T-1 3mm Through Hole LED Lamp Data Sheet - Red/Green - 2.6V - 78mW - English Technical Documentation

1. Product Overview

This document provides the complete technical specifications for a T-1 (3mm) diameter through-hole LED lamp. Designed for status indication and signaling applications, this component is available in red and green color variants with a white diffused lens. The device is characterized by its low power consumption, high efficiency, and compliance with lead-free and RoHS environmental standards. Its compact, industry-standard T-1 package makes it suitable for a wide range of electronic equipment where reliable visual feedback is required.

1.1 Core Advantages and Target Market

The primary advantages of this LED lamp include its proven reliability in through-hole packaging, excellent luminous intensity for its size, and a wide viewing angle ensuring good visibility. It is designed for flexibility, with multiple intensity and viewing angle choices theoretically available for each color. The target markets are broad, encompassing communication equipment, computer peripherals, consumer electronics, and home appliances where durable, long-life indicator lights are essential.

2. Technical Parameter Deep-Dive

A thorough understanding of the electrical and optical parameters is critical for successful circuit design and achieving desired performance.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation outside these limits is not advised. Key ratings are identical for both red and green versions: a maximum power dissipation of 78mW, a continuous DC forward current (I_F) of 30mA, and a peak forward current of 120mA under pulsed conditions (duty cycle ≤1/10, pulse width ≤10µs). The device can operate in ambient temperatures from -30°C to +85°C and be stored from -40°C to +100°C. The leads can withstand soldering at 260°C for a maximum of 5 seconds when measured 2.0mm from the LED body.

2.2 Electrical & Optical Characteristics

These parameters are measured at a standard test condition of 25°C ambient temperature and a forward current of 20mA, which serves as the standard operating point.

• Luminous Intensity (I_v): The axial light output. The typical value is 65 millicandelas (mcd) for both colors, with a minimum of 38 mcd and a maximum reaching 310 mcd, indicating a significant performance spread handled by the binning system.
• Viewing Angle (2θ_1/2): Defined as the full angle where intensity drops to half its axial value. This lamp features a very wide 120-degree viewing angle, providing excellent off-axis visibility.
• Forward Voltage (V_F): The voltage drop across the LED at 20mA. It ranges from 2.0V to 2.6V for both red and green LEDs. Designers must account for this range when calculating series resistor values.
• Peak & Dominant Wavelength: For the red LED, the peak emission wavelength (λ_P) is 660nm, and the dominant wavelength (λ_d) is 638nm. For the green LED, λ_P is 565nm, and λ_d ranges from 569nm to 574nm depending on the bin.
• Spectral Line Half-Width (Δλ): Approximately 20nm for red and 15nm for green, describing the spectral purity of the emitted light.
• Reverse Current (I_R): A maximum of 100µA at a reverse voltage of 5V. It is crucial to note that this device is not designed for reverse operation; this test condition is for characterization only.

3. Binning System Specification

To manage natural variations in semiconductor manufacturing, LEDs are sorted into performance bins. This ensures consistency within a production lot.

3.1 Luminous Intensity Binning

The luminous intensity is binned using a two-letter code (e.g., BC, DE, FG, HJ). This binning is separate for red and green LEDs. For example, bin 'BC' covers 38 to 65 mcd, while bin 'HJ' covers 180 to 310 mcd. The tolerance on each bin limit is ±15%. This system allows designers to select an intensity grade suitable for their application's brightness requirements.

3.2 Dominant Wavelength Binning (Green Only)

The green LEDs undergo additional sorting by dominant wavelength to ensure color consistency. Bins are designated as H06 (565-568nm), H07 (568-570nm), H08 (570-572nm), and H09 (572-574nm). The tolerance for each bin limit is ±1nm. This precise binning is critical in applications where specific color points or matching between multiple green LEDs is important.

4. Mechanical & Packaging Information

4.1 Outline Dimensions

The LED conforms to the standard T-1 (3mm) radial leaded package. Critical dimensions include the body diameter, lead spacing, and overall length. The lead spacing is measured where the leads emerge from the package body. Tolerances are typically ±0.25mm unless otherwise specified. A maximum resin protrusion of 1.0mm under the flange is allowed. Designers should refer to the detailed dimensional drawing in the datasheet for exact measurements when creating PCB footprints or panel cutouts.

4.2 Polarity Identification

Polarity is indicated by the lead length. The longer lead is the anode (positive), and the shorter lead is the cathode (negative). This is a standard convention for radial leaded LEDs. Additionally, the cathode side may be indicated by a flat spot on the LED lens's plastic flange.

4.3 Packing Specification

The LEDs are packaged in anti-static bags containing 500, 200, or 100 pieces. Ten of these bags are placed into an inner carton, totaling 5,000 pieces. Finally, eight inner cartons are packed into an outer shipping carton, resulting in a standard shipment lot of 40,000 pieces. It is noted that within a shipping lot, only the final pack may be a non-full pack.

5. Soldering & Assembly Guidelines

Proper handling is essential to maintain reliability and prevent damage.

5.1 Storage Conditions

For long-term storage outside the original packaging, the ambient should not exceed 30°C or 70% relative humidity. LEDs removed from their original packaging should be used within three months. For extended storage, they should be kept in a sealed container with desiccant or in a nitrogen-purged desiccator.

5.2 Lead Forming

If leads need to be bent, bending must occur at a point at least 3mm away from the base of the LED lens. The base of the lead frame must not be used as a fulcrum. All forming must be done at room temperature and before the soldering process. During PCB insertion, use the minimum clinch force necessary to avoid imposing excessive mechanical stress on the LED body.

5.3 Soldering Process

A minimum clearance of 2mm must be maintained between the base of the lens and the solder point. The lens must never be immersed in solder. No external stress should be applied to the leads while the LED is at high temperature.

• Soldering Iron: Maximum temperature 350°C, maximum time 3 seconds per lead (one time only).
• Wave Soldering: Pre-heat to a maximum of 100°C for up to 60 seconds. Solder wave temperature maximum 260°C, contact time maximum 5 seconds. The dipping position must be no lower than 2mm from the base of the epoxy lens.
• Important Note: Infrared (IR) reflow soldering is not suitable for this through-hole LED product. Excessive temperature or time can cause lens deformation or catastrophic failure.

5.4 Cleaning

If cleaning is necessary after soldering, only alcohol-based solvents like isopropyl alcohol (IPA) should be used.

6. Drive Circuit Design & Application Notes

6.1 Recommended Drive Method

LEDs are current-operated devices. To ensure uniform brightness when driving multiple LEDs in parallel, it is strongly recommended to use a individual current-limiting resistor in series with each LED. The schematic labeled 'Circuit A' in the datasheet illustrates this configuration. Attempting to drive multiple LEDs in parallel from a single resistor ('Circuit B') is discouraged, as slight variations in the forward voltage (V_F) characteristic of each LED will cause significant differences in current sharing and, consequently, uneven brightness.

6.2 Electrostatic Discharge (ESD) Protection

These LEDs are susceptible to damage from electrostatic discharge. A comprehensive ESD control program should be implemented in the handling area:

• Personnel must wear grounded wrist straps or anti-static gloves.
• All equipment, workstations, and storage racks must be properly grounded.
• An ionizer (ion blower) is recommended to neutralize static charge that may accumulate on the plastic lens due to friction during handling.
• Regular training and certification for personnel working in ESD-protected areas are essential.

6.3 Application Scope and Limitations

This LED lamp is suitable for general indicator applications in both indoor and outdoor signs, as well as ordinary electronic equipment. The wide viewing angle makes it ideal for front-panel status lights. Designers should ensure the operating point (current) stays within the absolute maximum ratings and consider the effects of ambient temperature on light output and longevity. The device is not intended for reverse bias operation or as a lighting source for illumination purposes.

7. Performance Curves & Thermal Considerations

While specific curve data points are not enumerated in the provided text, typical datasheets for such components include graphical representations crucial for design.

7.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve shows the exponential relationship between current and voltage. The curve for the red LED (with a higher wavelength) will typically have a slightly lower forward voltage for a given current compared to the green LED, though the datasheet specifies the same range for both. This curve is vital for selecting the appropriate series resistor value to achieve the desired operating current over the specified V_F range and supply voltage variations.

7.2 Luminous Intensity vs. Forward Current

This curve is generally linear over a significant range. Light output is directly proportional to forward current. However, operating above the recommended continuous current will reduce efficiency due to increased heat and may shorten the device's lifespan. The 20mA test point is a standard for comparing brightness.

7.3 Luminous Intensity vs. Ambient Temperature

LED light output decreases as the junction temperature increases. While the device operates from -30°C to +85°C, the luminous intensity will be highest at lower temperatures. For applications operating at high ambient temperatures or at high drive currents, thermal management considerations (like PCB copper area for heat sinking through the leads) may become relevant to maintain stable light output.

7.4 Spectral Distribution

The spectral output graph shows the relative intensity across wavelengths. It will peak at the specified peak wavelength (λ_P - 660nm for red, 565nm for green). The narrow spectral half-width indicates a relatively pure color emission, which is characteristic of standard indicator LEDs without phosphor conversion.

8. Technical Comparison & Design Considerations

8.1 Comparison with Surface-Mount Device (SMD) LEDs

The primary advantage of this through-hole LED is its mechanical robustness and ease of manual assembly and prototyping, making it ideal for low-volume production, hobbyist projects, or applications requiring high reliability against vibration. SMD LEDs offer a smaller footprint and are better suited for automated, high-volume PCB assembly. The T-1 package also typically allows for higher maximum power dissipation than similarly sized SMD counterparts due to its longer leads acting as heat paths.

8.2 Key Design Considerations

• Current Limiting: Always use a series resistor. Calculate its value based on the power supply voltage (V_CC), the LED's forward voltage range (V_F), and the desired forward current (I_F). Use the formula: R = (V_CC - V_F) / I_F. Choose a resistor power rating accordingly.
• Brightness Matching: For applications requiring multiple identical-looking LEDs, specify the same intensity and wavelength bin codes from the manufacturer to ensure visual consistency.
• Viewing Angle: The 120-degree viewing angle is very wide. If a more directional beam is needed, a lens with a narrower viewing angle would be required.
• Long-Term Storage: Adhere to the storage guidelines to prevent moisture absorption, which could cause 'popcorning' (package cracking) during subsequent soldering.