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513S YGD/S530-E2 LED Lamp Datasheet - Super Yellow - 140° Viewing Angle - 2.4V Forward Voltage - 60mW Power Dissipation - English Technical Document

Complete technical datasheet for the 513S YGD/S530-E2 Super Yellow diffused LED lamp. Includes absolute maximum ratings, electro-optical characteristics, package dimensions, soldering guidelines, and application notes.
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PDF Document Cover - 513S YGD/S530-E2 LED Lamp Datasheet - Super Yellow - 140° Viewing Angle - 2.4V Forward Voltage - 60mW Power Dissipation - English Technical Document

1. Product Overview

The 513S YGD/S530-E2 is a high-brightness LED lamp designed for general-purpose indicator and backlighting applications. It utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip to produce a Super Yellow light output. The device features a green diffused resin lens which helps to broaden the viewing angle and soften the light appearance. This LED is characterized by its reliability, robustness, and compliance with major environmental regulations including RoHS, REACH, and Halogen-Free standards.

1.1 Core Advantages and Target Market

The primary advantages of this LED series include a choice of various viewing angles to suit different application needs and availability on tape and reel for automated assembly processes. Its design prioritizes higher brightness output. The target applications are primarily in consumer electronics, including use as status indicators or backlighting elements in television sets, computer monitors, telephones, and other computing devices.

2. Technical Parameter Deep-Dive

This section provides a detailed, objective analysis of the LED's key technical specifications as defined in its absolute maximum ratings and electro-optical characteristics.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the limits beyond which permanent damage to the device may occur. These are not operating conditions.

2.2 Electro-Optical Characteristics

These parameters are measured under typical test conditions (Ta=25°C, IF=20mA unless noted) and define the device's performance.

3. Binning System Explanation

The datasheet references a binning system for key parameters, though specific bin code tables are not provided in the excerpt. The label explanation mentions ranks for Luminous Intensity (CAT), Dominant Wavelength (HUE), and Forward Voltage (REF). This implies that production units are sorted into different categories or "bins" based on measured performance to ensure consistency within a specific order. Designers should consult the manufacturer for detailed binning specifications when tight color or intensity matching is required across multiple LEDs.

4. Performance Curve Analysis

The datasheet includes several typical characteristic curves which are crucial for understanding device behavior under non-standard conditions.

4.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution. For a Super Yellow AlGaInP LED, the spectrum is relatively narrow compared to white LEDs, centered around 573-575 nm. The spectrum radiation bandwidth (Δλ) is typically 20 nm.

4.2 Directivity Pattern

This polar plot illustrates the 140-degree viewing angle, showing how light intensity decreases from the center (0°). The diffused lens creates a smooth, wide emission pattern.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

This graph is essential for circuit design. It shows the non-linear relationship between current and voltage. The LED begins to conduct significantly around its turn-on voltage (~1.8-2.0V for AlGaInP). Drivers should use constant current, not constant voltage, to ensure stable light output.

4.4 Relative Intensity vs. Forward Current

This curve demonstrates that light output (intensity) increases with forward current, but not linearly across the entire range. Efficiency may drop at very high currents due to increased heat.

4.5 Temperature Dependence Curves

Relative Intensity vs. Ambient Temperature: LED light output typically decreases as ambient temperature rises. This curve quantifies that derating, which is critical for designing reliable systems in hot environments.
Forward Current vs. Ambient Temperature: This may show how the I-V characteristic shifts with temperature. The forward voltage typically decreases with increasing temperature for LEDs.

5. Mechanical and Package Information

5.1 Package Dimension Drawing

The LED is in a standard 3mm round (T-1) radial leaded package. Key dimensions from the drawing include the lead spacing, body diameter, and overall height. Critical notes specify that all dimensions are in millimeters, the flange height must be less than 1.5mm, and the general tolerance is ±0.25mm unless otherwise stated. Designers must adhere to these dimensions for proper PCB footprint design.

5.2 Polarity Identification

For radial leaded LEDs, the cathode is typically identified by a flat spot on the lens rim, a shorter lead, or other marking. The specific identification method should be cross-referenced with the dimensional drawing. Correct polarity is essential for operation.

6. Soldering and Assembly Guidelines

Proper handling is critical to prevent damage and ensure long-term reliability.

6.1 Lead Forming

6.2 Storage Conditions

6.3 Soldering Process

General Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
Hand Soldering: Iron tip temperature max 300°C (for 30W max iron), soldering time max 3 seconds.
Wave/Dip Soldering: Preheat max 100°C for 60 sec max. Solder bath temperature max 260°C for 5 seconds max.
Profile: A recommended soldering profile graph is provided, emphasizing controlled ramp-up, a defined peak temperature/time, and a controlled cool-down. A rapid cool-down process is not recommended.
Important: Avoid stress on leads during high temperature. Do not solder (dip/hand) more than once. Protect the LED from shock/vibration until it cools to room temperature after soldering.

6.4 Cleaning

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packed in moisture-resistant, anti-static materials. The packing hierarchy is:
1. Anti-static bag: Contains 200 to 500 pieces.
2. Inner box: Contains 6 bags.
3. Outside carton: Contains 10 boxes.
Therefore, a full carton contains a minimum of 200 pcs/bag * 6 bags/box * 10 boxes/carton = 12,000 pieces.

7.2 Label Explanation

Labels on the packaging include:
- CPN: Customer's Production Number
- P/N: Manufacturer's Part Number (e.g., 513S YGD/S530-E2)
- QTY: Quantity in the package
- CAT, HUE, REF: Binning codes for Luminous Intensity, Dominant Wavelength, and Forward Voltage, respectively.
- LOT No: Traceable manufacturing lot number.

8. Application Suggestions

8.1 Typical Application Scenarios

8.2 Design Considerations

9. Technical Comparison and Differentiation

Compared to older technology yellow LEDs (e.g., based on GaAsP), this AlGaInP-based LED offers significantly higher brightness and efficiency. The "Super Yellow" designation often implies a more saturated, pure yellow color. The wide 140-degree viewing angle due to the diffused lens differentiates it from clear lens LEDs which have a narrower beam. Its compliance with RoHS, REACH, and Halogen-Free standards makes it suitable for modern global markets with strict environmental requirements.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What resistor value should I use with a 5V supply?

Using Ohm's Law: R = (V_supply - Vf_led) / I_led. For a typical Vf of 2.0V at 20mA: R = (5V - 2.0V) / 0.020A = 150 Ohms. Use the maximum Vf (2.4V) to calculate the minimum safe resistor value: R_min = (5V - 2.4V) / 0.020A = 130 Ohms. A standard 150Ω resistor is a good choice, providing ~20mA at typical Vf and slightly less at max Vf, which is safe.

10.2 Can I drive this LED at its maximum continuous current of 25mA?

While you can operate it at 25mA, it is at the absolute limit. For improved longevity and reliability, especially at elevated ambient temperatures, it is strongly advised to operate at or below the typical test current of 20mA. Always consider thermal derating.

10.3 Why is the storage humidity condition important?

Plastic packages like this LED can absorb moisture from the air. During the high-temperature soldering process, this trapped moisture can rapidly expand, causing internal delamination or "popcorning" which cracks the package and destroys the device. The storage conditions and shelf life limits are designed to prevent excessive moisture absorption.

11. Practical Use Case Example

Scenario: Designing a status indicator panel for a network router.
The panel has 4 LEDs indicating Power, Internet, Wi-Fi, and Ethernet activity. The designer chooses the 513S YGD/S530-E2 for its high brightness and wide viewing angle, ensuring the status is visible from across a room. A PCB is designed with 2.54mm (0.1") spaced holes matching the LED's lead spacing. A current-limiting resistor of 180Ω is placed in series with each LED on a 3.3V board supply rail, resulting in a forward current of approximately (3.3V - 2.0V)/180Ω ≈ 7.2mA, which is sufficient for indication while maximizing LED life and minimizing power consumption. The assembly instructions specify wave soldering according to the 260°C for 5s profile.

12. Technology Principle Introduction

This LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material grown on a substrate. When a forward voltage is applied, electrons and holes recombine in the active region of the P-N junction, releasing energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength of light emitted—in this case, yellow (~573-575 nm). The green diffused epoxy resin lens serves two purposes: 1) It encapsulates and protects the fragile semiconductor chip and wire bonds, and 2) The diffusing particles within the resin scatter the light, broadening the emission angle from the chip's native pattern to the specified 140 degrees.

13. Industry Trends and Developments

While this is a mature through-hole LED product, the broader LED industry trends still influence its context. There is a continuous drive towards higher efficiency (more lumens per watt) and improved color consistency across production batches. The environmental compliance standards (RoHS, REACH, Halogen-Free) highlighted in this datasheet have become baseline requirements. The market for such indicator LEDs remains stable in legacy and cost-sensitive applications, though surface-mount device (SMD) LEDs are increasingly dominant in new designs due to their smaller size and suitability for automated pick-and-place assembly. The principles of proper thermal management, current driving, and ESD protection remain universally critical across all LED technologies.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.