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LED Lamp 383-2SDRC/S530-A3 Datasheet - Super Deep Red - 650nm - 20mA - 60mW - English Technical Document

Technical datasheet for the 383-2SDRC/S530-A3 Super Deep Red LED lamp. Details include electro-optical characteristics, absolute maximum ratings, package dimensions, and application guidelines.
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PDF Document Cover - LED Lamp 383-2SDRC/S530-A3 Datasheet - Super Deep Red - 650nm - 20mA - 60mW - English Technical Document

1. Product Overview

The 383-2SDRC/S530-A3 is a high-brightness LED lamp designed for applications requiring superior luminous output. It utilizes AlGaInP chip technology to produce a super deep red color with a typical peak wavelength of 650nm. This component is engineered for reliability and robustness, making it suitable for various electronic display and indicator applications.

1.1 Core Advantages

1.2 Target Market & Applications

This LED is primarily targeted at the consumer electronics and display industries. Its typical applications include backlighting or status indication in:

2. Technical Parameter Deep-Dive Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

2.2 Electro-Optical Characteristics (Ta=25°C)

The following parameters are measured under standard test conditions (IF=20mA) and represent the device's typical performance.

Note on Measurement Uncertainty: Luminous Intensity ±10%, Dominant Wavelength ±1.0nm, Forward Voltage ±0.1V.

3. Performance Curve Analysis

The datasheet provides several characteristic curves that are crucial for design engineers.

3.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution, confirming the narrow bandwidth and peak around 650nm, which is ideal for applications requiring a saturated deep red color.

3.2 Directivity Pattern

The radiation pattern illustrates the 6° typical viewing angle, showing how light intensity drops sharply outside the central beam, which is useful for directed lighting.

3.3 Forward Current vs. Forward Voltage (I-V Curve)

This graph is essential for designing the current-limiting circuitry. It shows the non-linear relationship between voltage and current, with the typical operating point at 20mA/2.0V.

3.4 Relative Intensity vs. Forward Current

This curve demonstrates that light output is approximately linear with current up to the maximum rated current, allowing for simple brightness modulation via current control.

3.5 Temperature Dependence

Two critical curves are provided:

4. Mechanical and Package Information

4.1 Package Dimensions

The datasheet includes a detailed mechanical drawing of the LED package. Key dimensions include the lead spacing, body size, and overall height. Critical notes specify that the flange height must be less than 1.5mm and general tolerances are ±0.25mm unless otherwise stated.

4.2 Polarity Identification

The cathode is typically indicated by a flat spot on the lens, a shorter lead, or a specific marking on the package as shown in the dimension diagram. Correct polarity must be observed during assembly.

5. Soldering and Assembly Guidelines

Proper handling is critical to ensure reliability and prevent damage to the LED.

5.1 Lead Forming

5.2 Storage

5.3 Soldering Process

Key Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering: Iron tip temperature ≤300°C (30W max), soldering time ≤3 seconds.

Wave/Dip Soldering: Preheat ≤100°C for ≤60 sec. Solder bath at ≤260°C for ≤5 sec.

Soldering Profile: A recommended temperature-time profile is provided, emphasizing controlled ramp-up, a defined peak temperature zone, and a controlled cooldown. A rapid cooldown process is not recommended.

Important: Avoid stress on leads during high-temperature phases. Do not solder (dip/hand) more than once. Protect the LED from shock/vibration until it cools to room temperature after soldering.

5.4 Cleaning

5.5 Heat Management

Thermal management must be considered during PCB and system design. The operating current should be de-rated appropriately based on the ambient temperature and the provided de-rating curves to ensure long-term reliability and maintain performance.

6. Packaging and Ordering Information

6.1 Packing Specification

6.2 Label Explanation

Labels on the packaging contain several codes:

7. Application Suggestions and Design Considerations

7.1 Typical Application Circuits

This LED requires a simple series current-limiting resistor when driven from a voltage source. The resistor value (R) can be calculated using Ohm's Law: R = (Vsource - VF) / IF. For a 5V supply and a target IF of 20mA with VF=2.0V, R = (5 - 2.0) / 0.02 = 150 Ω. A resistor with sufficient power rating (P = I2R) should be selected.

7.2 Design Considerations

8. Technical Comparison and Differentiation

The 383-2SDRC/S530-A3 differentiates itself primarily through its use of AlGaInP semiconductor material, which is highly efficient for producing red and amber colors. Compared to older technologies or some broad-spectrum white LEDs used with filters, AlGaInP LEDs offer superior luminous efficacy for deep red light, resulting in higher brightness for a given input power. The specific 650nm peak wavelength provides a saturated color ideal for status indicators and backlights where color purity is important.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What is the difference between Peak Wavelength (650nm) and Dominant Wavelength (639nm)?

Peak wavelength is the point of maximum power in the spectral output curve. Dominant wavelength is the single wavelength perceived by the human eye that matches the color of the light. The difference is due to the shape of the LED's emission spectrum and the sensitivity of the human eye (photopic response).

9.2 Can I drive this LED at its maximum continuous current of 25mA?

While possible, it is generally recommended to operate below the absolute maximum rating for improved long-term reliability and to account for temperature rises. The typical operating condition specified (20mA) is a safe and standard operating point that delivers the rated luminous intensity.

9.3 How critical is the 3mm minimum distance from the solder joint?

Very critical. Soldering closer than 3mm to the epoxy bulb can transfer excessive heat into the LED chip and internal wire bonds, potentially causing immediate failure or latent damage that reduces lifespan. This rule must be strictly followed during PCB design and assembly.

10. Practical Use Case Example

Scenario: Status Indicator on a Network Router

A designer needs a bright, unmistakable "Standby" or "Error" indicator. The 383-2SDRC/S530-A3 is an excellent choice. Its high luminous intensity (2000 mcd typical) ensures visibility even in well-lit rooms. The deep red color is universally associated with "stop" or "warning." The designer would:

  1. Design the PCB with holes matching the LED's lead spacing.
  2. Place a 150Ω current-limiting resistor in series with the LED, connected to a 5V GPIO pin from the router's microcontroller.
  3. Program the microcontroller to turn the GPIO pin on/off to control the LED state.
  4. Ensure the LED is placed on the router's front panel with a clear aperture, taking advantage of its narrow viewing angle to direct light toward the user.

This simple implementation provides a reliable, long-lasting, and highly visible status indicator.

11. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction of the semiconductor material (in this case, AlGaInP), electrons and holes recombine in the active region, releasing energy in the form of photons. The wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material. AlGaInP has a bandgap suitable for producing light in the red to amber portion of the visible spectrum. The specific doping and structure of the chip are engineered to maximize the efficiency of this light generation process.

12. Technology Trends

The LED industry continues to focus on increasing luminous efficacy (more light output per watt of electrical input), improving color consistency and saturation, and enhancing reliability. For monochromatic LEDs like the deep red type, trends include pushing for even higher brightness in smaller packages, improving high-temperature performance for automotive and industrial applications, and further refining binning processes to provide designers with tighter tolerances on key parameters like wavelength and forward voltage. The drive for miniaturization and integration also continues, with LEDs being incorporated into more complex modules and systems.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.