1. Product Overview
The 1224SDRC/S530-A4 is a high-brightness LED lamp designed for applications requiring superior luminous intensity in the deep red spectrum. Utilizing AlGaInP chip technology, this component emits a super deep red color with a typical peak wavelength of 650nm. The device is housed in a standard through-hole package with a water-clear resin lens, offering a typical viewing angle of 25 degrees. It is engineered for reliability and robustness, making it suitable for a variety of electronic display and indicator applications.
1.1 Core Advantages
- High Brightness: Delivers a typical luminous intensity of 500 millicandelas (mcd) at a forward current of 20mA, ensuring excellent visibility.
- Choice of Viewing Angles: Available with various viewing angles to suit different application requirements.
- Reliable Construction: Built with robust materials for long-term durability and stable performance.
- Environmental Compliance: The product is Pb-free and designed to remain within RoHS compliant specifications.
- Packaging Flexibility: Available on tape and reel for automated assembly processes.
1.2 Target Market & Applications
This LED is specifically targeted at consumer electronics and display applications where a clear, bright red indicator is essential. Its primary applications include, but are not limited to:
- Television sets (power indicators, status lights)
- Computer monitors
- Telephones
- Desktop computers and peripherals
- General electronic equipment requiring status or backlighting indicators.
2. Technical Parameter Deep-Dive
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.
| Parameter | Symbol | Rating | Unit |
|---|---|---|---|
| Continuous Forward Current | IF | 25 | mA |
| Peak Forward Current (Pulse Width ≤ 10ms, Duty Cycle ≤ 1/10) | IF(Peak) | 160 | mA |
| Reverse Voltage | VR | 5 | V |
| Power Dissipation | Pd | 60 | mW |
| Operating Temperature | Topr | -40 to +85 | °C |
| Storage Temperature | Tstg | -40 to +100 | °C |
| Electrostatic Discharge (Human Body Model) | ESD | 2000 | V |
| Soldering Temperature (for 5 seconds) | Tsol | 260 | °C |
Interpretation: The device can handle a continuous DC current of up to 25mA. For brief pulses, it can withstand up to 160mA. The low reverse voltage rating (5V) indicates that the LED is sensitive to reverse bias; care must be taken in circuit design to avoid applying reverse voltage. The ESD rating of 2000V (HBM) is standard for many discrete LEDs, but proper ESD handling precautions are still recommended during assembly.
2.2 Electro-Optical Characteristics (Ta=25°C)
These parameters define the typical performance of the LED under normal operating conditions.
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Condition |
|---|---|---|---|---|---|---|
| Luminous Intensity | Iv | 250 | 500 | -- | mcd | IF=20mA |
| Viewing Angle (Half Angle) | 2θ1/2 | -- | 25 | -- | deg | IF=20mA |
| Peak Wavelength | λp | -- | 650 | -- | nm | IF=20mA |
| Dominant Wavelength | λd | -- | 639 | -- | nm | IF=20mA |
| Spectral Bandwidth (FWHM) | Δλ | -- | 20 | -- | nm | IF=20mA |
| Forward Voltage | VF | -- | 2.0 | 2.4 | V | IF=20mA |
| Reverse Current | IR | -- | -- | 10 | μA | VR=5V |
Interpretation: The luminous intensity has a minimum of 250mcd and a typical value of 500mcd, indicating good brightness consistency. The 25-degree viewing angle provides a focused beam of light. The peak wavelength of 650nm places it in the deep red region of the spectrum. The typical forward voltage of 2.0V is relatively low for a red LED, which is characteristic of AlGaInP technology, leading to lower power consumption. The maximum reverse current of 10μA at 5V is a leakage specification.
3. Binning System Explanation
The datasheet indicates the device uses a selection system based on key optical parameters. While specific bin codes are not detailed in the provided excerpt, the parameters typically involved in such a system for this type of LED include:
- Dominant Wavelength (HUE): LEDs are sorted into bins based on their dominant wavelength (e.g., 639nm typical) to ensure color consistency within an application.
- Luminous Intensity (CAT - Ranks): The luminous intensity is categorized into ranks or bins (e.g., Min 250mcd, Typ 500mcd). This ensures a minimum brightness level is met.
- Forward Voltage: While not explicitly mentioned as a binned parameter here, VF can also be binned (Typ 2.0V, Max 2.4V) to aid in circuit design for current regulation.
The label explanation on the packaging (CPN, P/N, QTY, CAT, HUE, REF, LOT No.) confirms that categorical (CAT) and hue (HUE) information is tracked per lot, which is essential for procurement and production planning to maintain application consistency.
4. Performance Curve Analysis
The datasheet provides several typical characteristic curves which are crucial for understanding device behavior under non-standard conditions.
4.1 Relative Intensity vs. Wavelength
This curve shows the spectral power distribution. It will peak at approximately 650nm with a typical spectral bandwidth (FWHM) of 20nm. This narrow bandwidth is typical for AlGaInP LEDs and results in a saturated, pure deep red color.
4.2 Directivity Pattern
This polar plot illustrates the spatial distribution of light intensity, correlating to the 25-degree viewing angle. It shows how light intensity decreases as the angle from the central axis increases.
4.3 Forward Current vs. Forward Voltage (I-V Curve)
This graph depicts the exponential relationship between forward voltage (VF) and forward current (IF). For a typical red AlGaInP LED, the curve will show a turn-on voltage around 1.8V-2.0V, rising sharply thereafter. This curve is vital for designing the current-limiting circuitry.
4.4 Relative Intensity vs. Forward Current
This curve shows that luminous intensity increases with forward current but not linearly. It will tend to saturate at higher currents. Operating at the recommended 20mA ensures optimal efficiency and longevity.
4.5 Relative Intensity vs. Ambient Temperature & Forward Current vs. Ambient Temperature
These curves demonstrate the thermal characteristics of the LED. Luminous intensity typically decreases as ambient temperature increases due to reduced internal quantum efficiency. Conversely, for a constant driving voltage, the forward current may decrease with rising temperature due to changes in the semiconductor's properties. These curves highlight the importance of thermal management in the application design.
5. Mechanical & Package Information
5.1 Package Dimensions
The LED is packaged in a standard 3mm or 5mm radial through-hole format (specific dimensions are detailed in the package drawing on page 5 of the datasheet). Key dimensional notes include:
- All dimensions are in millimeters.
- The height of the flange (the rim at the base of the dome) must be less than 1.5mm (0.059\").
- A typical tolerance of ±0.25mm applies unless otherwise specified.
5.2 Polarity Identification
The cathode is typically identified by a flat spot on the rim of the LED package and/or by the shorter lead. The anode is the longer lead. Correct polarity must be observed during installation.
6. Soldering & Assembly Guidelines
Proper handling is critical to ensure reliability and prevent damage to the LED.
6.1 Lead Forming
- Bend leads at a point at least 3mm from the base of the epoxy bulb.
- Perform lead forming before soldering.
- Avoid stressing the LED package during bending.
- Cut leads at room temperature.
- Ensure PCB holes align perfectly with LED leads to avoid mounting stress.
6.2 Storage
- Store at ≤30°C and ≤70% Relative Humidity upon receipt.
- Shelf life is 3 months under these conditions.
- For longer storage (up to 1 year), use a sealed container with nitrogen atmosphere and desiccant.
- Avoid rapid temperature changes in humid environments to prevent condensation.
6.3 Soldering Parameters
Hand Soldering:
Iron Tip Temperature: 300°C Max. (30W Max.)
Soldering Time: 3 seconds Max.
Distance from solder joint to epoxy bulb: 3mm Min.
Wave or Dip Soldering:
Preheat Temperature: 100°C Max. (60 sec Max.)
Bath Temperature & Time: 260°C Max., 5 seconds Max.
Distance from solder joint to epoxy bulb: 3mm Min.
Critical Notes:
- Avoid stress on leads at high temperatures.
- Do not solder (dip/hand) more than once.
- Protect the epoxy bulb from shock/vibration until it cools to room temperature after soldering.
- Avoid rapid cooling from peak temperature.
- Always use the lowest possible soldering temperature.
6.4 Cleaning
- If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
- Air dry at room temperature.
- Do not use ultrasonic cleaning unless pre-qualified under specific, controlled conditions, as it can cause damage.
6.5 Heat Management
Proper thermal design is essential. The operating current should be de-rated appropriately based on the ambient temperature, referring to the de-rating curve typically found in the full datasheet. Inadequate heat sinking or operation above recommended temperatures will reduce light output and shorten the LED's lifespan.
7. Packaging & Ordering Information
7.1 Packing Specification
- Primary Pack: 1000 pieces per anti-static bag.
- Inner Carton: 4 bags (4000 pieces) per inner carton.
- Master Carton: 10 inner cartons (40,000 pieces) per outside carton.
7.2 Label Explanation
Labels on the packaging contain the following information:
CPN: Customer's Part Number
P/N: Manufacturer's Part Number (1224SDRC/S530-A4)
QTY: Quantity
CAT: Intensity Rank/Bin
HUE: Dominant Wavelength Bin
REF: Reference Code
LOT No.: Traceable Lot Number
8. Application Suggestions
8.1 Typical Application Circuits
This LED is typically driven by a constant current source or, more commonly, a voltage source with a series current-limiting resistor. The resistor value (R) can be calculated using Ohm's Law: R = (Vcc - VF) / IF, where Vcc is the supply voltage, VF is the LED forward voltage (use 2.4V max for design margin), and IF is the desired forward current (e.g., 20mA).
8.2 Design Considerations
- Current Regulation: Always use a series resistor or active constant-current driver to prevent exceeding the maximum forward current, especially with variable supply voltages.
- Reverse Voltage Protection: Consider adding a parallel diode in reverse bias across the LED if the circuit cannot guarantee the reverse voltage stays below 5V.
- Thermal Management: In high ambient temperature environments or enclosed spaces, ensure adequate ventilation or consider de-rating the operating current.
- ESD Protection: Implement ESD protection on input lines if the LED is in a user-accessible location.
9. Technical Comparison & Differentiation
Compared to older GaAsP-based red LEDs, this AlGaInP LED offers significantly higher luminous efficiency (brighter output at the same current) and better temperature stability. Its deep red color (650nm) is more saturated than standard red LEDs (typically 620-630nm). The 25-degree viewing angle is narrower than "wide-angle" variants (e.g., 60 degrees), providing a more focused beam ideal for panel-mounted indicators where light should be directed at the viewer.
10. Frequently Asked Questions (FAQ)
Q: Can I drive this LED at 25mA continuously?
A: Yes, 25mA is the Absolute Maximum Continuous Forward Current. For optimal lifespan and reliability, operating at or below the test condition of 20mA is recommended.
Q: What is the difference between Peak Wavelength (650nm) and Dominant Wavelength (639nm)?
A: Peak wavelength is the point of highest intensity in the spectrum. Dominant wavelength is the single wavelength of monochromatic light that matches the perceived color of the LED. The difference is due to the shape of the emission spectrum.
Q: How critical is the 3mm distance from the solder joint to the epoxy bulb?
A: Very critical. Soldering closer than 3mm can expose the epoxy resin to excessive heat, potentially causing cracking, discoloration (yellowing), or internal damage to the semiconductor die, leading to premature failure.
Q: The ESD rating is 2000V. Is this sufficient for manual handling?
A: While 2000V HBM is a common rating, it is not a license for careless handling. Always follow standard ESD precautions (use grounded wrist straps, work on ESD mats) during assembly to prevent latent damage that may not cause immediate failure but can degrade performance over time.
11. Practical Use Case Example
Scenario: Designing a power indicator for a desktop computer.
The LED will be mounted on the front panel. A 5V supply rail (Vcc) is available from the motherboard. To achieve a bright indicator at ~20mA:
1. Calculate series resistor: R = (5V - 2.4V) / 0.020A = 130 ohms. Use the nearest standard value, 120 or 150 ohms.
2. Verify power dissipation in resistor: P_R = (IF)^2 * R = (0.02^2)*150 = 0.06W. A standard 1/4W resistor is sufficient.
3. On the PCB layout, ensure the hole spacing matches the LED's lead spacing. Include a silkscreen outline showing the flat side (cathode) for correct orientation.
4. During assembly, bend the LED leads carefully 4-5mm from the body before inserting into the PCB. Hand-solder using a controlled-temperature iron set to 300°C, applying heat for no more than 3 seconds per lead.
This approach ensures a reliable, long-lasting indicator light.
12. Technology Principle Introduction
This LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material grown on a substrate. When a forward voltage is applied, electrons and holes are injected into the active region where they recombine, releasing energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength of light emitted—in this case, deep red at 650nm. The water-clear epoxy resin package acts as a lens, shaping the light output into the specified 25-degree viewing angle, and also protects the delicate semiconductor chip from mechanical and environmental damage.
13. Technology Development Trends
The trend in indicator LEDs like this one continues towards higher efficiency (more light output per watt of electrical input) and increased reliability. While the basic through-hole package remains popular for many applications, there is a parallel trend towards surface-mount device (SMD) packages for automated assembly. Advances in materials science may lead to even narrower spectral bandwidths for more pure colors or improved performance at higher temperatures. Furthermore, integration of features like built-in current-limiting resistors or protection diodes within the LED package is a growing trend to simplify circuit design and board layout.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |