T34 Series Dual Chip 0.5W White LED Datasheet - 3.0x2.0mm - 6.0V - 0.5W - English Technical Documentation

1. Product Overview

The T34 series represents a high-performance, surface-mount white LED designed for applications requiring reliable and efficient illumination. This product utilizes a dual-chip series configuration within a compact 3020 package (3.0mm x 2.0mm footprint), delivering a nominal power of 0.5W. The series is engineered to offer a balance of luminous output, thermal management, and longevity, making it suitable for a variety of lighting solutions including backlighting, indicator lights, and general decorative lighting. Its design focuses on stable performance under specified electrical and environmental conditions.

2. Technical Parameters and Specifications

2.1 Absolute Maximum Ratings (T_s=25°C)

The following parameters define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Forward Current (I_F): 90 mA (DC)
• Forward Pulse Current (I_FP): 160 mA (Pulse width ≤10ms, Duty cycle ≤1/10)
• Power Dissipation (P_D): 612 mW
• Operating Temperature (T_opr): -40°C to +80°C
• Storage Temperature (T_stg): -40°C to +80°C
• Junction Temperature (T_j): 125°C
• Soldering Temperature (T_sld): Reflow soldering at 230°C or 260°C for 10 seconds maximum.

2.2 Electro-Optical Characteristics (T_s=25°C)

Typical performance parameters measured under standard test conditions.

• Forward Voltage (V_F): Typical 6.0V, Maximum 6.8V (at I_F=80mA)
• Reverse Voltage (V_R): 5V
• Reverse Current (I_R): Maximum 10 µA
• Viewing Angle (2θ_1/2): 110° (typical, without lens)

3. Binning and Classification System

3.1 Model Numbering Rule

The product model follows a structured code: T □□ □□ □ □ □ – □□□ □□. This code defines key attributes:

• Package Code (e.g., '34'): Denotes the 3020 form factor.
• Chip Count Code: '2' indicates a dual-chip configuration.
• Optics Code: '00' for no primary lens, '01' for with lens.
• Color Code: L (Warm White, <3700K), C (Neutral White, 3700-5000K), W (Cool White, >5000K).
• Luminous Flux Code: A multi-character code specifying the minimum luminous flux bin (e.g., E6, E7, E8).
• Forward Voltage Code: C (5.5-6.0V), D (6.0-6.5V), E (6.5-7.0V).

3.2 Correlated Color Temperature (CCT) Binning

Standard ordering CCT bins are defined with their corresponding chromaticity regions (Ellipse MacAdam steps).

• 2725K ±145K (27M5, 5-step MacAdam ellipse)
• 3045K ±175K (30M5, 5-step MacAdam ellipse)
• 3985K ±275K (40M5, 5-step MacAdam ellipse)
• 5028K ±283K (50M5, 5-step MacAdam ellipse)
• 5665K ±355K (57M7, 7-step MacAdam ellipse)
• 6530K ±510K (65M7, 7-step MacAdam ellipse)

Note: Shipments adhere to the ordered CCT's specified chromaticity region. Luminous flux is specified as a minimum value; actual flux may be higher.

3.3 Luminous Flux Binning

Flux is binned based on CCT and Color Rendering Index (CRI). The table specifies minimum luminous flux values at I_F=80mA. For example, a Warm White (2700-3700K) LED with CRI≥70 in bin E6 has a minimum flux of 50 lm and a typical maximum of 54 lm. Similar bins (E7, E8, E9) exist for Neutral White and Cool White variants, with corresponding bins for high-CRI (≥80) versions.

3.4 Forward Voltage Binning

Forward voltage is classified into three bins to aid in circuit design for current regulation.

• Code C: 5.5V to 6.0V
• Code D: 6.0V to 6.5V
• Code E: 6.5V to 7.0V

Tolerances: Luminous flux ±7%, Forward voltage ±0.08V, CRI ±2, Chromaticity coordinates ±0.005.

4. Mechanical and Package Information

4.1 Outline Dimensions

The LED is housed in a standard 3020 surface-mount package. The dimensional drawing shows a top-view outline with key measurements. Critical tolerances are specified: dimensions noted as .X are ±0.1mm, and .XX are ±0.05mm.

4.2 Pad Pattern and Stencil Design

Separate diagrams are provided for the recommended PCB land pattern (pad layout) and the solder paste stencil opening design. Adherence to these layouts is crucial for achieving proper solder joint formation, thermal transfer, and mechanical stability during reflow. The anode and cathode pads are clearly marked for polarity identification.

5. Performance Characteristics and Curves

5.1 Forward Current vs. Forward Voltage (I-V Curve)

The characteristic curve shows the relationship between forward current and forward voltage. For the dual-chip series design, the typical V_F is around 6.0V at the nominal 80mA drive current. The curve is essential for designing the appropriate current-limiting circuitry, which is mandatory for LED operation.

5.2 Relative Luminous Flux vs. Forward Current

This graph illustrates how light output increases with drive current. While output rises with current, efficiency typically decreases at higher currents due to increased thermal effects. Operating at or below the recommended 80mA ensures optimal efficacy and longevity.

5.3 Spectral Power Distribution

The relative spectral energy distribution curve is provided for different CCT ranges (2600-3700K, 3700-5000K, 5000-10000K). These curves show the intensity of light emitted at each wavelength, defining the color quality and CRI of the LED. Cool white LEDs exhibit more energy in the blue region, while warm white LEDs have more energy in the red/yellow region.

5.4 Junction Temperature vs. Relative Spectral Energy

This curve demonstrates the effect of junction temperature on the LED's spectrum. As temperature increases, the peak wavelength may shift slightly, and the overall spectral output can change, potentially affecting color point and lumen maintenance. Proper thermal management is critical to minimize this shift.

6. Application Guidelines and Handling

6.1 Moisture Sensitivity and Baking

The T34 series LED is classified as moisture-sensitive according to IPC/JEDEC J-STD-020C. Exposure to ambient humidity after opening the moisture barrier bag can lead to package cracking during reflow soldering.

• Storage: Unopened bags should be stored below 30°C/85% RH. After opening, store below 30°C/60% RH.
• Baking Requirement: LEDs that have been removed from the original sealed bag and not yet soldered must be baked before reflow.
• Baking Method: Bake at 60°C for 24 hours on the original reel. Do not exceed 60°C. Reflow should occur within one hour after baking, or the parts must be stored in a dry cabinet (<20% RH).
• Humidity Indicator Card: Check the card inside the bag immediately upon opening to determine if baking is required.

6.2 Soldering Recommendations

Reflow soldering is the recommended assembly method. The maximum soldering temperature profile is specified: 230°C or 260°C peak temperature for a maximum of 10 seconds. It is critical to follow a controlled temperature profile to prevent thermal shock and damage to the LED die, phosphor, and package. Manual soldering with an iron is not recommended due to the risk of localized overheating.

6.3 Circuit Design Considerations

Due to the series dual-chip design and the resulting higher forward voltage (~6V), standard 3V or 3.3V logic supplies are insufficient. A dedicated LED driver or current regulator capable of providing a voltage above the maximum V_F (up to 7.0V) at the required constant current (e.g., 80mA) is necessary. Always design with the maximum V_F from the binning table to ensure proper operation across all units. Adequate PCB thermal design, including thermal vias and copper pours connected to the cathode pad, is essential to dissipate heat and maintain low junction temperature.

7. Typical Applications and Use Cases

The T34 series 0.5W LED is well-suited for applications requiring a compact, bright light source with good color consistency.

• Backlighting: Edge-lit or direct-lit backlight units for small to medium displays, control panels, and signage.
• Decorative Lighting: Accent lighting, contour lighting, and mood lighting where consistent white light is desired.
• Indicator and Status Lights: High-brightness status indicators in industrial equipment, consumer electronics, or automotive interiors.
• Portable Lighting: Integrated into compact flashlights or task lights, leveraging its efficiency and small size.

When designing for these applications, consider the drive current, thermal path, optical requirements (lens, diffuser), and the need for consistent color (specifying tight CCT and flux bins).

8. Technical Comparison and Product Differentiation

The T34 series offers specific advantages within the 0.5W LED category:

• Dual-Chip Series Design: Compared to a single 0.5W die, the dual-chip approach can offer different phosphor application options and potentially more uniform light emission from the package. The series connection simplifies driving from a slightly higher voltage source compared to parallel configurations which require precise current balancing.
• 3020 Package: Provides a slightly larger thermal pad area than smaller packages like 2835 or 3014 for its power level, aiding in heat dissipation. Its footprint is a common industry standard, facilitating PCB design and sourcing of compatible optics.
• Comprehensive Binning: The availability of detailed CCT (including 5-step and 7-step MacAdam ellipses), flux, and voltage bins allows for precise color matching and electrical performance prediction in volume production, reducing the need for circuit adjustments on the production line.

9. Frequently Asked Questions (FAQ)

9.1 Why is the forward voltage around 6V for a 0.5W LED?

This is due to the internal series connection of two LED chips. Each chip has a typical forward voltage of around 3.0V to 3.4V. When connected in series, the voltages add up, resulting in the ~6V total. This requires a compatible power supply.

9.2 Is a constant current driver mandatory?

Yes. LEDs are current-driven devices. Their light output is proportional to current, not voltage. A constant current driver ensures stable brightness and protects the LED from thermal runaway, which can occur if driven by a constant voltage source without adequate series resistance.

9.3 Can I drive this LED at higher than 80mA for more light?

While possible, it is not recommended for reliable long-term operation. Exceeding the nominal current increases junction temperature, which accelerates lumen depreciation (light output decrease over time) and can significantly reduce the LED's lifespan. Always refer to the Absolute Maximum Ratings.

9.4 How critical is the PCB thermal design?

Very critical. The 0.5W of electrical power is mostly converted to heat. An effective thermal path from the LED's thermal pad (typically the cathode) through the PCB to the ambient environment is essential to keep the junction temperature low. High junction temperature is the primary cause of LED failure and performance degradation.

9.5 What does the 'Luminous Flux Code' (e.g., E7) mean?

This is a binning code that specifies a range of minimum luminous flux. For a given CCT and CRI, an E7 bin guarantees a minimum flux (e.g., 54 lm for some types) and typically implies a maximum value (e.g., 58 lm). It allows designers to select LEDs that meet their minimum brightness requirements.