Table of Contents
- 1. Product Overview
- 1.1 Core Advantages and Target Market
- 2. Technical Parameter Deep Dive
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical and Optical Characteristics
- 3. Binning System Specification
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 4. Performance Curve Analysis
- 5. Mechanical and Packaging Information
- 5.1 Outline Dimensions
- 5.2 Polarity Identification
- 5.3 Packing Specifications
- 6. Soldering and Assembly Guidelines
- 6.1 Storage
- 6.2 Cleaning
- 6.3 Lead Forming
- 6.4 Soldering Process
- 7. Application and Design Recommendations
- 7.1 Drive Circuit Design
- 7.2 Electrostatic Discharge (ESD) Protection
- 7.3 Thermal Management
- 8. Technical Comparison and Considerations
- 9. Frequently Asked Questions (Based on Technical Parameters)
- 10. Practical Application Example
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This document details the specifications for a 4mm oval through-hole LED lamp. This component is designed as a popular, cost-effective solution for applications requiring a uniform viewing angle and high luminous output. Its primary design focus is on reliability and efficiency for both indoor and outdoor use.
1.1 Core Advantages and Target Market
The lamp features a smooth, uniform radiation pattern characterized by a typical viewing angle of 110x50 degrees. This makes it particularly suitable for applications where consistent light distribution is critical from various angles. The device utilizes advanced epoxy technology, which provides good moisture resistance and UV protection. This enhances its durability and makes it suitable for long-term exposure in outdoor environments, reducing performance degradation over time. Key target markets and applications include full-color signboards, billboard signs, message displays, bus signs, and general use in communication, computer, consumer electronics, and home appliance sectors.
2. Technical Parameter Deep Dive
This section provides a detailed, objective interpretation of the electrical, optical, and thermal characteristics defined in the datasheet.
2.1 Absolute Maximum Ratings
The absolute maximum ratings define the limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.
- Power Dissipation (Pd): 75 mW maximum. This is the total power the LED package can dissipate as heat.
- Peak Forward Current (IF(PEAK)): 90 mA, but only under strict conditions (duty cycle ≤ 1/10, pulse width ≤ 10μs). This rating is for short pulses, not continuous operation.
- DC Forward Current (IF): 30 mA continuous. This is the recommended maximum current for reliable, long-term operation.
- Derating: The DC forward current must be linearly derated by 0.36 mA for every degree Celsius above 30°C ambient temperature (TA). For example, at 85°C, the maximum allowable continuous current is significantly lower than 30mA.
- Operating Temperature Range (Topr): -40°C to +85°C.
- Storage Temperature Range (Tstg): -40°C to +100°C.
- Lead Soldering Temperature: 260°C maximum for 5 seconds, measured 2.0mm from the LED body.
2.2 Electrical and Optical Characteristics
These parameters are measured at a standard test condition of TA=25°C and IF=20mA, unless otherwise noted.
- Luminous Intensity (IV): Ranges from a minimum of 520 mcd to a typical maximum of 1500 mcd. The actual value for a specific unit is determined by its bin code (see Section 4). The measurement includes a ±15% testing tolerance.
- Viewing Angle (2θ1/2): 110 x 50 degrees (oval pattern). The angle is defined where luminous intensity drops to half its axial value, measured with a ±2-degree tolerance.
- Peak Emission Wavelength (λP): Typically 631 nm. This is the wavelength at which the spectral power distribution is highest.
- Dominant Wavelength (λd): Ranges from 617 nm to 629 nm, binned into specific codes (H28, H29, H30). This is the single wavelength perceived by the human eye that defines the color (red).
- Spectral Line Half-Width (Δλ): Approximately 20 nm. This indicates the spectral purity of the red light.
- Forward Voltage (VF): Ranges from 1.8V (min) to 2.5V (max), with a typical value of 2.1V at 20mA.
- Reverse Current (IR): Maximum 100 μA at a reverse voltage (VR) of 5V. Critical Note: The device is not designed for reverse operation; this test condition is for characterization only.
3. Binning System Specification
The product is classified into bins based on key performance parameters to ensure consistency within an application.
3.1 Luminous Intensity Binning
At IF=20mA, LEDs are sorted into four intensity bins. The tolerance for each bin limit is ±15%.
- Bin M: 520 mcd (Min) to 680 mcd (Max)
- Bin N: 680 mcd to 880 mcd
- Bin P: 880 mcd to 1150 mcd
- Bin Q: 1150 mcd to 1500 mcd
3.2 Dominant Wavelength Binning
At IF=20mA, LEDs are sorted into three wavelength bins to control color consistency. The tolerance for each bin limit is ±1 nm.
- Bin H28: 617.0 nm to 621.0 nm
- Bin H29: 621.0 nm to 625.0 nm
- Bin H30: 625.0 nm to 629.0 nm
The intensity classification code (Iv bin) is marked on each packing bag for traceability.
4. Performance Curve Analysis
The datasheet references typical characteristic curves which are essential for design. While not displayed here, they typically include:
- Relative Luminous Intensity vs. Forward Current (I-V Curve): Shows how light output increases with current, up to the maximum rated limits.
- Relative Luminous Intensity vs. Ambient Temperature: Demonstrates the derating of light output as junction temperature increases.
- Forward Voltage vs. Forward Current: Illustrates the nonlinear relationship, important for calculating series resistor values and power dissipation.
- Spectral Distribution: A graph showing the relative power emitted across wavelengths, centered around the peak wavelength of 631 nm.
Designers should consult these curves to understand performance under non-standard conditions (e.g., different drive currents or temperatures).
5. Mechanical and Packaging Information
5.1 Outline Dimensions
The lamp has a popular T-1 (3mm) diameter package with a 4mm oval lens. Key dimensional notes include:
- All dimensions are in millimeters (inches provided in tolerance).
- General tolerance is ±0.25mm unless specified otherwise.
- Maximum resin protrusion under the flange is 1.0mm.
- Lead spacing is measured where leads emerge from the package body.
5.2 Polarity Identification
For through-hole LEDs, the cathode is typically identified by a flat spot on the lens rim, a shorter lead, or other marking. The specific identification method should be verified from the dimensional drawing. Correct polarity is essential for operation.
5.3 Packing Specifications
The LEDs are packaged for bulk handling:
- Unit Pack: 1000, 500, or 250 pieces per anti-static packing bag.
- Inner Carton: Contains 8 packing bags, totaling 8000 pieces.
- Outer Carton: Contains 8 inner cartons, totaling 64,000 pieces.
- In every shipping lot, only the last pack may be non-full.
6. Soldering and Assembly Guidelines
Proper handling is critical to prevent damage.
6.1 Storage
For extended storage outside the original packaging (beyond 3 months), store in a sealed container with desiccant or in a nitrogen ambient. Storage should not exceed 30°C and 70% relative humidity.
6.2 Cleaning
Use alcohol-based solvents like isopropyl alcohol if cleaning is necessary.
6.3 Lead Forming
Bend leads at a point at least 3mm from the base of the LED lens. Do not use the lens base as a fulcrum. Perform forming before soldering at room temperature. Use minimal clinch force during PCB assembly.
6.4 Soldering Process
Critical Rule: Maintain a minimum clearance of 2mm from the base of the lens to the solder point. Never immerse the lens in solder.
- Soldering Iron: Max temperature 350°C, max time 3 seconds (one time only).
- Wave Soldering: Pre-heat to max 100°C for up to 60 seconds. Solder wave at max 260°C for up to 5 seconds.
- Important: IR reflow is NOT suitable for this through-hole type LED product. Excessive heat or time can cause lens deformation or catastrophic failure.
7. Application and Design Recommendations
7.1 Drive Circuit Design
LEDs are current-operated devices. To ensure uniform brightness when connecting multiple LEDs in parallel, it is strongly recommended to use a current-limiting resistor in series with each LED (Circuit A). Driving multiple LEDs in parallel directly from a voltage source (Circuit B) is not recommended due to variations in individual LED forward voltage (VF), which will cause significant differences in current and, therefore, brightness.
The series resistor value (Rs) can be calculated using Ohm's Law: Rs = (Vsupply - VF) / IF. Use the maximum VF from the datasheet (2.5V) to ensure the current does not exceed the desired IF (e.g., 20mA) under all conditions.
7.2 Electrostatic Discharge (ESD) Protection
These devices are sensitive to electrostatic discharge. Preventive measures must be implemented:
- Operators must wear grounded wrist straps or anti-static gloves.
- All equipment, worktables, and storage racks must be properly grounded.
- Use an ion blower to neutralize static charge that may build up on the plastic lens.
- Maintain training and certification records for personnel in ESD-protected areas.
7.3 Thermal Management
While the power dissipation is low (75mW max), adhering to the derating curve for forward current is essential for longevity, especially in high ambient temperature environments or enclosed spaces. Ensure adequate ventilation if multiple LEDs are used in a dense array.
8. Technical Comparison and Considerations
Compared to non-diffused or narrower-angle LEDs, this component's key differentiator is its oval, wide (110x50°), and uniform viewing angle, making it ideal for signage where visibility from oblique angles is important. The use of diffused red lens and moisture-resistant epoxy offers a balance of performance and environmental robustness suitable for cost-sensitive outdoor applications. Designers comparing options should focus on the specific luminous intensity bin required for their application's brightness needs and the dominant wavelength bin for color consistency across multiple units.
9. Frequently Asked Questions (Based on Technical Parameters)
Q1: Can I drive this LED at 30mA continuously?
A1: The absolute maximum DC forward current is 30mA at 25°C. However, for reliable operation and longer lifetime, it is advisable to operate below this maximum, typically at 20mA as per the test conditions. Furthermore, the current must be derated for ambient temperatures above 30°C.
Q2: Why is there a ±15% tolerance on the luminous intensity bin limits?
A2: This accounts for measurement variability during production testing. It means a unit from Bin M (520-680mcd) could test as low as 442mcd (520 -15%) or as high as 782mcd (680 +15%) under the same test conditions, though it will be classified and marked according to its nominal bin.
Q3: Can I use this LED with a 5V supply?
A3: Yes, but you MUST use a series current-limiting resistor. For example, to achieve ~20mA with a typical VF of 2.1V: R = (5V - 2.1V) / 0.020A = 145 Ohms. A standard 150 Ohm resistor would be appropriate. Always calculate using the maximum VF to ensure current does not exceed the desired limit.
Q4: Is this LED suitable for automotive applications?
A4: The operating temperature range (-40°C to +85°C) covers many automotive environments. However, automotive applications typically require components to meet specific quality and reliability standards (e.g., AEC-Q102) which are not specified in this generic datasheet. Further qualification would be necessary.
10. Practical Application Example
Scenario: Designing a simple "ON" indicator for a device powered by a 12V DC wall adapter.
- Goal: Drive one LED at approximately 15mA for a balance of brightness and longevity.
- Calculation: Using the maximum VF of 2.5V for safety. Rs = (12V - 2.5V) / 0.015A = 633 Ohms. The nearest standard value is 620 Ohms.
- Recalculation: Actual current with 620Ω and typical VF of 2.1V: IF = (12V - 2.1V) / 620Ω ≈ 16.0mA. This is within a safe range.
- Power in Resistor: P = I2 * R = (0.016)2 * 620 ≈ 0.16W. Use at least a 1/4W (0.25W) resistor.
- Assembly: Insert LED into PCB, respecting polarity. Bend leads 3mm from body if needed. Solder, keeping the iron tip >2mm from the lens base for <3 seconds at 350°C.
This example highlights the importance of current limiting, component selection, and proper soldering technique.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |