB copper area and potential heatsinking, is necessary when operating at high currents or in elevated ambient temperatures to prevent performance degradation and premature failure.

3. Binning System Explanation

3.1 Wavelength Binning Standards

To ensure color consistency in production, LEDs are sorted into bins based on their peak emission wavelength. The following codes define the wavelength ranges for each color.

Code	Minimum	Maximum	Unit
R1	620	625	nm
R2	625	630	nm
G5	519	522.5	nm
G6	522.5	526	nm
G7	526	530	nm
B1	445	450	nm
B2	450	455	nm
B3	455	460	nm
B4	460	465	nm

This binning allows designers to select LEDs with precise chromaticity for applications demanding uniform color appearance, such as in large-format displays or coordinated lighting installations.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (IV Curve)

The IV curve illustrates the relationship between the forward voltage (VF) and forward current (IF) for the red, green, and blue chips. The red LED typically exhibits a lower forward voltage (~2.2V) compared to the green and blue LEDs (~3.2V). This characteristic is crucial for designing appropriate current-limiting circuits or constant-current drivers for each channel to achieve balanced color output and prevent over-current conditions.

4.2 Relative Spectral Energy vs. Junction Temperature

This graph shows how the light output (relative spectral energy) of each color chip varies with increasing junction temperature (Tj). Generally, the luminous output decreases as the junction temperature rises. The rate of decrease can vary between the different semiconductor materials (InGaN for blue/green and AlInGaP for red). Effective heat sinking is vital to maintain stable color output and brightness over the product's lifetime.

4.3 Ambient Temperature vs. Allowable Forward Current

This derating curve defines the maximum permissible forward current as a function of the ambient temperature (Ta). As the ambient temperature increases, the maximum allowable current must be reduced to prevent the junction temperature from exceeding its 125°C limit. Designers must reference this curve to determine safe operating currents for their specific application environment.

4.4 Radiation Pattern (Viewing Angle Curve)

The polar intensity distribution diagram confirms the 120-degree viewing angle. The emission pattern is typically Lambertian or near-Lambertian, providing a wide, even field of illumination suitable for many general lighting and indicator applications.

5. Mechanical and Package Information

5.1 Package Dimensions and Outline Drawing

The LED is housed in a standard SMD5050 package with dimensions of 5.0mm (L) x 5.0mm (W). The exact height and dimensional tolerances (e.g., ±0.10mm for .X dimensions, ±0.05mm for .XX dimensions) should be referenced from the detailed mechanical drawing in the original datasheet for precise PCB layout.

5.2 Recommended Pad Layout and Stencil Design

A recommended land pattern (footprint) and solder paste stencil design are provided to ensure reliable soldering. The pad layout typically features six pads—two for each of the three color chips, which share a common cathode or anode configuration depending on the specific part number. Adhering to this recommended layout minimizes soldering defects like tombstoning and ensures proper thermal and electrical connection.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Parameters

This LED is compatible with standard infrared (IR) or convection reflow soldering processes used for surface-mount technology (SMT). A typical lead-free reflow profile with a peak temperature not exceeding 260°C for a duration specified by JEDEC standards (e.g., 10-30 seconds above 240°C) is generally applicable. It is critical to avoid excessive thermal stress to prevent damage to the internal wire bonds and the epoxy lens.

6.2 Handling and Storage Precautions

LEDs are sensitive to electrostatic discharge (ESD). Always handle them in an ESD-protected environment using grounded wrist straps and conductive containers. Store components in their original moisture-barrier bags at recommended conditions (temperature < 40°C, humidity < 70% RH) to prevent moisture absorption, which can cause \"popcorning\" during reflow.

7. Packaging and Ordering Information

7.1 Product Packaging Specification

The LEDs are supplied in embossed carrier tape for automated pick-and-place assembly. The tape width, pocket dimensions, and reel count follow EIA-481 standards. A cover tape with a specified peel strength (0.1 - 0.7N at a 10-degree angle) seals the components in place. This packaging ensures component protection, orientation consistency, and feeding reliability in high-speed assembly machines.

7.2 Part Numbering System (Model Naming Rule)

The part number follows a structured format that encodes key attributes:
T [Shape Code] [Chip Count] [Optics Code] [Internal Code] [Color Code] [Flux Code] - [CCT Code] [Other Codes].
For example, the code \"5A\" indicates a 5050N shape, \"3\" indicates three chips (RGB), \"00\" indicates no secondary lens, \"F\" indicates full-color, etc. Understanding this nomenclature is essential for correctly specifying and ordering the desired LED variant with the correct color, brightness, and optical characteristics.

8. Application Recommendations

8.1 Typical Application Circuits

Each color channel of the RGB LED should be driven independently using a constant-current source or a current-limiting resistor in series with a switched voltage source. Pulse-width modulation (PWM) is the preferred method for intensity control (dimming and color mixing) as it maintains a consistent forward voltage and chromaticity, unlike analog dimming which can cause color shift. A microcontroller with PWM outputs is commonly used to generate the control signals.

8.2 Design Considerations

• Current Matching: Due to different Vf and efficiency of R, G, B chips, separate current-setting resistors or drivers are needed to achieve white balance or desired color ratios.
• Thermal Management: Include sufficient thermal relief and copper area on the PCB, especially if operating at high currents or in high-density arrays.
• ESD Protection: Incorporate ESD protection diodes on signal lines close to the LED, particularly in portable or consumer applications.
• Optical Design: Consider the 120-degree viewing angle when designing lenses or light guides to achieve the desired beam pattern and spatial distribution.

9. Reliability and Quality Standards

9.1 Reliability Test Standards

The product undergoes rigorous reliability testing per industry standards (JESD22, MIL-STD-202G). Key tests include:

• Operating Life Test: Conducted at room temperature, high temperature (85°C), and low temperature (-40°C) for 1008 hours under maximum current.
• High Temperature/Humidity Operating Life: 1008 hours at 60°C/90% RH.
• Temperature Cycling: Exposing the device to rapid transitions between extreme temperatures (e.g., -40°C to +125°C).

Failure criteria are strictly defined, including limits on forward voltage shift (≤200mV), luminous flux degradation (≤15% for InGaN, ≤25% for AlInGaP), and leakage current (≤10μA).

10. Frequently Asked Questions (FAQ)

10.1 How do I achieve pure white light with this RGB LED?

Pure white is created by mixing specific intensities of red, green, and blue light. The exact current ratio (e.g., IR:IG:IB) required depends on the individual efficiency and chromaticity coordinates of the specific LED bin. It typically requires calibration and feedback from a color sensor for high-accuracy applications. Using PWM control allows fine adjustment of this ratio.

10.2 Can I drive all three channels in parallel from a single constant-current source?

No. Due to the significant difference in forward voltage between the red (~2.2V) and blue/green (~3.2V) chips, connecting them in parallel would result in severe current imbalance, potentially overdriving the red channel while underdriving the others. Each color channel must have its own current control circuit.

10.3 What is the impact of junction temperature on color?

Increasing junction temperature causes a shift in the peak wavelength (typically a longer wavelength for AlInGaP red and a shorter wavelength for InGaN blue/green) and a reduction in light output. This can lead to visible color shift in RGB systems if not managed. Maintaining a stable, low junction temperature through good thermal design is critical for color-stable applications.

11. Practical Design Case Study

11.1 Design of a Color-Tunable Desk Lamp

Consider a desk lamp using an array of these SMD5050 RGB LEDs. The design would involve:

1. Driver Circuit: A dedicated LED driver IC with three independent constant-current outputs and PWM dimming capability for each channel, controlled via I2C or a similar interface from a microcontroller.
2. Thermal Design: The metal core PCB (MCPCB) acts as a heatsink. Thermal vias connect the LED thermal pads to a large copper plane on the backside of the board to dissipate heat efficiently.
3. Optics: A diffuser is placed over the LED array to blend the individual points of light into a uniform, glare-free illumination area.
4. Control: A user interface (buttons, touch sensor, or app) allows selection of pre-set colors (white, warm white, cool white) or custom colors via RGB sliders. The microcontroller translates these inputs into the corresponding PWM duty cycles for the R, G, and B channels.

This case highlights the integration of electrical, thermal, optical, and firmware design considerations when using this component.

12. Technical Principle Introduction

12.1 Working Principle of RGB LEDs

An RGB LED is essentially three independent light-emitting diodes—red, green, and blue—encapsulated together. Each diode emits light through electroluminescence: when a forward voltage is applied across the p-n junction of a semiconductor material (AlInGaP for red, InGaN for green and blue), electrons recombine with holes, releasing energy in the form of photons. The wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material. By independently controlling the intensity of these three primary colors, a vast array of secondary colors can be produced through additive color mixing.

13. Technology Trends

13.1 Evolution in Full-Color LEDs

The market for full-color LEDs continues to evolve with trends focusing on:

• Higher Efficiency (lm/W): Ongoing improvements in epitaxial growth and chip design yield more light output per unit of electrical power, reducing energy consumption and thermal load.
• Improved Color Rendering and Gamut: Development of new phosphor systems and narrow-band emitters (like quantum dots) to expand the color gamut for displays and improve the Color Rendering Index (CRI) for lighting, even in RGB-based systems.
• Miniaturization: Development of smaller package sizes (e.g., 2020, 1515) with similar or improved performance for space-constrained applications like mini-LED backlights for TVs and monitors.
• Integrated Smart Features: The emergence of LEDs with built-in drivers, controllers, and communication interfaces (e.g., I2C, SPI, or wireless like Zigbee/BLE) simplifying system design for IoT-connected lighting.
• Enhanced Reliability: Advancements in packaging materials (silicones, ceramics) to better withstand higher temperatures and harsher environmental conditions, extending product lifetime.