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LTL-R14FGSAJ LED Lamp Datasheet - T-1 Package - 2.0V Typ - 20mA - Yellow Green/Yellow - English Technical Document

Complete technical datasheet for the LTL-R14FGSAJ through-hole LED lamp. Includes specifications for Yellow Green and Yellow variants, electrical/optical characteristics, absolute maximum ratings, binning tables, and application guidelines.
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PDF Document Cover - LTL-R14FGSAJ LED Lamp Datasheet - T-1 Package - 2.0V Typ - 20mA - Yellow Green/Yellow - English Technical Document

1. Product Overview

This document details the specifications for the LTL-R14FGSAJ, a through-hole LED lamp. Through-hole LEDs are offered in a variety of packages such as 3 mm, 4mm, 5mm, rectangular, and cylinder which are suitable for all applications requiring status indication. Several intensity and viewing angle choices are available in each color for design flexibility.

1.1 Features

1.2 Applications

2. Outline Dimensions

The LED features a standard T-1 (3mm) package with a white diffused lens. The leads are designed for through-hole mounting on printed circuit boards (PCBs).

Notes:

  1. All dimensions are in millimeters (inches).
  2. Tolerance is ±0.25mm (.010") unless otherwise noted.
  3. Protruded resin under flange is 1.0mm (.04") max.
  4. Lead spacing is measured where the leads emerge from the package.
  5. Specifications are subject to change without notice.

3. Absolute Maximum Ratings

Ratings are specified at an ambient temperature (TA) of 25°C. Exceeding these values may cause permanent damage to the device.

Parameter Yellow Green Yellow Unit
Power Dissipation 52 52 mW
Peak Forward Current (Duty Cycle ≤1/10, Pulse Width ≤10 μs) 60 60 mA
DC Forward Current 20 20 mA
Operating Temperature Range -40°C to +85°C
Storage Temperature Range -40°C to +100°C
Lead Soldering Temperature [2.0mm (.079") From Body] 260°C for 5 Seconds Max.

4. Electrical / Optical Characteristics

Characteristics are measured at an ambient temperature (TA) of 25°C.

Parameter Symbol Color Min. Typ. Max. Unit Test Condition
Luminous Intensity Iv Yellow Green 4 11 29 mcd IF = 10mA
Yellow 4 11 29 mcd IF = 10mA
Viewing Angle 2 θ1/2 Yellow Green 110 deg
Yellow 110 deg
Peak Emission Wavelength λP Yellow Green 574 nm
Yellow 590 nm
Dominant Wavelength λd Yellow Green 565 569 572 nm
Yellow 582 590 594 nm
Spectral Line Half-Width Δλ Yellow Green 20 nm
Yellow 20 nm
Forward Voltage VF Yellow Green 1.6 2.0 2.5 V IF = 10mA
Yellow 1.6 2.0 2.5 V IF = 10mA
Reverse Current IR Yellow Green 10 μA VR = 5V
Yellow 10 μA VR = 5V

NOTES:

  1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve.
  2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
  3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.
  4. Iv guarantee must be included with ±30% testing tolerance.
  5. Reverse voltage (VR) condition is applied for IR test only. The device is not designed for reverse operation.
  6. Reverse current is controlled by dice source.

5. Typical Electrical / Optical Characteristics Curves

The datasheet includes typical performance curves measured at 25°C ambient temperature unless otherwise noted. These curves graphically represent the relationship between forward current (IF) and luminous intensity (Iv), forward voltage (VF), and the impact of ambient temperature on luminous intensity. Analyzing these curves is crucial for understanding the LED's behavior under different operating conditions, allowing designers to optimize drive current for desired brightness while managing power dissipation and thermal effects.

6. Binning System Specification

The LEDs are sorted into bins based on luminous intensity and dominant wavelength to ensure color and brightness consistency within an application.

6.1 Luminous Intensity Binning

Bin Code Luminous Intensity (Yellow Green) Min. (mcd) Max. (mcd) Bin Code Luminous Intensity (Yellow) Min. (mcd) Max. (mcd)
A 4 13 A 4 13
B 13 29 B 13 29

Note: Tolerance of each bin limit is ±30%.

6.2 Dominant Wavelength Binning

Bin Code Dominant Wavelength (Yellow Green) Min. (nm) Max. (nm) Bin Code Dominant Wavelength (Yellow) Min. (nm) Max. (nm)
1 565 569 1 582 588
2 569 572 2 588 594

Note: Tolerance of each bin limit is ±1nm.

7. Packaging Specification

The LEDs are packaged for bulk handling and shipping:

8. Cautions and Application Guidelines

8.1 Application

This LED lamp is suitable for application in indoor and outdoor signs, as well as ordinary electronic equipment requiring status indication.

8.2 Storage

The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.

8.3 Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.

8.4 Lead Forming & Assembly

During lead forming, the leads should be bent at a point at least 3mm from the base of the LED lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use the minimum clinch force possible to avoid excessive mechanical stress on the package.

8.5 Soldering

When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.

Recommended soldering conditions:

Soldering Iron: Temperature: 350°C Max. Soldering time: 3 seconds Max. (one time only). Position: No closer than 2mm from the base of the epoxy bulb.

Wave Soldering: Pre-heat: 100°C Max. Pre-heat time: 60 seconds Max. Solder wave: 260°C Max. Soldering time: 5 seconds Max. Dipping Position: No lower than 2mm from the base of the epoxy bulb.

Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED. IR reflow is not a suitable process for through-hole type LED lamp products.

8.6 Drive Method

An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is strongly recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED. Driving LEDs directly from a voltage source without a series resistor (connecting multiple LEDs in parallel) is not recommended, as the brightness of each LED might appear different due to the natural variations in the forward voltage (I-V) characteristics of individual LEDs. The series resistor stabilizes the current through each LED, ensuring consistent brightness and protecting the LED from current spikes.

8.7 ESD (Electrostatic Discharge) Protection

Static electricity or power surge can damage the LED. Suggestions to prevent ESD damage include:

9. Technical Analysis and Design Considerations

9.1 Photometric and Colorimetric Analysis

The LTL-R14FGSAJ uses AlInGaP (Aluminum Indium Gallium Phosphide) technology for its Yellow Green and Yellow emissions. AlInGaP LEDs are known for their high efficiency and good color purity in the amber to red spectrum. The white diffused lens serves to widen the viewing angle to a typical 110 degrees and softens the appearance of the light point, making it ideal for status indicators where wide-angle visibility is desired. The dominant wavelength bins ensure color consistency, which is critical in applications where multiple LEDs are used together and must match visually.

9.2 Thermal Management Considerations

With a maximum power dissipation of 52mW and a DC forward current of 20mA, thermal management is generally straightforward for these indicators. However, designers must consider the operating temperature range (-40°C to +85°C). At higher ambient temperatures, the luminous output will decrease, and the forward voltage will also shift slightly. For applications operating consistently at high temperatures, derating the forward current may be necessary to maintain long-term reliability. The absolute maximum rating for lead soldering temperature (260°C for 5 seconds) provides clear guidelines for PCB assembly processes.

9.3 Circuit Design Implementation

The typical forward voltage (VF) of 2.0V at 10mA is a key parameter for circuit design. To calculate the required series resistor (R_s) when powering the LED from a supply voltage (V_supply), use Ohm's Law: R_s = (V_supply - VF) / I_F. For example, with a 5V supply and a target current of 10mA: R_s = (5V - 2.0V) / 0.01A = 300 Ohms. The power rating of the resistor should be at least P = I_F^2 * R_s = (0.01)^2 * 300 = 0.03W, so a standard 1/8W or 1/10W resistor is sufficient. This simple current-limiting circuit is essential for stable operation and longevity.

9.4 Comparison with Alternative Technologies

Compared to older GaAsP (Gallium Arsenide Phosphide) yellow LEDs, AlInGaP technology offers significantly higher luminous efficiency, resulting in brighter output for the same drive current. The wide 110-degree viewing angle provided by the diffused lens is a distinct advantage over clear-lens LEDs that have narrower viewing angles, making the LTL-R14FGSAJ better suited for applications where the indicator needs to be seen from various angles. The through-hole package offers mechanical robustness and ease of manual assembly or prototyping compared to surface-mount device (SMD) alternatives, though SMDs save board space in high-volume automated production.

9.5 Application-Specific Recommendations

For communication equipment (routers, modems), these LEDs provide clear link/activity status. In consumer electronics and home appliances (power buttons, mode indicators), the diffused light is aesthetically pleasing. When used in outdoor signage, designers must ensure the housing provides adequate environmental protection (IP rating) as the LED itself is not waterproof. For battery-powered devices, the low forward voltage and ability to operate effectively at currents below 10mA (refer to the IV curve) help conserve energy. When designing panels with multiple indicators, specifying LEDs from the same intensity and wavelength bin is crucial for a uniform appearance.

9.6 Reliability and Lifespan Factors

The lifespan of an LED is primarily determined by operating conditions, especially junction temperature. Adhering to the absolute maximum ratings for current and temperature is paramount. The storage guidelines prevent moisture absorption, which could lead to "popcorning" or delamination during soldering. Proper ESD handling prevents latent defects that may cause premature failure. By following the soldering, driving, and handling guidelines in this datasheet, the LED can achieve its intended operational lifetime, which is typically tens of thousands of hours for indicator applications.

10. Frequently Asked Questions (FAQs)

Q: Can I drive this LED at its maximum DC current of 20mA continuously?
A: Yes, but only within the specified operating temperature range. For maximum reliability, especially in high ambient temperatures, operating at a lower current (e.g., 10-15mA) is recommended, as it reduces internal heating and stress on the device.

Q: What is the difference between Peak Wavelength (λP) and Dominant Wavelength (λd)?
A: Peak Wavelength is the wavelength at which the emitted optical power is maximum. Dominant Wavelength is the single wavelength perceived by the human eye that best represents the color of the light, calculated from the CIE chromaticity coordinates. λd is more relevant for color specification.

Q: Why is a series resistor mandatory?
A: LEDs have an exponential I-V relationship. A small increase in voltage causes a large increase in current, which can quickly exceed the maximum rating and destroy the LED. A series resistor makes the current primarily dependent on the resistor value and supply voltage, providing a simple and effective form of current regulation.

Q: Can I use this LED for backlighting a small panel?
A: While possible, its wide viewing angle and diffused lens make it better suited for direct viewing as a status indicator. For even panel backlighting, LEDs with a narrower viewing angle or side-view packages are often more appropriate.

Q: How do I interpret the binning codes when ordering?
A: Specify the desired combination of Luminous Intensity Bin (e.g., A or B) and Dominant Wavelength Bin (e.g., 1 or 2) for the required color (Yellow Green or Yellow) to ensure you receive LEDs with consistent performance characteristics for your application.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.