Table of Contents
- 1. Product Overview
- 2. Technical Parameter Deep Dive
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical & Optical Characteristics
- 3. Binning System Explanation
- 3.1 Luminous Flux Binning
- 3.2 Dominant Wavelength Binning
- 4. Performance Curve Analysis
- 4.1 Forward Voltage vs. Forward Current (I-V Curve)
- 4.2 Relative Luminous Flux vs. Forward Current
- 4.3 Relative Spectral Power vs. Junction Temperature
- 4.4 Spectral Power Distribution
- 5. Mechanical & Package Information
- 5.1 Package Dimensions
- 5.2 Recommended Pad Layout & Stencil Design
- 5.3 Polarity Identification
- 6. Soldering & Assembly Guidelines
- 6.1 Moisture Sensitivity & Baking
- 6.2 Reflow Soldering Profile
- 7. Electrostatic Discharge (ESD) Protection
- 8. Application Circuit Design
- 8.1 Driving Method
- 8.2 Current Limiting Resistor (for Constant Voltage Source)
- 8.3 Connection Sequence
- 9. Handling & Storage Precautions
- 10. Product Nomenclature & Ordering Information
- 11. Typical Application Scenarios
- 12. Design Considerations & FAQs
- 12.1 How do I select the right current?
- 12.2 Why is thermal management important?
- 12.3 Can I connect multiple LEDs in series or parallel?
- 13. Technical Comparison & Trends
1. Product Overview
The SMD5050N series is a surface-mount LED designed for applications requiring high brightness and reliability in a compact 5.0mm x 5.0mm footprint. This document provides the complete technical specifications for the Blue variant, model T5A003BA. The device features a standard SMD package suitable for automated assembly processes and is intended for use in backlighting, signage, decorative lighting, and general illumination.
2. Technical Parameter Deep Dive
2.1 Absolute Maximum Ratings
The following parameters define the limits beyond which permanent damage to the device may occur. All values are specified at an ambient temperature (Ts) of 25°C.
- Forward Current (IF): 90 mA (Continuous)
- Forward Pulse Current (IFP): 120 mA (Pulse Width ≤10ms, Duty Cycle ≤1/10)
- Power Dissipation (PD): 306 mW
- Operating Temperature (Topr): -40°C to +80°C
- Storage Temperature (Tstg): -40°C to +80°C
- Junction Temperature (Tj): 125°C
- Soldering Temperature (Tsld): Reflow soldering at 200°C or 230°C for a maximum of 10 seconds.
2.2 Electrical & Optical Characteristics
Typical operating parameters are measured at Ts=25°C with a forward current (IF) of 60mA, which is the recommended test condition.
- Forward Voltage (VF): Typical 3.2V, Maximum 3.4V (Tolerance: ±0.08V)
- Reverse Voltage (VR): 5 V
- Reverse Current (IR): Maximum 10 µA at VR=5V
- Dominant Wavelength (λd): 460 nm (Refer to binned values in Section 2.4)
- Viewing Angle (2θ1/2): 120° (Wide viewing angle, lens-less design)
3. Binning System Explanation
3.1 Luminous Flux Binning
The luminous flux output is categorized into bins to ensure consistency. Measurements are taken at IF=60mA with a tolerance of ±7%.
- Code A4: Min 1.5 lm, Typ 2.0 lm
- Code A5: Min 2.0 lm, Typ 2.5 lm
- Code A6: Min 2.5 lm, Typ 3.0 lm
- Code A7: Min 3.0 lm, Typ 3.5 lm
- Code A8: Min 3.5 lm, Typ 4.0 lm
3.2 Dominant Wavelength Binning
The blue color is precisely controlled through wavelength binning.
- Code B1: 445 nm – 450 nm
- Code B2: 450 nm – 455 nm
- Code B3: 455 nm – 460 nm
- Code B4: 460 nm – 465 nm
4. Performance Curve Analysis
The datasheet includes several key performance graphs essential for circuit design and thermal management.
4.1 Forward Voltage vs. Forward Current (I-V Curve)
This graph shows the non-linear relationship between voltage and current. The forward voltage increases with current and is also temperature-dependent. Designers must use this curve to calculate power dissipation (VF * IF) and ensure the driver can supply the necessary voltage, especially at low temperatures where VF increases.
4.2 Relative Luminous Flux vs. Forward Current
This curve illustrates how light output scales with drive current. While output increases with current, efficiency typically decreases at higher currents due to increased thermal effects. Operating significantly above the recommended 60mA test point may reduce lifetime and shift color.
4.3 Relative Spectral Power vs. Junction Temperature
For blue LEDs, the peak wavelength can shift with junction temperature (typically 0.1-0.3 nm/°C). This graph is critical for applications requiring stable color output. Higher junction temperatures cause a redshift (longer wavelength), which must be accounted for in thermal design.
4.4 Spectral Power Distribution
This graph displays the full emission spectrum of the blue LED, showing a narrow peak around the dominant wavelength (e.g., 460nm). The full width at half maximum (FWHM) is typically 20-30nm for InGaN-based blue LEDs. Understanding the spectrum is vital for color mixing applications or when using phosphor conversion for white light.
5. Mechanical & Package Information
5.1 Package Dimensions
The SMD5050N package has nominal dimensions of 5.0mm (L) x 5.0mm (W) x 1.6mm (H). Detailed mechanical drawings with tolerances are provided: .X dimensions have a tolerance of ±0.10mm, and .XX dimensions have a tolerance of ±0.05mm.
5.2 Recommended Pad Layout & Stencil Design
For reliable soldering, a specific pad pattern is recommended. The pad design ensures proper solder fillet formation and mechanical strength. A corresponding stencil aperture design is provided to control solder paste volume, which is crucial for achieving a reliable solder joint without bridging or insufficient solder.
5.3 Polarity Identification
The LED cathode is typically marked on the package. Correct polarity must be observed during assembly to prevent reverse bias, which is limited to 5V.
6. Soldering & Assembly Guidelines
6.1 Moisture Sensitivity & Baking
The SMD5050N package is moisture-sensitive (MSL classified per IPC/JEDEC J-STD-020C).
- Storage: Store in original sealed bag with desiccant at <30°C and <85% RH.
- Floor Life: After opening the sealed bag, components should be used within 12 hours if stored at <30°C/<60% RH.
- Baking Required If: The bag has been opened for >12 hours, or the humidity indicator card shows high humidity.
- Baking Procedure: Bake at 60°C for 24 hours. Do not exceed 60°C. Use within 1 hour after baking or store in a dry cabinet (<20% RH).
6.2 Reflow Soldering Profile
The LED can withstand a lead-free reflow profile with a peak temperature of 200°C or 230°C for a maximum of 10 seconds. Consult the specific profile recommendations to minimize thermal stress on the silicone encapsulant and wire bonds.
7. Electrostatic Discharge (ESD) Protection
Blue LEDs are sensitive to electrostatic discharge. Failure modes include increased leakage current (reduced brightness, color shift) or catastrophic failure (dead LED).
- Prevention Measures: Use grounded anti-static workstations, floor mats, and wrist straps.
- Personnel: Operators must wear anti-static garments and gloves.
- Equipment: Use ionizers and ensure soldering irons are properly grounded.
- Packaging: Use conductive or anti-static materials for handling and transport.
8. Application Circuit Design
8.1 Driving Method
Constant Current Drive is strongly recommended. LEDs are current-driven devices; their light output is proportional to current, not voltage. A constant current source provides stable brightness and protects the LED from thermal runaway.
8.2 Current Limiting Resistor (for Constant Voltage Source)
If a constant voltage source (e.g., a regulated DC supply) must be used, a series current-limiting resistor is mandatory. The resistor value is calculated using Ohm's Law: R = (Vsupply - VF) / IF. The power rating of the resistor must be sufficient: PR = (IF)² * R. This method is less efficient and less stable than constant current drive, as VF varies with temperature.
8.3 Connection Sequence
When connecting an LED module to a driver, follow this sequence to avoid voltage spikes: 1) Identify LED and driver polarity. 2) Connect the driver output to the LED module. 3) Finally, connect the driver input to the power source. This prevents connecting a live driver to the LEDs.
9. Handling & Storage Precautions
- Avoid Direct Handling: Do not touch the LED lens with bare hands. Contaminants like skin oils can permanently stain the silicone, reducing light output.
- Use Proper Tools: Use vacuum pick-up tools or soft-tipped tweezers. Avoid excessive mechanical pressure on the lens, which can damage the wire bonds or die.
- Long-Term Storage: For opened packages, store in a dry cabinet with nitrogen purge or desiccant at 5-30°C and <60% RH.
10. Product Nomenclature & Ordering Information
The model number follows a structured code: T □□ □□ □ □ □ – □□□ □□. Key elements include:
- Package Code (5A): Denotes the 5050N package size.
- Chip Count: Indicates the number of LED dies within the package (e.g., 1, 2, 3).
- Color Code (B): B for Blue. Other codes: R (Red), Y (Yellow), G (Green), etc.
- Optics Code (00): 00 indicates no secondary lens (primary lens only).
- Flux Bin Code (e.g., A6): Specifies the luminous flux output bin.
- Wavelength Bin Code (e.g., B3): Specifies the dominant wavelength bin.
11. Typical Application Scenarios
- Backlighting: LCD TV and monitor edge-lighting, advertising light boxes.
- Decorative Lighting: Architectural accent lighting, cove lighting, signage.
- General Illumination: As a component in white LED modules using phosphor conversion.
- Automotive Interior Lighting: Dashboard, footwell, and ambient lighting.
- Consumer Electronics: Status indicators, keyboard backlights.
12. Design Considerations & FAQs
12.1 How do I select the right current?
Operate at or below the recommended test current of 60mA for optimal balance of brightness, efficiency, and lifetime. Higher currents increase light output but generate more heat, accelerating lumen depreciation and potentially shifting color.
12.2 Why is thermal management important?
LED performance and lifetime are inversely related to junction temperature. High Tj reduces light output (lumen depreciation), causes a color shift (for blue and white LEDs), and can lead to premature failure. Ensure adequate heat sinking, especially in high-power or enclosed applications.
12.3 Can I connect multiple LEDs in series or parallel?
Series connection is preferred when using a constant current driver, as the same current flows through all LEDs. Ensure the driver's compliance voltage is higher than the sum of the VF of all LEDs in the string. Parallel connection is generally not recommended due to VF binning variations, which can cause current imbalance and uneven brightness/overheating. If parallel connection is unavoidable, use a separate current-limiting resistor for each parallel branch.
13. Technical Comparison & Trends
The SMD5050N, with its 5.0x5.0mm footprint, offers a larger emitting area and higher potential light output than smaller packages like 3528 or 3014. It is a mature, cost-effective solution for applications not requiring the ultra-high density of newer, smaller packages. The industry trend is towards higher efficiency (lumens per watt) and improved color consistency (tighter binning). Future developments may include chip-scale packaging (CSP) and improved phosphor technologies for white LEDs derived from blue emitters.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |