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LTL-R14FGFAJ Through Hole LED Lamp Datasheet - T-1 Package - Orange/Yellow Green - 20mA - 52mW - English Technical Documentation

Complete technical datasheet for the LTL-R14FGFAJ through-hole LED lamp. Includes specifications for Orange and Yellow Green variants, absolute maximum ratings, electrical/optical characteristics, binning tables, and application guidelines.
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PDF Document Cover - LTL-R14FGFAJ Through Hole LED Lamp Datasheet - T-1 Package - Orange/Yellow Green - 20mA - 52mW - English Technical Documentation

1. Product Overview

This document details the specifications for the LTL-R14FGFAJ, a through-hole LED lamp designed for status indication and signaling applications. The device is offered in two distinct color variants: Orange and Yellow Green, utilizing AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor technology for high efficiency and reliable performance. The LED is housed in a standard T-1 type package with a white diffused lens, providing a wide viewing angle suitable for various electronic equipment.

1.1 Core Features and Advantages

1.2 Target Applications and Markets

This LED is versatile and finds use across multiple industries requiring clear, reliable visual indicators. Primary application areas include:

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

2.2 Electrical and Optical Characteristics

These parameters are measured at an ambient temperature (TA) of 25°C and define the typical performance of the device.

3. Binning System Specification

To ensure color and brightness consistency in production, LEDs are sorted into bins. The LTL-R14FGFAJ uses a two-dimensional binning system.

3.1 Luminous Intensity Binning

Both Orange and Yellow Green LEDs are grouped into three intensity bins (AB, CD, EF), each with a defined minimum and maximum luminous intensity measured at 20mA. Tolerance for each bin limit is ±30%.

3.2 Dominant Wavelength Binning

LEDs are also binned by their dominant wavelength to control color consistency. Tolerance for each bin limit is ±1 nm.

When ordering, a complete part number specifying both intensity and wavelength bins is typically required to guarantee specific performance characteristics.

4. Mechanical and Packaging Information

4.1 Outline Dimensions

The LED conforms to the standard T-1 (3mm) radial leaded package. Key dimensional notes include:

4.2 Polarity Identification

The cathode (negative lead) is typically identified by a flat spot on the LED lens rim and/or by being the shorter lead. Always refer to the manufacturer's marking diagram for confirmation before assembly.

4.3 Packing Specification

The LEDs are packed in anti-static bags to prevent ESD damage. Standard packing quantities are:

5. Assembly, Soldering, and Handling Guidelines

5.1 Storage Conditions

For long-term reliability, store LEDs in an environment not exceeding 30°C and 70% relative humidity. If removed from the original sealed, moisture-barrier bag, use within three months. For extended storage outside the original packaging, use a sealed container with desiccant or a nitrogen-filled desiccator.

5.2 Lead Forming and PCB Assembly

5.3 Soldering Recommendations

Maintain a minimum distance of 2mm from the base of the lens to the solder point. Never immerse the lens in solder.

Warning: Excessive temperature or time can deform the lens or cause catastrophic LED failure.

5.4 Electrostatic Discharge (ESD) Protection

AlInGaP LEDs are sensitive to electrostatic discharge. Always:

6. Drive Circuit Design and Application Notes

6.1 Recommended Drive Method

LEDs are current-driven devices. To ensure uniform brightness, especially when multiple LEDs are used in parallel, it is strongly recommended to drive each LED with its own current-limiting resistor connected in series (Circuit A).

Avoid connecting LEDs directly in parallel without individual resistors (Circuit B), as small variations in their forward voltage (VF) characteristics will cause significant differences in current sharing and, consequently, uneven brightness.

6.2 Series Resistor Calculation

The value of the current-limiting resistor (RS) is calculated using Ohm's Law: RS = (VSupply - VF) / IF

Where:

Example: For a 5V supply: RS = (5V - 2.6V) / 0.020A = 120 Ω. The nearest standard value (e.g., 120Ω or 150Ω) can be used, adjusting the current slightly.

6.3 Thermal Considerations

While the power dissipation is low (52mW), ensuring adequate spacing between LEDs on a PCB and avoiding placement near other heat-generating components will help maintain optimal light output and longevity, especially when operating at the upper end of the temperature range.

7. Performance Curves and Typical Characteristics

While specific graphs are not detailed in the provided text, typical performance curves for such LEDs would include:

Designers should consult the full datasheet from the manufacturer for these graphical representations to make informed design decisions regarding drive current, thermal management, and optical design.

8. Comparison and Selection Guidance

8.1 Orange vs. Yellow Green Selection

8.2 Key Differentiators of AlInGaP Technology

Compared to older technologies like standard GaP (Gallium Phosphide), AlInGaP LEDs used in this product offer:

9. Frequently Asked Questions (FAQs)

Q: Can I drive this LED at 30mA for more brightness?
A: No. The absolute maximum continuous forward current is 20mA. Exceeding this rating will drastically reduce the LED's lifespan and may cause immediate failure due to overheating.

Q: Why is a series resistor necessary even with a constant current source?
A> A true constant current source does not require a series resistor for current regulation. However, in most practical applications using voltage sources (like a 5V or 3.3V rail), a series resistor is the simplest and most cost-effective method to set and limit the current through the LED.

Q: What does the ±30% tolerance on luminous intensity bins mean?
A> It means that the actual tested intensity of an LED labeled in a specific bin (e.g., EF: 85-140 mcd) could be up to 30% higher or lower than the stated bin limits. This is a test tolerance, not a production spread. The binning process itself sorts LEDs into these ranges.

Q: Is this LED suitable for outdoor use?
A> The datasheet states it is good for indoor and outdoor signs. However, for prolonged outdoor exposure, additional design considerations are needed, such as conformal coating on the PCB to protect against moisture and UV-resistant lens material (which this white diffused lens may provide). Verify specific environmental ratings with the manufacturer for critical applications.

Q: How do I identify the anode and cathode?
A> Typically, the cathode (negative) lead is shorter and may be marked by a flat edge on the LED's plastic flange. Always check the manufacturer's datasheet diagram for the specific marking scheme.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.