SMT Green LED Indicator LTL-M11KG1H310U Datasheet - Right-Angle Holder - Voltage 2.0V - Power 72mW - English Technical Document

1. Product Overview

The LTL-M11KG1H310U is a Circuit Board Indicator (CBI) designed for surface mount technology (SMT) assembly. It consists of a black plastic right-angle holder (housing) that integrates with a high-efficiency green LED lamp. This component is engineered for applications requiring clear visual status indication in a compact, board-level package.

1.1 Core Advantages

• SMT Compatibility: Designed for automated pick-and-place and reflow soldering processes, enhancing manufacturing efficiency.
• Enhanced Contrast: The black plastic housing provides a high contrast background, improving the visibility and perceived brightness of the LED.
• High Efficiency: Utilizes AlInGaP green chip technology combined with a white diffused lens for consistent, wide-angle light distribution.
• Environmental Compliance: This is a lead-free product fully compliant with RoHS directives.
• Stackable Design: The housing design allows for the creation of vertical or horizontal arrays, offering flexibility in panel layout.

1.2 Target Applications

This indicator is suitable for a wide range of electronic equipment, including:

• Computer peripherals and motherboards
• Communication devices (routers, switches, modems)
• Consumer electronics
• Industrial control panels and instrumentation

2. Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Power Dissipation (P_D): 72 mW
• Peak Forward Current (I_FP): 80 mA (Duty Cycle ≤ 1/10, Pulse Width ≤ 0.1ms)
• Continuous Forward Current (I_F): 30 mA DC
• Operating Temperature Range (T_opr): -40°C to +85°C
• Storage Temperature Range (T_stg): -40°C to +100°C
• Lead Soldering Temperature: 260°C for a maximum of 5 seconds, measured 2.0mm from the LED body.

2.2 Electro-Optical Characteristics

Measured at an ambient temperature (T_A) of 25°C and a forward current (I_F) of 10mA, unless otherwise specified.

• Luminous Intensity (I_V): 3 mcd (Min), 8 mcd (Typ), 23 mcd (Max). The actual classification code is marked on the packing bag.
• Viewing Angle (2θ_1/2): 40 degrees. This is the full angle at which luminous intensity drops to half its axial value.
• Peak Wavelength (λ_P): 575 nm (Typical).
• Dominant Wavelength (λ_d): 564.5 nm (Min), 571 nm (Typ), 576.5 nm (Max). This defines the perceived color.
• Spectral Half-Width (Δλ): 15 nm (Typical).
• Forward Voltage (V_F): 1.8V (Min), 2.0V (Typ), 2.4V (Max) at I_F=10mA.
• Reverse Current (I_R): 10 μA (Max) at V_R=5V. Note: This device is not designed for operation under reverse bias.

3. Mechanical and Packaging Information

3.1 Outline Dimensions

The component features a right-angle design. Critical dimensional notes include:

• All dimensions are in millimeters, with a general tolerance of ±0.25mm unless otherwise specified.
• The housing material is black plastic.
• The integrated LED emits a green (yellow-green) color through a white diffused lens.

3.2 Packaging Specification

The LEDs are supplied on tape-and-reel for automated assembly.

• Carrier Tape: Black conductive polystyrene alloy, 0.40mm thick.
• Reel Size: Standard 13-inch (330mm) diameter reel.
• Quantity per Reel: 1,400 pieces.
• Master Packing: One reel is packed with a desiccant and humidity indicator card in a Moisture Barrier Bag (MBB). Three MBBs are packed in one inner carton (4,200 pcs total). Ten inner cartons are packed in one outer carton (42,000 pcs total).

4. Assembly and Handling Guidelines

4.1 Storage Conditions

• Sealed Package: Store at ≤30°C and ≤70% RH. Use within one year of the bag seal date.
• Opened Package: Store at ≤30°C and ≤60% RH. Components should be IR-reflowed within 168 hours (7 days) of opening the MBB.
• Extended Storage (Opened): For storage beyond 168 hours, store in a sealed container with desiccant or in a nitrogen desiccator. A bake at 60°C for at least 48 hours is required before SMT assembly.

4.2 Soldering Process

Hand Soldering: Maximum iron temperature of 300°C for a maximum of 3 seconds. Apply only once.

Reflow Soldering: Follow a JEDEC-compliant temperature profile. Key parameters include:

• Preheat/Soak: 150°C to 200°C over a maximum of 100 seconds.
• Time Above Liquidous (T_L=217°C): 60 to 150 seconds.
• Peak Temperature (T_P): 260°C maximum.
• Time within 5°C of Specified Classification Temp (T_C=255°C): Maximum 30 seconds.
• Total Time from 25°C to Peak: Maximum 5 minutes.

Caution: Excessive temperature or time can deform the lens or cause catastrophic LED failure. The maximum reflow temperature is not indicative of the holder's heat deflection temperature.

4.3 Cleaning

If cleaning is necessary after soldering, use alcohol-based solvents such as isopropyl alcohol. Avoid harsh or abrasive cleaners.

5. Application and Circuit Design

5.1 Drive Method

LEDs are current-driven devices. To ensure uniform brightness, especially when driving multiple LEDs in parallel, a current-limiting resistor must be used in series with each LED. The resistor value (R) can be calculated using Ohm's Law: R = (V_supply - V_F) / I_F, where V_F is the LED forward voltage and I_F is the desired operating current (e.g., 10mA).

5.2 Design Considerations

• Current Control: Always drive with a constant current or a voltage source with a series resistor. Direct connection to a voltage source exceeding V_F will cause excessive current and rapid failure.
• Thermal Management: While power dissipation is low, ensure the maximum junction temperature is not exceeded in high ambient temperature environments by adhering to the specified operating current.
• ESD Precautions: Although not explicitly stated for this device, standard ESD handling precautions for semiconductor devices are recommended during assembly.

6. Performance Curves and Characteristics

The datasheet references typical performance curves which illustrate the relationship between key parameters. While specific graphs are not detailed in the provided text, such curves typically include:

• Relative Luminous Intensity vs. Forward Current: Shows how light output increases with current, typically in a sub-linear manner at higher currents.
• Forward Voltage vs. Forward Current: Demonstrates the diode's I-V characteristic.
• Relative Luminous Intensity vs. Ambient Temperature: Illustrates the decrease in light output as junction temperature rises.
• Spectral Distribution: A graph showing the intensity of emitted light across different wavelengths, centered around the dominant wavelength of 571nm.

These curves are essential for designers to predict performance under non-standard conditions (different drive currents or temperatures) and to optimize the circuit for efficiency and longevity.

7. Technical Comparison and Positioning

The LTL-M11KG1H310U differentiates itself through its integrated right-angle SMT package. Compared to discrete LEDs that require separate holders or standoffs, this CBI solution offers:

• Simplified Assembly: A single component replaces the LED and holder, reducing part count and assembly steps.
• Consistent Alignment: The integrated housing ensures precise and consistent LED positioning relative to the PCB and panel cutout.
• Optimized Viewing: The right-angle design is ideal for applications where the indicator must be viewed from the front panel of an enclosure, perpendicular to the main PCB.
• Contrast Enhancement: The black housing is a key advantage over clear or white housings, significantly improving readability in various lighting conditions.

8. Frequently Asked Questions (FAQ)

8.1 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak Wavelength (λ_P): The single wavelength at which the spectral power distribution is maximum (575nm typical). Dominant Wavelength (λ_d): The single wavelength that, when combined with a reference white light, matches the perceived color of the LED. It is derived from the CIE chromaticity diagram and is more relevant to human color perception (571nm typical).

8.2 Why is a bake required if the MBB is opened for more than 168 hours?

The plastic packaging is moisture-sensitive (MSL 3). When exposed to ambient humidity, moisture can be absorbed. During the high-temperature reflow process, this trapped moisture can rapidly expand ("popcorn effect"), causing internal delamination or cracking of the LED package. Baking removes this absorbed moisture.

8.3 Can I drive this LED at 20mA continuously?

Yes. The absolute maximum continuous forward current is 30mA. Operating at 20mA is within specification. However, you must ensure the power dissipation (V_F * I_F) does not exceed 72mW. At a typical V_F of 2.0V and I_F=20mA, power is 40mW, which is acceptable.

8.4 How do I interpret the luminous intensity bin code?

The packing bag is marked with an I_V classification code. This code corresponds to the measured luminous intensity bin for the LEDs in that bag (e.g., a code indicating the 8-12 mcd bin). Designers should specify the required bin or be prepared for intensity variations if mixing parts from different batches.